Thin-film device

Abstract

A thin-film device incorporates: a substrate; an insulating layer, a plurality of lower conductor layers, a dielectric film, an insulating layer, a plurality of upper conductor layers and a protection film that are stacked in this order on the substrate; and a plurality of terminal electrodes. One of the terminal electrodes is connected to one of the lower conductor layers. The one of the lower conductor layers has a protruding portion that protrudes to extend more outward in a lateral direction than a side surface of the insulating layer. The one of the terminal electrodes has a concave portion that accommodates and touches at least part of the protruding portion, and touches the side surface of the insulating layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of a thin-film device of a first embodiment of the invention.

FIG. 2 is a top view of upper conductor layers that the thin-film device of the first embodiment of the invention includes.

FIG. 3 is a top view of lower conductor layers that the thin-film device of the first embodiment of the invention includes.

FIG. 4 is a cross-sectional view of the thin-film device taken along line 4-4 of FIG. 1 to FIG. 3.

FIG. 5 is a cross-sectional view of the thin-film device taken along line 5-5 of FIG. 1 to FIG. 3.

FIG. 6 is a schematic diagram illustrating the circuit configuration of the thin-film device of the first embodiment of the invention.

FIG. 7 is a cross-sectional view illustrating a step of a method of manufacturing the thin-film device of the first embodiment of the invention.

FIG. 8 is a cross-sectional view illustrating a step that follows the step of FIG. 7.

FIG. 9 is a cross-sectional view illustrating a step that follows the step of FIG. 8.

FIG. 10 is a cross-sectional view illustrating a step that follows the step of FIG. 9.

FIG. 11 is a cross-sectional view illustrating a step that follows the step of FIG. 10.

FIG. 12 is a cross-sectional view illustrating a step that follows the step of FIG. 11.

FIG. 13 is a cross-sectional view illustrating a step that follows the step of FIG. 12.

FIG. 14 is a cross-sectional view of a thin-film device of a second embodiment of the invention.

FIG. 15 is a cross-sectional view illustrating a step of a method of manufacturing the thin-film device of the second embodiment of the invention.

FIG. 16 is a cross-sectional view illustrating a step that follows the step of FIG. 15.

Claims

1. A thin-film device comprising: an underlying layer having a bottom surface and a top surface that face toward opposite directions, and a side surface that couple the bottom surface and the top surface to each other;a conductor layer disposed on the top surface of the underlying layer; anda terminal electrode connected to the conductor layer, wherein:the conductor layer has a protruding portion that protrudes to extend more outward in a lateral direction than the side surface of the underlying layer; andthe terminal electrode has a concave portion that accommodates and touches at least part of the protruding portion, and the terminal electrode touches the side surface of the underlying layer.

2. The thin-film device according to claim 1, wherein the underlying layer is made of an insulating material.

3. The thin-film device according to claim 1, further comprising a coating layer having a bottom surface and a top surface that face toward opposite directions, and a side surface that couple the bottom surface and the top surface to each other, wherein: at least a portion of the conductor layer other than the protruding portion is disposed between the top surface of the underlying layer and the bottom surface of the coating layer;the protruding portion protrudes to extend more outward in a lateral direction than the side surface of the underlying layer and the side surface of the coating layer; andthe terminal electrode further touches the side surface of the coating layer.

4. The thin-film device according to claim 3, wherein the coating layer is made of an insulating material.

5. The thin-film device according to claim 1, wherein, when the protruding portion is sectioned with an imaginary plane intersecting the top surface of the underlying layer at a right angle, at least part of a contour of a cross section of the protruding section forms a convex-shaped curved line.

6. The thin-film device according to claim 1, wherein a maximum thickness of the protruding portion is greater than a thickness of any portion of the conductor layer other than the protruding portion.