Claims
- 1. A thermosetting resin composition which comprises:
- (a) a bismaleimide derivative having the formula (III): ##STR9## (b) a diamine derivative having the formula (IV): ##STR10## wherein R.sup.3 is a divalent radical represented by ##STR11## wherein X is a bond, or X is a radical selected from the group consisting of a hexafluorinated isopropylidene radical, a carbonyl radical, a thio radical, and a sulfinyl radical.
- 2. The thermosetting resin composition of claim 1 wherein the bismaleimide derivative (III) and the diamine derivative (IV) are used in a proportion ranging from 10:1 to 1:1.2 molar ratio.
- 3. A thermosetting resin prepolymer obtained by conducting heat-treatment of the thermosetting resin composition at a temperature of 70.degree. to 220.degree. C. in the presence or absence of a solvent, said thermosetting resin composition comprising:
- (a) a bismaleimide derivative having the formula (III): ##STR12## and (b) a diamine derivative having the formula (IV): ##STR13## wherein R.sup.3 is a divalent radical represented by ##STR14## wherein X is a bond, or X is a radical selected from the group consisting of a hexafluorinated isopropylidene radical, a carbonyl radical, a thio radical, and a sulfinyl radical.
Priority Claims (3)
Number |
Date |
Country |
Kind |
61-164668 |
Jul 1986 |
JPX |
|
61-190563 |
Aug 1986 |
JPX |
|
61-190564 |
Aug 1986 |
JPX |
|
Parent Case Info
This application is a continuation of U.S. application Ser. No. 171,161, filed July 8, 1987 now U.S. Pat. No. 4,831,102.
US Referenced Citations (10)
Foreign Referenced Citations (4)
Number |
Date |
Country |
0192480 |
Aug 1986 |
EPX |
0233435 |
Aug 1987 |
EPX |
59560 |
Mar 1985 |
JPX |
61-221158 |
Oct 1986 |
JPX |
Divisions (1)
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Number |
Date |
Country |
Parent |
71161 |
Jul 1987 |
|