The present invention relates to a thin film silicon solar cell and a manufacturing method thereof, in particular to the thin film silicon solar cell having a glass substrate, and the manufacturing method thereof
Due to the world's energy shortage, governments and private sectors pay increasingly more attention to the application of solar cells, because solar energy is an everlasting resource and the power generation process causes no environmental pollution issues. Therefore, solar energy has become a popular alternative energy source and led to a blooming industry of solar cells. Among a variety of solar cell technologies, thin film solar cells have the advantages of using less silicon material, providing a high total power generation, and integrating with construction materials easily, so that the thin film solar cells attract much attention.
At present, most thin film silicon solar cells with a glass substrate adopts a superstrate structure. In the superstrate structure, a transparent conductive oxide (TCO) layer is coated onto a glass substrate, and then three P-I-N silicon thin film layers (also known as light absorbing layers) are coated sequentially, and finally a metal layer is coated, so that an incident light can be passed from the glass substrate into the solar cell. Since the bottom layer of the thin film silicon solar cell with the superstrate structure is made of metal, the metal reflective layer will reflect a major fraction of the incident light back to the absorbing layer for a reuse of the light energy if the incident light has not been absorbed completely by the light absorbing layer. However, the metal layer generally has a poor surface adhesion with silicon, and if the metal layer is deposited directly on the silicon, defects occurred at the junction between the metal layer and silicon will give rise to a light absorption, and the light will be unable to reflect back to the absorbing layer effectively. In general, a TCO layer is usually formed between the metal layer and silicon to improve the reflectivity of the light and the stability of the components.
Therefore, the thin film silicon solar cell with the superstrate structure requires upper and lower TCO layers, wherein the TCO layer proximate to the incident light is called a front TCO layer, and the other TCO layer is called a back TCO layer. For a flat surface, the incident light can enter and exit the thin film silicon solar cell directly and solar energy cannot be used effectively. If the TCO layer has an irregular texture, the light scattering level is enhanced to increase the chance of absorbing the light. However, if the back TCO layer of the thin film silicon solar cell with the superstrate structure has a texture surface, it is necessary to submerge the whole thin film silicon solar cell into an acid solution. Since the environmental control of the process is not easy, the process may scrap the whole thin film silicon solar cell.
Based on the aforementioned problem, manufactures urgently require a thin film silicon solar cell and a manufacturing method of the thin film solar cell capable of reflecting an incident light from a metal layer to enhance the power generation efficiency of the thin film solar cell.
The present invention provides a thin film silicon solar cell, comprising a glass substrate, a first electrode layer, a light absorbing layer, a second electrode layer, and a metal electrode layer sequentially stacked on top of one another, wherein the second electrode layer has a texture surface and a plurality of concavities formed on the texture surface, and each concavity has a width falling within a range of 100 nm-1600 nm and a depth less than 800 nm.
Therefore, it is a primary objective of the present invention to provide a thin film silicon solar cell, wherein the second electrode layer is etched to form a texture surface, and the texture surface of the second electrode layer is provided to increase the number of reflection paths of the incident light in order to improve the chance of absorbing the incident light and increase the short-circuit current density.
Another objective of the present invention is to provide a thin film silicon solar cell, wherein the second electrode layer is etched to form a texture surface, and the texture surface can reflect an incident light of a greater wavelength to achieve the effect of improving the power generation efficiency.
The present invention further provides a manufacturing method of a thin film silicon solar cell, comprising the steps of: providing a glass substrate; forming a first electrode layer on the glass substrate; forming a light absorbing layer on the first electrode layer; forming a second electrode layer on the light absorbing layer; etching the second electrode layer to form a texture surface on the second electrode layer, and the texture surface having a plurality of concavities; and forming a metal layer on the texture surface of the second electrode layer.
It is another objective of the present invention to provide a manufacturing method of a thin film silicon solar cell, wherein the second electrode layer is etched to form a texture surface, and the texture surface increases the number of reflection paths to achieve the effects of improving the chance of absorbing the incident light and increasing the short-circuit current density and the power generation efficiency.
Another objective of the present invention is to provide a manufacturing method of a thin film silicon solar cell, wherein the second electrode layer is etched to form a texture surface, and the texture surface can reflect an incident light of a greater wavelength to improve the power generation efficiency.
Since both thin film material and electrode material of the thin film silicon solar cell and the manufacturing method thereof are prior arts, therefore they will not be described here. The technical characteristics and effects of the present invention will become apparent by the detailed description of preferred embodiments and the illustration of related drawings as follows. For simplicity, same numerals are used for representing respective elements respectively in the following preferred embodiments and drawings.
With reference to
With reference to
To compare the difference between the thin film silicon solar cell 10 having the second electrode layer 14 without the texture surface 15 and the thin film silicon solar cell 10 having the second electrode layer 14 with the texture surface 15, the short-circuit current densities (Jsc) of the two are measured in unit of mA/cm2. The average short-circuit current density of the thin film silicon solar cell 10 having the second electrode layer 14 without the texture surface 15 is equal to 19.95 mA/cm2, and the average short-circuit current density of the thin film silicon solar cell 10 having the second electrode layer 14 with the texture surface 15 is equal to 21.30 mA/cm2. Obviously, the results show that the thin film silicon solar cell 10 having the second electrode layer 14 with the texture surface 15 can increase the number of reflection paths of the incident light to improve the chance of absorbing the incident light and increase the short-circuit current density. With reference to
With reference to
(1) providing a glass substrate 11;
(2) forming a first electrode layer 12 on the glass substrate 11;
(3) forming a light absorbing layer 13 on the first electrode layer 12;
(4) forming a second electrode layer 14 on the light absorbing layer 13;
(6) etching the second electrode layer 14 to form a texture surface 15 having a plurality of concavities 151;
(7) forming a metal layer 16 on the irregular texture surface 15 of the second electrode layer 14; and
(8) performing a heat treatment of the second electrode layer 14 to dry the second electrode layer 14.
Wherein, the texture surface 15 as described in the step (5) is formed by etching, and the etching is conducted at room temperature, and less than 1% of a dilute hydrochloric acid solution is used for the etching, and the etching time is less than 5 minutes. Each of the concavities 151 of the texture surface 15 has a width W falling within a range from 100 nm to 1600 nm and a depth D less than 800 nm, and preferably, the concavity 151 has a width falling within a range from 300 nm to 400 nm and a depth falling within a range from 150 nm to 200 nm. The concavities 151 are provided for reflecting an incident light with a greater wavelength such as the incident light with a reflection wavelength falling within a range from 500 nm to 1200 nm to achieve the effect of improving the power generation efficiency.
Number | Date | Country | Kind |
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099123935 | Jul 2010 | TW | national |