The present invention relates to thermowells of the type used in temperature sensors used in industrial process control and monitoring systems. More specifically, the present invention relates to measurement of vibration of such thermowells.
Industrial process sensors and transmitters are used to sense various characteristics of fluid flowing through a conduit, or contained within a vessel. The transmitters sense process parameters such as differential pressure, line pressure, temperature, and pH.
Temperature sensors such as thermocouples, resistance temperature detectors or infrared sensors in process applications are usually protected by a metal or ceramic sheath known as a thermowell. The sensor electrical leads are isolated from each other and from the metal sheath and metal parts through some kind of isolating material. The assembly consisting of the sensor, sensor electrical leads, sensor sheath, isolating material and installation fittings is called a sensor assembly.
The sensor leads are connected to an electronic circuit that reads the sensor signal and convert it to a temperature reading. This electronic circuit can reside in an input electronic card of a control, monitoring or safety system or in a transmitter. Transmitters are usually installed relatively close to the temperature sensor.
The transmitter converts the sensor signal to a temperature measurement value and transmits the signal to a remote recipient such as a control, monitoring and/or safety system. The temperature value can be transmitted through different types of signals and media. It can be converted into an analog standard value such as 4 to 20 mA or through digital protocols such as HART®, Fieldbus, Profibus, DeviceNet, Modbus, Ethernet, etc. The transmitting media can be via wires, fiber optic, infrared or RF.
Temperature sensors used in industrial processes are typically fitted with a primary seal such as a thermowell. Thermowells are used to provide an additional protection to the temperature sensor. Thermowells are closed-end metal or ceramic tubes that protect temperature sensors from process pressure, erosion and corrosion. They also allow for the installing and removal of sensors without having to shut down the process. As the thermowell is a generally elongated tube, it is possible for the thermowell to vibrate and even break or crack. This may allow the release of process fluid and require an unscheduled shut down of an industrial process in order to repair any damage.
A thermowell system for measuring a process temperature includes an elongate thermowell having a proximal end and a distal end configured to extend into a process fluid. An infrared sensor is configured to detect infrared radiation from the distal end of the thermowell and responsively provide a sensor output. Vibration detector circuitry is coupled to the infrared sensor and configured to detect vibration of the thermowell as a function of oscillations in the sensor output.
This Summary and the Abstract are provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. The Summary and the Abstract are not intended to identify key features or essential features of the claimed subject matter, nor are they intended to be used as an aid in determining the scope of the claimed subject matter.
A thermowell system for measuring a process temperature is provided which includes a thermowell which is configured to extend into a process fluid. An infrared sensor is configured to detect infrared radiation from the distal end of the thermowell. The detected radiation can be correlated with vibration or other movement of the thermowell.
Sensor/transmitter 12 transmits temperature information to control room equipment 14 in either analog or digital form. For example, sensor/transmitter 12 may transmit an analog signal representative of measured temperature by controlling the loop current flowing in loop 16 between 4 and 20 milliamps. In addition, sensor/transmitter 12 may transmit to control room 14 digital information related to measured temperature, to a measured secondary process parameter, or to diagnostic data. Transmission of digital information over loop 16 can, for example, be transmitted using the Highway Addressable Remote Transducer (HART®) protocol. Alternatively, temperature information, as well as secondary measurements and diagnostic information can be transmitted by sensor/transmitter 12 to control room 14 using an all digital protocol such as Foundation Fieldbus, Profibus, Modbus, etc. Alternatively, the loop may employ various wireless techniques. Alternatively, the loop may employ various wireless techniques, Wireless HART® communication protocol in accordance with the IEC 62591. Standard Ethernet, fiberoptic connection, or other communication channels may also be used. Sensor/transmitter 12 provides a thermowell system for measuring a process temperature.
As process fluid carried in pipe 18 moves past the thermowell 20, vortexes can be created. There are a number of factors that dictate how the vortexes will be generated and how they will affect the thermowell 20. If the vortexes are sufficiently large, the thermowell 20 will move in the vortexes and may approach a resonant frequency. This may cause permanent damage to the thermowell 20. The damage may be in the form of cracks or permanent bending, as well as completely breaking away from flange 22. It would be desirable to measure this vibration. However, a number of factors must be considered. Any vibration detector should be monitored and the information digitized or otherwise made available to measurement electronics. For example, vibration information may be monitored by a micro controller. In one example configuration, a primary measurement analog to digital converter which is used for measuring temperature is also used for monitoring vibrations. Further, in some configurations, the transmitter electronics is mounted remotely from the thermowell. Additionally, the vibration experienced by the thermowell may not be in a single direction and thus requires a multi axis vibration detector.
As illustrated in
In accordance with Planck's Law, an interior wall of the bore through the thermowell 20 will emit radiation which is related to the temperature of the wall. The infrared sensor 24 is arranged to sense the radiation emitted in accordance with Planck's Law and responsively provide a sensor output. The sensor output can be correlated with the temperature of the thermowell 20 and provide an indirect measurement of the temperature of process fluid carried in process piping 18. The infrared sensor 24 may include optics configured to focus the sensor along the bore of the thermowell 20.
A temperature gradient ΔT is illustrated in
Vortexes in the process fluid will cause an oscillating movement of the distal end of the thermowell 20 with respect to the proximal end. With increasing movement, the infrared sensor 24 will be focused to a greater extent on the bore wall in its focal point creating a larger error in the temperature measurement which will maximize at the resonant frequency of the thermowell. As the thermowell 20 oscillates, the sensor 24 will periodically receive the infrared radiation from the distal tip of the thermowell. This oscillation is illustrated in
The peaks and valleys in the output of the infrared sensor 24 illustrated in
During operation, the microprocessor 52 receives a digitized signal representative of the output from sensor 24. Microprocessor 52 can correlate this digitized signal with the temperature of the process fluid in accordance with Planck's Law. Temperature related information is transmitted on the process control loop 16 using I/O circuitry 56.
As discussed above, the microprocessor 52 is also capable of performing vibration diagnostics based upon variations in the output from sensor 24. For example, variations such as those illustrated in
As noted above, the same infrared sensor 24 can be used to perform both diagnostics as well as process variable (such as temperature) measurement. The determinations may be made simultaneously. However, the determinations may also be made alternatively during time slices or as desired. The diagnostic determination can be implemented using a software solution in accordance with programming instructions stored in memory 54. The thermowell may be optionally configured to enhance its sensitivity to vibrations. This may be through physical confirmations such as a portion of thermowell 20 having a thinned wall, or may be selected based upon particular materials. The vibrations sensed by the thermowell 20 may be due to process fluid flowing past the thermowell as well as due to vibrations received from other components in the process such as nearby process components. For example, a motor may induce vibrations in the process to which the probe 20 responds. As used herein, the term “vibration detection circuitry” includes implementations implemented based upon software stored in a memory, such as memory 54, of the device and implemented using an appropriate controller such as microprocessor 52. However, vibration detection circuitry may be implemented using any appropriate technique including dedicated analog components, dedicated digital components, shared components, or their combinations. The vibration detection circuitry may also be the same circuitry used to measure a process temperature based upon the output from the infrared sensor 24. Filters, including digital or analog filters, may be used to enhance the sensitivity of the vibration detection circuit to vibrations of a certain frequency, as well as reduce the sensitivity to certain frequencies as desired.
Although the present invention has been described with reference to preferred embodiments, workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the invention. In addition to providing diagnostics related to the condition to the thermowell, the sensed vibration information can also be used to obtain information regarding operation of the process. For example, detection of vibrations can be used to determine that the process fluid carried in process piping 18 has begun moving. The vibration information may also be correlated with the flow rate of the process fluid. A sudden large vibration of a very short duration may indicate that something in the process fluid has impacted the thermowell 20. Any appropriate infrared sensor may be used. However, the sensor should preferably be able to detect vibration of the thermowell in a desired range, for example between 100 Hz and 1 kHz. A typical infrared sensor has a response time on the order of nanoseconds which is sufficiently fast to detect such vibrations. The infrared sensor may be spaced apart from the thermowell using a fiber optic bundle or other focusing technique. Although an infrared sensor is specifically described, such a configuration also includes an infrared imaging detector. In the example configuration shown in
Number | Name | Date | Kind |
---|---|---|---|
4137768 | Tushie et al. | Feb 1979 | A |
4324945 | Sivyer | Apr 1982 | A |
4510343 | Sivyer | Apr 1985 | A |
4737038 | Dostoornian | Apr 1988 | A |
4743752 | Olsen | May 1988 | A |
4778538 | Lyman | Oct 1988 | A |
4831252 | Ihnat | May 1989 | A |
4850717 | Clark | Jul 1989 | A |
4859076 | Twerdochlib | Aug 1989 | A |
4925638 | Chakravarti | May 1990 | A |
4958938 | Schwartz | Sep 1990 | A |
5147137 | Thiesen | Sep 1992 | A |
5302027 | Park | Apr 1994 | A |
5348395 | Corr, II et al. | Sep 1994 | A |
5399018 | Hollander et al. | Mar 1995 | A |
5590240 | Rezabek | Dec 1996 | A |
5632556 | Sivyer | May 1997 | A |
5858311 | Bachtel | Jan 1999 | A |
6053632 | Leininger | Apr 2000 | A |
6059453 | Kempf et al. | May 2000 | A |
6231230 | Baldock | May 2001 | B1 |
6390673 | Camburn | May 2002 | B1 |
6536950 | Green et al. | Jul 2003 | B1 |
6612156 | Hakimuddin | Sep 2003 | B1 |
7290450 | Brown | Nov 2007 | B2 |
7465086 | Foreman, Jr. | Dec 2008 | B1 |
7579947 | Peluso | Aug 2009 | B2 |
7644633 | Schmidt | Jan 2010 | B2 |
9188488 | Engelstad et al. | Nov 2015 | B2 |
20020085617 | Gul | Jul 2002 | A1 |
20030028345 | Watkins | Feb 2003 | A1 |
20040009075 | Meza et al. | Jan 2004 | A1 |
20050208908 | Karschnia | Sep 2005 | A1 |
20060017821 | Garvey, III | Jan 2006 | A1 |
20060204367 | Meza et al. | Sep 2006 | A1 |
20060278827 | Sierra | Dec 2006 | A1 |
20070085670 | Peluso | Apr 2007 | A1 |
20090199634 | Tonner | Aug 2009 | A1 |
20090211368 | Garnett | Aug 2009 | A1 |
20100135862 | Yoon | Jun 2010 | A1 |
20100316086 | Engelstad | Dec 2010 | A1 |
20110054822 | Bauschke et al. | Mar 2011 | A1 |
20110150033 | Egan | Jun 2011 | A1 |
20110150034 | Breimon | Jun 2011 | A1 |
20110301867 | Davis | Dec 2011 | A1 |
20120300808 | Martensson | Nov 2012 | A1 |
20130107908 | Lukach | May 2013 | A1 |
20130191556 | Holmstadt | Jul 2013 | A1 |
20130283928 | Wiklund | Oct 2013 | A1 |
20140036960 | Middleton | Feb 2014 | A1 |
20140269820 | Perrault et al. | Sep 2014 | A1 |
20150177072 | Murphy | Jun 2015 | A1 |
20150181313 | Murphy | Jun 2015 | A1 |
20150330840 | Lukach | Nov 2015 | A1 |
20160178441 | Rud | Jun 2016 | A1 |
Number | Date | Country |
---|---|---|
101881652 | Nov 2010 | CN |
104048747 | Sep 2014 | CN |
103 45 299 | Jul 2005 | DE |
10345299 | Jul 2005 | DE |
0 438 880 | Jul 1991 | EP |
1 835 270 | Sep 2007 | EP |
2000-46653 | Feb 2000 | JP |
WO 2014158423 | Oct 2014 | WO |
Entry |
---|
First Chinese Office Action for Chinese Patent Application No. 201520363314.8, dated Sep. 29, 2015, 4 pages. |
Office Action from U.S. Appl. No. 14/755,126, dated Jan. 19, 2016. |
Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority from PCT/US2015/065744, dated Mar. 18, 2016. |
Office Action from United States Patent Office, U.S. Appl. No. 14/755,126, dated Dec. 13, 2016, 19 pages. |
Office Action from U.S. Appl. No. 14/755,126, dated Jul. 26, 2016. |
Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority from PCT/US2016/036140, dated Oct. 5, 2016. |
Office Action from U.S. Appl. No. 14/755,126, dated Jun. 20, 2017. |
Communication from European Patent Application No. 15823256.1, dated Jul. 28, 2017. |
Office Action from Chinese Patent Application No. 20150289909.8, dated Oct. 30, 2017. |
Number | Date | Country | |
---|---|---|---|
20160178441 A1 | Jun 2016 | US |