1. Field
The invention relates to three-dimensional integrated automotive radars and methods of manufacturing the same. More particularly, the invention relates to a three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications.
2. Background
Automotive radar systems are currently being provided in many luxury automobiles. Over the past few years, automotive radar systems have been used with intelligent cruise control systems to sense and adjust the automobile's speed depending on traffic conditions. Today, automotive radar systems are being used with active safety systems to monitor the surroundings of an automobile for collision avoidance. Current automotive radar systems are divided into long range (for adaptive cruise control and collision warning) and short range (for pre-crash, collision mitigation, parking aid, blind spot detection, etc.). Two or more separate radar systems, for example, a 24 GHz short range radar system and a 77 GHz long range radar system, which are typically each 15×15×15 centimeters in dimensions, are used to provide long and short range detection. Typically, the front-end (e.g., the antenna, the transmitter and the receiver) of an automotive radar system has an aperture area for the array antenna of 8 centimeters×11 centimeters and a thickness of 3 centimeters.
Prior art automotive radar systems have several drawbacks. For example, since multiple prior art radar systems are separately mounted on a vehicle, significant space is needed and can be wasteful. The cost for packaging, assembling, and mounting each radar system increases due to the additional number of radar systems. In order for each radar system to work properly, the materials placed on top of each radar system needs to be carefully selected so that the materials are RF transparent. The cost for multiple radar systems is further increased because multiple areas of RF transparency are needed on the front, sides, and rear of the vehicle. Thus, increasing the number of radar systems increases the packaging, assembly, mounting, and materials costs.
Therefore, a need exists in the art for a compact three-dimensional integrated array antenna for mm-wave automotive applications fabricated on low cost substrates.
The invention is a multilayer antenna including a first microstrip patch positioned along a first plane, a second microstrip patch positioned along a second plane that is substantially parallel to the first plane, and a ground plane having a slot formed therein. The multilayer antenna also includes a microstrip feeding line for propagating signals through the slot in the ground plane and to the second microstrip patch and a backlobe suppression reflector for receiving some of the signals and reflecting the signals to the slot in the ground plane.
The features, objects, and advantages of the invention will become more apparent from the detailed description set forth below when taken in conjunction with the drawings, wherein:
Apparatus, systems and methods that implement the embodiments of the various features of the invention will now be described with reference to the drawings. The drawings and the associated descriptions are provided to illustrate some embodiments of the invention and not to limit the scope of the invention. Throughout the drawings, reference numbers are re-used to indicate correspondence between referenced elements. For purposes of this disclosure, the term “patch” may be used synonymously with the term “antenna.”
The LCP substrate 120 may be a single 100 um thick LCP layer, as shown, mounted on a 200-400 um thick, FR4 grade printed circuit board (PCB) that contains all the digital signal processing and control signals. The LCP substrate 120 has a planar phased array beam-steering antenna array 105 printed on one side. The signals from each antenna 105 are RF transitioned to the backside with a 3D vertical transition 125. In the backside, the signals converge to the RFIC chip 115.
After the 3D via transition 315, the CPW transmission line 320 converges towards the RFIC chip 310. The 3D automotive radar RF front-end 300 utilizes one or more vias (e.g., the single via fence 325) that are connected to a ground plane to isolate each CPW transmission line 320 from an adjacent or neighboring CPW transmission line 320. The double via fences 335 and 336 (i.e., two vias side-by-side) allows for better isolation between CPW transmission lines 320 and 321. Each double via fence is positioned on one side of the CPW ground plane 330. A double via means there are two vias positioned side-by-side. As the CPW transmission lines 320 and 321 converge towards the RFIC chip 310, the single via fence 325 may be utilized due to size restrictions. The RFIC chip 310 is connected to the CPW transmission lines 320 and 321.
The CPW ground plane 330 is broken to reduce crosstalk between the two CPW transmission lines 320 and 321. The reason for breaking or splitting the common CPW ground plane 330 is because surface waves that are created within the LCP substrate 305 can more easily propagate and parasitically couple to the adjacent CPW transmission lines 320 and 321. Also, the CPW ground plane 330 achieve high isolation between the CPW transmission lines 320 and 321.
The microstrip feeding line 625 propagates signals through the opening 620 in the ground plane 615 to the main radiating patch 610, which is used to transmit the signals. The stacked patch 605 is used to direct the beams of the main radiating patch 610. In one embodiment, the two microstrip patches 605 and 610 are slot fed through the opening 620 in the ground plane 615, as opposed to a direct connection, resulting in a wider or larger bandwidth. The stacked patch 605 is positioned above or on top of the main radiating patch 610 to improve the gain and the bandwidth of the multilayer antenna array 600. In one embodiment, the stacked patch 605 is a planar version of a Yagi-Uda antenna such that the stacked patch 605 acts as a director. In one embodiment, the stacked patch 605 is attached or tacked to the main radiation patch 610.
The backlobe suppression reflector 630 is positioned below the microstrip feeding line 625 and the opening 620 in the ground plane 615. The backlobe suppression reflector 630 is designed as a resonating dipole and acts as a secondary reflector, which couples the energy that is transmitted on the backside of the antenna 600 and retransmits the energy to the front side of the antenna 600. The length of the backlobe suppression reflector 630 is approximately half a wavelength at the resonant frequency. The distance D between the main radiating patch 610 and the backlobe suppression reflector 630 has a value such that the re-transmitted energy is 180 degrees out-of-phase with the backside radiation and can therefore cancel it. The backlobe suppression reflector 630 improves the front-to-back ratio (i.e., how much energy is wasted by being transmitted to the back instead of the front) of the antenna 600 and significantly improves the aperture efficiency. The is, the aperture efficiency is improved by 60% in that the overall aperture area is reduced to a size of 5.5 cm×5.5 cm or 6 cm×6 cm. The reduced aperture area results in reduced materials and packaging and assembly costs. The backlobe suppression reflector 630 is also used to reduce or suppress radiation created by the two microstrip patches 605 and 610.
The microstrip patch 605 is attached to or formed on a top surface 606 of the substrate 607. In one embodiment, the substrate 607 has a thickness of 2 mils. The microstrip patch 610 is attached to or formed on a top surface 608 of the substrate 611. In one embodiment, the substrate 611 has a thickness of 2 mils. An adhesive material 609 is placed between the substrate 607 and the substrate 611. In one embodiment, the adhesive material 609 has a thickness of 2 mils.
The ground plane 615 is attached or formed on a top surface 619 of the substrate 618. In one embodiment, the substrate 618 has a thickness of 4 mils. An adhesive material 614 is placed between the substrate 611 and the substrate 618. In one embodiment, the adhesive material 614 has a thickness of 2 mils. The microstrip feeding line 625 is attached or formed on a bottom surface of the substrate 618.
In one embodiment, the substrate 635 has a thickness of 30 mils. In one embodiment, the substrate 635 has an air cavity 636 of at least 12 mils (see also
Those of ordinary skill would appreciate that the various illustrative logical blocks, modules, and algorithm steps described in connection with the examples disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the disclosed apparatus and methods.
The various illustrative logical blocks, modules, and circuits described in connection with the examples disclosed herein may be implemented or performed with a general purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.
The steps of a method or algorithm described in connection with the examples disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such that the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium may be integral to the processor. The processor and the storage medium may reside in an Application Specific Integrated Circuit (ASIC). The ASIC may reside in a wireless modem. In the alternative, the processor and the storage medium may reside as discrete components in the wireless modem.
The previous description of the disclosed examples is provided to enable any person of ordinary skill in the art to make or use the disclosed methods and apparatus. Various modifications to these examples will be readily apparent to those skilled in the art, and the principles defined herein may be applied to other examples without departing from the spirit or scope of the disclosed method and apparatus. The described embodiments are to be considered in all respects only as illustrative and not restrictive and the scope of the invention is, therefore, indicated by the appended claims rather than by the foregoing description. All changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.
Number | Name | Date | Kind |
---|---|---|---|
3093805 | Osifchin et al. | Jun 1963 | A |
3686596 | Albee | Aug 1972 | A |
4259743 | Kaneko et al. | Mar 1981 | A |
4494083 | Josefsson et al. | Jan 1985 | A |
4513266 | Ishihara | Apr 1985 | A |
4623894 | Lee et al. | Nov 1986 | A |
4731611 | Muller et al. | Mar 1988 | A |
4786913 | Barendregt et al. | Nov 1988 | A |
5008678 | Herman | Apr 1991 | A |
5111210 | Morse | May 1992 | A |
5115245 | Wen et al. | May 1992 | A |
5124713 | Mayes et al. | Jun 1992 | A |
5153600 | Metzler et al. | Oct 1992 | A |
5220335 | Huang | Jun 1993 | A |
5262783 | Philpott et al. | Nov 1993 | A |
5307075 | Huynh | Apr 1994 | A |
5376902 | Bockelman et al. | Dec 1994 | A |
5436453 | Chang et al. | Jul 1995 | A |
5481268 | Higgins | Jan 1996 | A |
5485167 | Wong et al. | Jan 1996 | A |
5495262 | Klebe | Feb 1996 | A |
5512901 | Chen et al. | Apr 1996 | A |
5554865 | Larson | Sep 1996 | A |
5561405 | Hoffmeister et al. | Oct 1996 | A |
5583511 | Hulderman | Dec 1996 | A |
5633615 | Quan | May 1997 | A |
5724042 | Komatsu et al. | Mar 1998 | A |
5767009 | Yoshida et al. | Jun 1998 | A |
5815112 | Sasaki et al. | Sep 1998 | A |
5821625 | Yoshida et al. | Oct 1998 | A |
5867120 | Ishikawa et al. | Feb 1999 | A |
5877726 | Kudoh et al. | Mar 1999 | A |
5886671 | Riemer et al. | Mar 1999 | A |
5909191 | Hirshfield et al. | Jun 1999 | A |
5923290 | Mikami et al. | Jul 1999 | A |
5929802 | Russell et al. | Jul 1999 | A |
5933109 | Tohya et al. | Aug 1999 | A |
5943005 | Tanizaki et al. | Aug 1999 | A |
5952971 | Strickland | Sep 1999 | A |
5977915 | Bergstedt et al. | Nov 1999 | A |
5994766 | Shenoy et al. | Nov 1999 | A |
5999092 | Smith et al. | Dec 1999 | A |
6008750 | Cottle et al. | Dec 1999 | A |
6034641 | Kudoh et al. | Mar 2000 | A |
6037911 | Brankovic et al. | Mar 2000 | A |
6040524 | Kobayashi et al. | Mar 2000 | A |
6043772 | Voigtlaender et al. | Mar 2000 | A |
6091365 | Derneryd et al. | Jul 2000 | A |
6107578 | Hashim | Aug 2000 | A |
6107956 | Russell et al. | Aug 2000 | A |
6114985 | Russell et al. | Sep 2000 | A |
6130640 | Uematsu et al. | Oct 2000 | A |
6137434 | Tohya et al. | Oct 2000 | A |
6191740 | Kates et al. | Feb 2001 | B1 |
6232849 | Flynn et al. | May 2001 | B1 |
6249242 | Sekine et al. | Jun 2001 | B1 |
6278400 | Cassen et al. | Aug 2001 | B1 |
6281843 | Evtioushkine et al. | Aug 2001 | B1 |
6329649 | Jack et al. | Dec 2001 | B1 |
6359588 | Kuntzsch | Mar 2002 | B1 |
6388206 | Dove et al. | May 2002 | B2 |
6452549 | Lo | Sep 2002 | B1 |
6483481 | Sievenpiper et al. | Nov 2002 | B1 |
6483714 | Kabumoto et al. | Nov 2002 | B1 |
6501415 | Viana et al. | Dec 2002 | B1 |
6577269 | Woodington et al. | Jun 2003 | B2 |
6583753 | Reed | Jun 2003 | B1 |
6624786 | Boyle | Sep 2003 | B2 |
6628230 | Mikami et al. | Sep 2003 | B2 |
6639558 | Kellerman et al. | Oct 2003 | B2 |
6642819 | Jain et al. | Nov 2003 | B1 |
6642908 | Pleva et al. | Nov 2003 | B2 |
6657518 | Weller et al. | Dec 2003 | B1 |
6683510 | Padilla | Jan 2004 | B1 |
6686867 | Lissel et al. | Feb 2004 | B1 |
6703965 | Ming et al. | Mar 2004 | B1 |
6717544 | Nagasaku et al. | Apr 2004 | B2 |
6727853 | Sasada et al. | Apr 2004 | B2 |
6756936 | Wu | Jun 2004 | B1 |
6771221 | Rawnick et al. | Aug 2004 | B2 |
6784828 | Delcheccolo et al. | Aug 2004 | B2 |
6794961 | Nagaishi et al. | Sep 2004 | B2 |
6795021 | Ngai et al. | Sep 2004 | B2 |
6806831 | Johansson et al. | Oct 2004 | B2 |
6828556 | Pobanz et al. | Dec 2004 | B2 |
6833806 | Nagasaku et al. | Dec 2004 | B2 |
6842140 | Killen et al. | Jan 2005 | B2 |
6853329 | Shinoda et al. | Feb 2005 | B2 |
6864831 | Woodington et al. | Mar 2005 | B2 |
6873250 | Viana et al. | Mar 2005 | B2 |
6897819 | Henderson et al. | May 2005 | B2 |
6909405 | Kondo | Jun 2005 | B2 |
6930639 | Bauregger et al. | Aug 2005 | B2 |
6933881 | Shinoda et al. | Aug 2005 | B2 |
6940547 | Mine | Sep 2005 | B1 |
6946995 | Choi et al. | Sep 2005 | B2 |
6987307 | White et al. | Jan 2006 | B2 |
6992629 | Kerner et al. | Jan 2006 | B2 |
7009551 | Sapletal | Mar 2006 | B1 |
7015860 | Alsliety | Mar 2006 | B2 |
7019697 | du Toit | Mar 2006 | B2 |
7030712 | Brunette et al. | Apr 2006 | B2 |
7034753 | Elsallal et al. | Apr 2006 | B1 |
7071889 | McKinzie, III et al. | Jul 2006 | B2 |
7081847 | Ziller et al. | Jul 2006 | B2 |
7098842 | Nakazawa et al. | Aug 2006 | B2 |
7102571 | McCarrick | Sep 2006 | B2 |
7106264 | Lee et al. | Sep 2006 | B2 |
7109922 | Shmuel | Sep 2006 | B2 |
7109926 | du Toit | Sep 2006 | B2 |
7154356 | Brunette et al. | Dec 2006 | B2 |
7154432 | Nagasaku et al. | Dec 2006 | B2 |
7170361 | Farnworth | Jan 2007 | B1 |
7177549 | Matsushima et al. | Feb 2007 | B2 |
7187334 | Franson et al. | Mar 2007 | B2 |
7193562 | Shtrom et al. | Mar 2007 | B2 |
7215284 | Collinson | May 2007 | B2 |
7236130 | Voigtlaender | Jun 2007 | B2 |
7239779 | Little | Jul 2007 | B2 |
7268732 | Gotzig et al. | Sep 2007 | B2 |
7292125 | Mansour et al. | Nov 2007 | B2 |
7298234 | Dutta | Nov 2007 | B2 |
7307581 | Sasada | Dec 2007 | B2 |
7310061 | Nagasaku et al. | Dec 2007 | B2 |
7331723 | Yoon et al. | Feb 2008 | B2 |
7336221 | Matsuo et al. | Feb 2008 | B2 |
7355547 | Nakazawa et al. | Apr 2008 | B2 |
7358497 | Boreman et al. | Apr 2008 | B1 |
7362259 | Gottwald | Apr 2008 | B2 |
7388279 | Fjelstad et al. | Jun 2008 | B2 |
7408500 | Shinoda et al. | Aug 2008 | B2 |
7411542 | O'Boyle | Aug 2008 | B2 |
7414569 | De Mersseman | Aug 2008 | B2 |
7436363 | Klein et al. | Oct 2008 | B1 |
7446696 | Kondo et al. | Nov 2008 | B2 |
7456790 | Isono et al. | Nov 2008 | B2 |
7463122 | Kushta et al. | Dec 2008 | B2 |
7489280 | Aminzadeh et al. | Feb 2009 | B2 |
7528780 | Thiam et al. | May 2009 | B2 |
7532153 | Nagasaku et al. | May 2009 | B2 |
7586450 | Muller | Sep 2009 | B2 |
7603097 | Leblanc et al. | Oct 2009 | B2 |
7639173 | Wang et al. | Dec 2009 | B1 |
7733265 | Margomenos et al. | Jun 2010 | B2 |
7830301 | Margomenos | Nov 2010 | B2 |
7881689 | Leblanc et al. | Feb 2011 | B2 |
8022861 | Margomenos | Sep 2011 | B2 |
8384611 | Asakura et al. | Feb 2013 | B2 |
20020047802 | Voipio | Apr 2002 | A1 |
20020158305 | Dalmia et al. | Oct 2002 | A1 |
20030016162 | Sasada et al. | Jan 2003 | A1 |
20030034916 | Kwon et al. | Feb 2003 | A1 |
20030036349 | Liu et al. | Feb 2003 | A1 |
20040028888 | Lee et al. | Feb 2004 | A1 |
20040075604 | Nakazawa et al. | Apr 2004 | A1 |
20050109453 | Jacobson et al. | May 2005 | A1 |
20050156693 | Dove et al. | Jul 2005 | A1 |
20050248418 | Govind et al. | Nov 2005 | A1 |
20060044189 | Livingston et al. | Mar 2006 | A1 |
20060146484 | Kim et al. | Jul 2006 | A1 |
20060152406 | Leblanc et al. | Jul 2006 | A1 |
20060158378 | Pons et al. | Jul 2006 | A1 |
20060250298 | Nakazawa et al. | Nov 2006 | A1 |
20060267830 | O'Boyle | Nov 2006 | A1 |
20060290564 | Sasada et al. | Dec 2006 | A1 |
20070026567 | Beer et al. | Feb 2007 | A1 |
20070052503 | Quach et al. | Mar 2007 | A1 |
20070085108 | White et al. | Apr 2007 | A1 |
20070131452 | Gilliland | Jun 2007 | A1 |
20070230149 | Bibee | Oct 2007 | A1 |
20070279287 | Castaneda et al. | Dec 2007 | A1 |
20070285314 | Mortazawi et al. | Dec 2007 | A1 |
20080030416 | Lee et al. | Feb 2008 | A1 |
20080048800 | Dutta | Feb 2008 | A1 |
20080061900 | Park et al. | Mar 2008 | A1 |
20080068270 | Thiam et al. | Mar 2008 | A1 |
20080074338 | Vacanti | Mar 2008 | A1 |
20080150821 | Koch et al. | Jun 2008 | A1 |
20080169992 | Ortiz et al. | Jul 2008 | A1 |
20090000804 | Kobayashi et al. | Jan 2009 | A1 |
20090015483 | Liu | Jan 2009 | A1 |
20090058731 | Geary et al. | Mar 2009 | A1 |
20090066593 | Jared et al. | Mar 2009 | A1 |
20090102723 | Mateychuk et al. | Apr 2009 | A1 |
20090251356 | Margomenos | Oct 2009 | A1 |
20090251357 | Margomenos | Oct 2009 | A1 |
20090251362 | Margomenos et al. | Oct 2009 | A1 |
20100073238 | Jun et al. | Mar 2010 | A1 |
20100182103 | Margomenos | Jul 2010 | A1 |
20100182107 | Margomenos | Jul 2010 | A1 |
20100327068 | Chen et al. | Dec 2010 | A1 |
Number | Date | Country |
---|---|---|
101145627 | Mar 2008 | CN |
1324423 | Jul 2003 | EP |
04-286204 | Oct 1992 | JP |
6-224629 | Aug 1994 | JP |
8186437 | Jul 1996 | JP |
11-088038 | Mar 1999 | JP |
11186837 | Jul 1999 | JP |
2001-077608 | Mar 2001 | JP |
2001-189623 | Jul 2001 | JP |
2002-506592 | Feb 2002 | JP |
2007-194915 | Aug 2007 | JP |
2008-048090 | Feb 2008 | JP |
777967 | Nov 2007 | KR |
WO 2007149746 | Dec 2007 | WO |
WO 2008148569 | Dec 2008 | WO |
Entry |
---|
Targonski, S.D.; Waterhouse, R.B.; , “Reflector elements for aperture and aperture coupled microstrip antennas,” Antennas and Propagation Society International Symposium, 1997. IEEE., 1997 Digest , vol. 3, No., pp. 1840-1843 vol. 3, Jul. 13-18, 1997. |
K. Schuler et al., “Innovative Material Modulation for Multilayer LTCC Antenna at 76.5 GHz in Radar and Communication Applications”; Proceedings of the 33rd European Microwave Conference, Munich Germany 2003; pp. 707-710; printed in the year 2003. |
Walden et al., “A European Low Cost MMIC Based Millimetre-Wave Radar Module for Automotive Applications”, 4 pages. |
Chouvaev et al., “Application of a Substrate-Lens Antenna Concept and SiGe Component Development for Cost-Efficient Automotive Radar”, Sweedish National Testing and Research Institute, 34th European Microwave Conference, Amsterdam, pp. 1417-1420, 2004. |
“Advanced RF Frontend Technology Using Micromachined SiGe”, Information Society Technologies IST Program, 38 pages. |
Lee et al., “Characteristic of the Coplanar Waveguide to Microstrip Right-Angled Transition”, 3 pages. |
Suntives et al., “Design and Characterization of the EBG Waveguide-Based Interconnects”, IEEE Transactions on Advanced Packaging, vol. 30, No. 2, pp. 163-170, May 2007. |
Gedney et al., “Simulation and Performance of Passive Millimeter Wave Coplanar Waveguide Circuit Devices”, 1997 Wireless Communications Conference, pp. 27-31, May 1997. |
Weller, Thomas M., “Three-Dimensional High-Frequency Distribution Networks—Part I: Optimization of CPW Discontinuities”, IEEE Transactions on Microwave Theory and Techniques, vol. 48, No. 10, pp. 1635-1642, Oct. 2000. |
Omar et al., “Effects of Air-Bridges and Mitering on Coplanar Waveguide 90° Bends: Theory and Experiment”, 1993 IEEE MTT-S Digest, pp. 823-826, 1993. |
Watson et al., “Design and Optimization of CPW Circuits Using EM-ANN Models for CPW Components”, IEEE Transactions on Microwave Theory and Techniques, vol. 45, No. 12, pp. 2515-2523, Dec. 1997. |
Vetharatnam et al., “Combined Feed Network for a Shared-Aperture Dual-Band Dual-Polarized Array”, IEEE Antennas and Wireless Propagation Letters, vol. 4, pp. 297-299, 2005. |
Pozar et al., “Shared-Aperture Dual Band Dual-Polarized Microstrip Array”, IEEE Transactions on Antennas and Propagation, vol. 49, No. 2, pp. 150-157, Feb. 2001. |
Leong et al. “Coupling Suppression in Microstrip Lines using a Bi-Periodically Perforated Ground Plane”, IEEE Microwave and Wireless Components Letters, vol. 12, No. 5, pp. 169-171, May 2002. |
Iizuka et al., “Millimeter-Wave Microstrip Array Antenna for Automotive Radars”, IEEE Transactions for Communications, vol. E86-B, No. 9, pp. 2728-2738, Sep. 2003. |
Margomenos et al., “Isolation in Three-Dimensional Integrated Circuits”, IEEE Transactions on Microwave Theory and Techniques, vol. 51, issue 1, pp. 25-32, Jan. 2003. |
Ponchak et al., “Characterization of the Coupling Between Adjacent Finite Ground Coplanar (FGC) wageguides”, Int. J. Microcircuits Electron. Packag., vol. 20, No. 4, pp. 587-592, Nov. 1997. |
Ponchak et al., “Coupling Between Microstrip Lines With Finite Width Groundh Plane Embedded in Thin-Film Circuits”, IEEE Transaction on Advanced Packaging, vol. 28, No. 2, pp. 320-327, May 2005. |
Ponchak et al., “The Use of Metal Filled Via Holes for Improving Isolation in LTCC RF and Wireless Multichip Packages”, IEEE Transactions on Advanced Packaging, vol. 23, No. 1, pp. 88-99, Feb. 2000. |
Papapolymerou et al., “Crosstalk Between Finite Ground Coplanar Waveguides Over Polyimide Layers for 3-D MMICs on Si Substrates”, IEEE Transactions on Microwave Theory and Techniques, vol. 52, No. 4, pp. 1292-1301, Apr. 2004. |
Mbairi et al., “On the Problem of Using Guard Traces for High Frequency Differential Lines Crosstalk Reduction”, IEEE Transactions on Components and Packaging Technologies, vol. 30, No. 1, pp. 67-74, Mar. 2007. |
Alexandros D. Margomenos, “Three Dimensional Integration and Packaging Using Silicon Micromachining”, dissertation at the University of Michigan; Ann Arbor, Michigan; 2003. |
Number | Date | Country | |
---|---|---|---|
20120026043 A1 | Feb 2012 | US |