Thin-film device

Abstract

A thin-film device incorporates: a substrate; an insulating layer, a lower conductor layer, a dielectric film, an insulating layer, an upper conductor layer and a protection film that are stacked in this order on the substrate; and four terminal electrodes. The four terminal electrodes touch part of end faces of the upper conductor layer, and part of the top surface of the upper conductor layer contiguous to the end faces. The protection film has four concave portions, each of which has a shape that is recessed inward from the edge of the protection film except portions thereof corresponding to these concave portions. The four concave portions expose respective portions of the top surface of the upper conductor layer that touch the four terminal electrodes. The four concave portions accommodate respective portions of the four terminal electrodes.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of a thin-film device of a first embodiment of the invention.

FIG. 2 is a top view of upper conductor layers that the thin-film device of the first embodiment of the invention includes.

FIG. 3 is a top view of lower conductor layers that the thin-film device of the first embodiment of the invention includes.

FIG. 4 is a cross-sectional view of the thin-film device taken along line 4-4 of FIG. 1 to FIG. 3.

FIG. 5 is a cross-sectional view of the thin-film device taken along line 5-5 of FIG. 1 to FIG. 3.

FIG. 6 is a schematic diagram illustrating the circuit configuration of the thin-film device of the first embodiment of the invention.

FIG. 7 is a cross-sectional view illustrating a step of a method of manufacturing the thin-film device of the first embodiment of the invention.

FIG. 8 is a cross-sectional view illustrating a step that follows the step of FIG. 7.

FIG. 9 is a cross-sectional view illustrating a step that follows the step of FIG. 8.

FIG. 10 is a cross-sectional view illustrating a step that follows the step of FIG. 9.

FIG. 11 is a cross-sectional view illustrating a step that follows the step of FIG. 10.

FIG. 12 is a cross-sectional view illustrating a step that follows the step of FIG. 11.

FIG. 13 is a cross-sectional view illustrating a step that follows the step of FIG. 12.

FIG. 14 is a top view of a thin-film device of a first modification example of the first embodiment of the invention.

FIG. 15 is a cross-sectional view of a thin-film device of a second modification example of the first embodiment of the invention.

FIG. 16 is a cross-sectional view of a thin-film device of a third modification example of the first embodiment of the invention.

FIG. 17 is a cross-sectional view of a thin-film device of a fourth modification example of the first embodiment of the invention.

FIG. 18 is a cross-sectional view of a thin-film device of a fifth modification example of the first embodiment of the invention.

FIG. 19 is a cross-sectional view of a thin-film device of a sixth modification example of the first embodiment of the invention.

FIG. 20 is a cross-sectional view of a thin-film device of a seventh modification example of the first embodiment of the invention.

FIG. 21 is a cross-sectional view of a thin-film device of a second embodiment of the invention.

FIG. 22 is a cross-sectional view illustrating a step of a method of manufacturing the thin-film device of the second embodiment of the invention.

FIG. 23 is a cross-sectional view illustrating a step that follows the step of FIG. 22.

FIG. 24 is a cross-sectional view of a thin-film device of a first modification example of the second embodiment of the invention.

FIG. 25 is a cross-sectional view of a thin-film device of a second modification example of the second embodiment of the invention.

FIG. 26 is a cross-sectional view of a thin-film device of a third modification example of the second embodiment of the invention.

FIG. 27 is a cross-sectional view of a thin-film device of a fourth modification example of the second embodiment of the invention.

FIG. 28 is a cross-sectional view of a thin-film device of a third embodiment of the invention.

FIG. 29 is a cross-sectional view illustrating a step of a method of manufacturing the thin-film device of the third embodiment of the invention.

FIG. 30 is a cross-sectional view illustrating a step that follows the step of FIG. 29.

FIG. 31 is a cross-sectional view of a thin-film device of a first modification example of the third embodiment of the invention.

FIG. 32 is a cross-sectional view of a thin-film device of a second modification example of the third embodiment of the invention.

FIG. 33 is a cross-sectional view of a thin-film device of a third modification example of the third embodiment of the invention.

FIG. 34 is a cross-sectional view of a thin-film device of a fourth modification example of the third embodiment of the invention.

FIG. 35 is a cross-sectional view of a thin-film device of a fifth modification example of the third embodiment of the invention.

Claims

1. A thin-film device comprising: a substrate having a first surface and a second surface that face toward opposite directions, and a side surface coupling the first and second surfaces to each other;a protection film disposed such that one of surfaces thereof faces toward the first surface of the substrate;a conductor layer disposed between the first surface of the substrate and the protection film, the conductor layer having a bottom surface facing toward the first surface of the substrate, a top surface opposite to the bottom surface, and an end face coupling the bottom and top surfaces to each other; anda terminal electrode connected to the conductor layer, wherein:the terminal electrode touches part of the end face of the conductor layer and part of the top surface of the conductor layer contiguous to the end face; andthe protection film has a concave portion having a shape that is recessed inward from an edge of the protection film except a portion thereof corresponding to the concave portion, the concave portion exposing the part of the top surface of the conductor layer that touches the terminal electrode, and accommodating part of the terminal electrode.

2. The thin-film device according to claim 1, wherein, when the protection film is seen from above, the edge of the protection film except the portion thereof corresponding to the concave portion is located at a position that coincides with an edge of a surface located directly below the protection film.

3. The thin-film device according to claim 1, wherein, when the protection film is seen from above, the edge of the protection film except the portion thereof corresponding to the concave portion is located on an inner side relative to an edge of a surface located directly below the protection film.

4. The thin-film device according to claim 1, wherein the terminal electrode further touches part of the side surface of the substrate.

5. The thin-film device according to claim 1, wherein the terminal electrode further touches part of the first surface of the substrate.

6. The thin-film device according to claim 1, wherein the terminal electrode further touches part of the first surface of the substrate and part of the side surface of the substrate.

7. The thin-film device according to claim 1, further comprising an insulating layer disposed between the first surface of the substrate and the conductor layer, the insulating layer having a bottom surface facing toward the first surface of the substrate, a top surface opposite to the bottom surface, and an end face coupling the bottom and top surfaces to each other.

8. The thin-film device according to claim 7, wherein the terminal electrode further touches part of the end face of the insulating layer.

9. The thin-film device according to claim 7, wherein the terminal electrode further touches part of the top surface of the insulating layer.

10. The thin-film device according to claim 7, wherein the terminal electrode further touches part of the top surface of the insulating layer and part of the end face of the insulating layer.

11. The thin-film device according to claim 7, wherein the terminal electrode further touches part of the end face of the insulating layer and part of the side surface of the substrate.

12. The thin-film device according to claim 7, wherein the terminal electrode further touches part of the end face of the insulating layer and part of the first surface of the substrate.

13. The thin-film device according to claim 7, wherein the terminal electrode further touches part of the end face of the insulating layer, part of the first surface of the substrate, and part of the side surface of the substrate.

14. The thin-film device according to claim 7, wherein the terminal electrode further touches part of the top surface of the insulating layer, part of the end face of the insulating layer, and part of the side surface of the substrate.

15. The thin-film device according to claim 7, wherein the terminal electrode further touches part of the top surface of the insulating layer, part of the end face of the insulating layer, and part of the first surface of the substrate.

16. The thin-film device according to claim 7, wherein the terminal electrode further touches part of the top surface of the insulating layer, part of the end face of the insulating layer, part of the first surface of the substrate, and part of the side surface of the substrate.