Claims
- 1. A method for reinforcing a thin walled honeycomb structure comprising:providing a honeycomb structure having a circumferential wall, partition walls disposed inside the circumferential wall, and cell passages defined by the partition walls; and coating the circumferential wall of the honeycomb structure with a high molecular weight organic reinforcing material in a narrow band, wherein (1) the organic reinforcing material dissipates at a high temperature, thereby protecting the edge portions of the honeycomb structure from damage before the structure is subjected to a baking treatment and (2) the coating of the circumferential wall is performed by wrapping up a circumferential portion of the honeycomb structure wholly or in a part, with a tape formed by molding said high molecular weight organic reinforcing material, within a certain distance from an extremity surface of the honeycomb structure.
- 2. A method for reinforcing a thin-walled honeycomb structure according to claim 1, wherein said tape is a pressure-sensitive adhesive.
- 3. A method for reinforcing a thin-walled honeycomb structure according to claim 1, wherein said high molecular weight organic reinforcing material is a photo-curing photo-reactive material.
- 4. A method for reinforcing a thin-walled honeycomb structure according to claim 2, wherein said high molecular weight organic reinforcing material is a photo-curing photo-reactive material.
- 5. A method for reinforcing a thin-walled honeycomb stricture according to claim 1, wherein at least the circumferential portion of the extremity surface of the honeycomb structure is reinforced with an organic high molecular material after injection molding, or after drying before firing but after injection-molding.
- 6. A method for reinforcing a thin-walled honeycomb structure according to claim 2, wherein at least the circumferential portion of the extremity surface of the honeycomb structure is reinforced with an organic high molecular material after injection molding, or after drying before firing but after injection-molding.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-171108 |
Jun 1998 |
JP |
|
Parent Case Info
This is a continuation of application Ser. No. 09,318,265 filed May 25, 1999, now U.S. Pat. No. 6,352,756, granted Mar. 5, 2002.
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Continuations (1)
|
Number |
Date |
Country |
Parent |
09/318265 |
May 1999 |
US |
Child |
09/953954 |
|
US |