1. Field of Invention
The present disclosure relates to a photoelectric conversion apparatus. More particularly, the present disclosure relates to a thin film photoelectric conversion module and a fabrication method of the same.
2. Description of Related Art
A solar cell is a device that converts the energy of sunlight directly into electricity by the photovoltaic effect. In general, a thin film photoelectric conversion module includes a plurality of thin film photoelectric conversion cells connected to each other in series.
When a stain, such as a leaf or a bird dropping, is attached to the light-receiving surface of the thin film photoelectric conversion module, the light to the particular cell is partially or entirely intercepted by the stain so as to decrease the photoelectric motive force. The decreased photoelectric motive force acts as a diode connected in series in the reverse direction to the direction of the power generation. As a result, the light-intercepted cell exhibits a very high resistance, leading to the marked reduction in the output of the entire module. Further, the electrical current doesn't flow uniformly through the photoelectric conversion cells so as to bring about a local overheating called a hot spot phenomenon.
Accordingly, what is needed is an improved thin film photoelectric conversion module and its fabrication method that is able to reduce the effect of the hot spot phenomenon. The present disclosure addresses such a need.
It is therefore an objective of the present invention to provide an improved thin film photoelectric conversion module and its fabrication method that is able to reduce the effect of the hot spot phenomenon.
In accordance with the foregoing and other objectives of the present invention, a thin film photoelectric conversion module includes a substrate, a first electrode layer, at least one photoelectric conversion layer and a second electrode layer. The first electrode layer is deposited on the substrate, wherein the first electrode layer includes a plurality of first electrode rows extending along a current flow direction. Any immediately-adjacent two of the first electrode rows have a row of unoverlapped through holes formed therebetween. The photoelectric conversion layer is deposited on the first electrode layer. The second electrode layer is deposited on the photoelectric conversion layer.
In accordance with the foregoing and other objectives of the present invention, another thin film photoelectric conversion module includes a substrate, a first electrode layer, at least one photoelectric conversion layer and a second electrode layer. The first electrode layer is deposited on the substrate, wherein the first electrode layer includes a plurality of first electrode rows extending along a current flow direction. Any immediately-adjacent two of the first electrode rows have a row of unoverlapped through holes formed therebetween. A plurality of first grooves divide the first electrode layer into a plurality of first electrode columns along a direction which crosses the current flow direction. The photoelectric conversion layer is deposited on the first electrode layer. The photoelectric conversion layer includes a plurality of second grooves each formed next to one of the first grooves. The second electrode layer is deposited on the photoelectric conversion layer. The second electrode layer includes a plurality of third grooves each formed next to one of the second grooves.
According to an embodiment disclosed herein, the row of unoverlapped through holes have an average diameter or width ranging from about 30 μm to about 100 μm.
According to another embodiment disclosed herein, any immediately-adjacent two of the row of unoverlapped through holes have an interval therebetween ranging from about 1 percent to about 200 percent of the average diameter or width.
According to another embodiment disclosed herein, any immediately-adjacent two of the row of unoverlapped through holes have a resistance therebetween ranging from about 100 ohm to about 1 mega-ohm.
According to another embodiment disclosed herein, the row of unoverlapped through holes further extend through the photoelectric conversion layer and the second electrode layer.
According to another embodiment disclosed herein, each of the unoverlapped through holes is of a square, rectangular, circular or oval shape.
According to another embodiment disclosed herein, the substrate is a glass substrate, which includes a plurality of opaque materials each deposited to be aligned with each of the unoverlapped through holes.
According to another embodiment disclosed herein, the plurality of opaque materials are deposited on the same side of the glass substrate as the first electrode layer is deposited on.
According to another embodiment disclosed herein, the plurality of opaque materials are deposited on a side of the glass substrate, which is opposite to a side the first electrode layer is deposited on.
In accordance with the foregoing and other objectives of the present invention, a method for fabricating a thin film photoelectric conversion module includes the following steps. A first electrode layer is formed on a substrate. Multiple rows of unoverlapped through holes are formed to divide the first electrode layer into a plurality of first electrode rows extending along a current flow direction. At least one photoelectric conversion layer is formed on the first electrode layer. A second electrode layer is formed on the photoelectric conversion layer.
According to an embodiment disclosed herein, the unoverlapped through holes is formed to have an average diameter ranging from about 30 μm to about 100 μm.
According to another embodiment disclosed herein, the unoverlapped through holes is formed to have an interval therebetween ranging from about 1 percent to about 200 percent of the average diameter.
According to another embodiment disclosed herein, any immediately-adjacent two of the unoverlapped through holes is formed to have a resistance therebetween ranging from about 100 ohm to about 1 mega-ohm.
According to another embodiment disclosed herein, the unoverlapped through holes is formed to extend through the photoelectric conversion layer and the second electrode layer.
According to another embodiment disclosed herein, the unoverlapped through holes is formed by laser scribing, chemical etching, mechanical drilling or any combination thereof.
It is to be understood that both the foregoing general description and the following detailed description are by examples, and are intended to provide further explanation of the invention as claimed.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings,
Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
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The thin film photoelectric conversion module 10 includes a substrate 101, a first electrode layer 102, a photoelectric conversion layer 104 and a second electrode layer 106 sequentially. The first electrode layer 102 includes a plurality of first electrode rows 110. A row of unoverlapped through holes 102a is formed between any immediately-adjacent two of the first electrode rows 110 to serve as a border therebetween. The first electrode rows 100 are substantially physically parallel to each other along a current flow direction, i.e. a horizontal direction 11 illustrated in
The row of unoverlapped through holes 102a are formed substantially along a straight line as if a resistance wall is formed between any immediately-adjacent two of the first electrode rows 110. Due to the resistance wall between any immediately-adjacent two of the first electrode rows 110, the electrical currents would not or hardly cross the resistance wall. Therefore, the electrical currents in the thin film photoelectric conversion module 10 can distribute along different rows, thereby avoiding the chances of overheat condition caused by larger electrical currents.
In this embodiment, the first electrode layer 102 and the second electrode layer 106 can be a transparent conducting oxide layer or a metal layer according to designs. The substrate 101 next to the first electrode layer 102 can be made of a transparent material, such as glass.
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In this embodiment, the multiple rows of unoverlapped through holes (102a or 102b) are formed by laser scribing, e.g. using infrared or ultraviolet laser to blast from the substrate 101. In an alternate embodiment, the multiple rows of unoverlapped through holes (102a or 102b) can be formed by chemical etching or mechanical drilling.
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The first electrode layer 203 further includes multiple rows of unoverlapped through holes 203a, wherein each row traverses the plurality of first grooves 202 to further divide the first electrode layer 203 into a plurality of first electrode rows, as illustrated in
The photoelectric conversion layer 205 includes a plurality of second grooves 204 each formed substantially parallel and next to one of the first grooves 202. The second electrode layer 207 and the photoelectric conversion layer 205 includes a plurality of third grooves 206 penetrating through therein, wherein each of the third grooves 206 is formed substantially parallel and next to one of the second grooves 204. Besides, each second groove 204 is located between each first groove 202 and each third groove 206.
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In step 401, a first electrode layer 102 is formed on a substrate 101. Then in step 402, multiple rows of unoverlapped through holes 102a are formed to divide the first electrode layer 102 into a plurality of first electrode rows 110 extending along a current flow direction 11. In step 403, a photoelectric conversion layer 104 is deposited on the first electrode layer 102. A second electrode layer 106 is further deposited on the photoelectric conversion layer 104 in step 404.
In an alternate embodiment (refer to
In this embodiment, the multiple rows of unoverlapped through holes (102a or 102b) are formed by laser scribing, e.g. using infrared (e.g. 1064 nm) or ultraviolet (e.g. 326 nm) laser to blast from the substrate 101. In an alternate embodiment, the multiple rows of unoverlapped through holes (102a or 102b) can be formed by chemical etching or mechanical drilling.
It's noticed that all the processes to form unoverlapped through holes or (first, second or third) grooves described above can be implemented by, but not limited thereto, laser-scribing processes, chemical etching processes or mechanical drilling. Further, the above-mentioned steps are not recited in the sequence in which the steps are performed. That is, unless the sequence of the steps is expressly indicated, the sequence of the steps is interchangeable, and all or part of the steps may be simultaneously, partially simultaneously, or sequentially performed.
According to the above-discussed embodiments, the thin film photoelectric conversion module and its manufacturing process are able to reduce the effect of the hot spot phenomenon by forming multiple rows of unoverlapped through holes at least on the electrode layer to further divide the electrode layer into multiple electrode rows.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.