THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

CROSS-REFERENCES TO RELATED APPLICATIONS

This application claims the benefit of priorities to Chinese Application No. 202210021158.1, filed on Jan. 10, 2022, and Chinese Application No. 202211502869.7, filed on Nov. 28, 2022, both of which are incorporated herein by reference in their entireties.

BACKGROUND

The present disclosure relates to three-dimensional (3D) memory devices and fabrication methods thereof.

Planar memory cells are scaled to smaller sizes by improving process technology, circuit design, programming algorithm, and fabrication process. However, as feature sizes of the memory cells approach a lower limit, planar process and fabrication techniques become challenging and costly. As a result, memory density for planar memory cells approaches an upper limit. As the number of 3D memory layers continues to increase, the control of channel profile becomes more and more difficult.

SUMMARY

In one aspect, a 3D memory device is disclosed. The 3D memory device includes a stack structure including interleaved first conductive layers and first dielectric layers, a channel structure extending through the stack structure along a first direction in contact with a first semiconductor layer at a bottom portion of the channel structure, and a slit structure extending through the stack structure along the first direction. The slit structure includes a slit core, and a second dielectric layer surrounding the slit core. A first width of the second dielectric layer near the first semiconductor layer is larger than a second width of the second dielectric layer away from the first semiconductor layer.

In some implementations, the channel structure includes a semiconductor channel and a memory film over the semiconductor channel. The semiconductor channel includes an angled structure, and a third width of the semiconductor channel at the bottom portion of the channel structure below the angled structure is smaller than a fourth width of the semiconductor channel at an upper portion of the channel structure above the angled structure.

In some implementations, the 3D memory device further includes a second semiconductor layer below the stack structure. The second semiconductor layer is below a bottom surface of the second dielectric layer.

In some implementations, the second semiconductor layer is below a bottom surface of the semiconductor channel, and a top surface of the second semiconductor layer is ammonia (NH₃) treated.

In some implementations, the second semiconductor layer includes a p-type doping polysilicon layer.

In some implementations, the 3D memory device further includes a third semiconductor layer between the second semiconductor layer and the stack structure. A top surface of the third semiconductor layer is coplanar to the bottom surface of the second dielectric layer.

In some implementations, the third semiconductor layer includes an undoped polysilicon layer, and a top surface of the third semiconductor layer is ammonia (NH₃) treated.

In a further aspect, a 3D memory device is disclosed. The 3D memory device includes a first stack structure including a first semiconductor layer, a second semiconductor layer above the first semiconductor layer, and a third semiconductor layer surrounding the first semiconductor layer and the second semiconductor layer, a second stack structure above the first stack structure including interleaved first conductive layers and first dielectric layers, and a channel structure extending through the second stack structure along a first direction in contact with the third semiconductor layer at a bottom portion of the channel structure.

In some implementations, the 3D memory device further includes a slit structure extending through the second stack structure along the first direction. The slit structure includes a slit core extending through the second stack structure along the first direction in contact with the third semiconductor layer, and a second dielectric layer surrounding the slit core. A first width of the second dielectric layer contacting the third semiconductor layer is larger than a second width of the second dielectric layer away from the third semiconductor layer.

In some implementations, the first semiconductor layer includes a p-type doping polysilicon layer, and the second semiconductor layer comprises an undoped polysilicon layer.

In still a further aspect, a method for forming a 3D memory device is disclosed. A first semiconductor layer, a first dielectric layer, and a second semiconductor layer are formed on a substrate. A second dielectric layer extending through the second semiconductor layer, the first dielectric layer, and the first semiconductor layer in contact with the substrate are formed. A dielectric stack including interleaved third dielectric layers and fourth dielectric layers is formed on the second semiconductor layer and the second dielectric layer. A channel hole penetrating the dielectric stack, the second semiconductor layer, the first dielectric layer, and the first semiconductor layer is formed to expose the substrate. An oxidation operation is performed to form a fifth dielectric layer on the first semiconductor layer exposed by sidewalls of the channel hole. A channel structure is formed in the channel hole. The substrate, the fifth dielectric layer, and a bottom portion of the channel structure are removed. A third semiconductor layer is formed over the channel structure.

In some implementations, a trench extending through the second semiconductor layer, the first dielectric layer, and the first semiconductor layer is formed to expose the substrate, and the second dielectric layer is formed in the trench.

In some implementations, an ammonia (NH₃) treatment is performed on top surfaces of the first semiconductor layer and the second semiconductor layer.

In some implementations, a gate line slit opening extending through the dielectric stack and the second dielectric layer is formed. The first semiconductor layer and the gate line slit opening are separated by the second dielectric layer.

In some implementations, the fourth dielectric layers are replaced with first conductive layers through the gate line slit opening, and a slit structure is formed in the gate line slit opening.

In some implementations, a planarization operation is performed to remove the substrate, the bottom portion of the channel structure, and a bottom portion of the slit structure, and the fifth dielectric layer and a portion of the second dielectric layer are removed.

In some implementations, an etch operation is performed using the second semiconductor layer as a stop layer.

In some implementations, the channel structure includes a semiconductor channel and a memory film over the semiconductor channel, and a bottom portion of the memory film is removed to expose the semiconductor channel.

In some implementations, the semiconductor channel is formed above the first semiconductor layer in the channel hole.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate aspects of the present disclosure and, together with the description, further serve to explain the present disclosure and to enable a person skilled in the pertinent art to make and use the present disclosure.

FIG. 1 illustrates a cross-section of an exemplary 3D memory device, according to some aspects of the present disclosure.

FIG. 2 illustrates a cross-section of the bottom portions of the channel structures, according to some aspects of the present disclosure.

FIGS. 3-14 illustrate cross-sections of an exemplary 3D memory device at different stages of a manufacturing process, according to some aspects of the present disclosure.

FIG. 15 illustrates a flowchart of an exemplary method for forming a 3D memory device, according to some aspects of the present disclosure.

FIG. 16 illustrates a block diagram of an exemplary system having a memory device, according to some aspects of the present disclosure.

FIG. 17A illustrates a diagram of an exemplary memory card having a memory device, according to some aspects of the present disclosure.

FIG. 17B illustrates a diagram of an exemplary solid-state drive (SSD) having a memory device, according to some aspects of the present disclosure.

The present disclosure will be described with reference to the accompanying drawings.

DETAILED DESCRIPTION

Although specific configurations and arrangements are discussed, it should be understood that this is done for illustrative purposes only. As such, other configurations and arrangements can be used without departing from the scope of the present disclosure. Also, the present disclosure can also be employed in a variety of other applications. Functional and structural features as described in the present disclosures can be combined, adjusted, and modified with one another and in ways not specifically depicted in the drawings, such that these combinations, adjustments, and modifications are within the scope of the present discloses.

In general, terminology may be understood at least in part from usage in context. For example, the term “one or more” as used herein, depending at least in part upon context, may be used to describe any feature, structure, or characteristic in a singular sense or may be used to describe combinations of features, structures or characteristics in a plural sense. Similarly, terms, such as “a,” “an,” or “the,” again, may be understood to convey a singular usage or to convey a plural usage, depending at least in part upon context. In addition, the term “based on” may be understood as not necessarily intended to convey an exclusive set of factors and may, instead, allow for existence of additional factors not necessarily expressly described, again, depending at least in part on context.

It should be readily understood that the meaning of “on,” “above,” and “over” in the present disclosure should be interpreted in the broadest manner such that “on” not only means “directly on” something but also includes the meaning of “on” something with an intermediate feature or a layer therebetween, and that “above” or “over” not only means the meaning of “above” or “over” something but can also include the meaning it is “above” or “over” something with no intermediate feature or layer therebetween (i.e., directly on something).

Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may likewise be interpreted accordingly.

As used herein, the term “layer” refers to a material portion including a region with a thickness. A layer can extend over the entirety of an underlying or overlying structure or may have an extent less than the extent of an underlying or overlying structure. Further, a layer can be a region of a homogeneous or inhomogeneous continuous structure that has a thickness less than the thickness of the continuous structure. For example, a layer can be located between any pair of horizontal planes between, or at, a top surface and a bottom surface of the continuous structure. A layer can extend horizontally, vertically, and/or along a tapered surface. A substrate can be a layer, can include one or more layers therein, and/or can have one or more layer thereupon, thereabove, and/or therebelow. A layer can include multiple layers. For example, an interconnect layer can include one or more conductor and contact layers (in which interconnect lines and/or via contacts are formed) and one or more dielectric layers.

As used herein, the term “substrate” refers to a material onto which subsequent material layers are added. The substrate itself can be patterned. Materials added on top of the substrate can be patterned or can remain unpatterned. Furthermore, the substrate can include a wide array of semiconductor materials, such as silicon, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate can be made from an electrically non-conductive material, such as a glass, a plastic, or a sapphire wafer.

As used herein, the term “3D memory device” refers to a semiconductor device with vertically oriented strings of memory cell transistors (referred to herein as “memory strings,” such as NAND memory strings) on a laterally-oriented substrate so that the memory strings extend in the vertical direction with respect to the substrate. As used herein, the term “vertical/vertically” means nominally perpendicular to the lateral surface of a substrate.

A 3D semiconductor device can be formed by stacking semiconductor wafers or dies and interconnecting them vertically so that the resulting structure acts as a single device to achieve performance improvements at reduced power and a smaller footprint than conventional planar processes. However, as the number of 3D memory layers continues to increase, the control of channel profile becomes more and more difficult

FIG. 1 illustrates a cross-section of an exemplary 3D memory device 100, according to some aspects of the present disclosure. As shown in FIG. 1, 3D memory device 100 includes a stack structure 111, a channel structure 118 extending through stack structure 111 along the z-direction, and a channel structure 119 also extending through stack structure 111 along the z-direction. In some implementations, channel structure 118 and channel structure 119 extending vertically through stack structure 111 along the z-direction. Stack structure 111 may include interleaved conductive layers 113 and dielectric layers 107, and the stacked conductive/dielectric layer pairs are also referred to as a memory stack. In some implementations, dielectric layers 107 may include dielectric materials including, but not limited to, silicon oxide, silicon nitride, silicon oxynitride, or any combination thereof. In some implementations, conductive layers 113 may form the word lines and may include conductive materials including, but not limited to, tungsten (W), cobalt (Co), copper (Cu), aluminum (Al), polysilicon, doped silicon, silicides, or any combination thereof.

Channel structure 118 and channel structure 119 may extend through stack structure 111, and the bottom of channel structure 118 and channel structure 119 may contact a source of 3D memory device 100. In some implementations, channel structure 118 may include a semiconductor channel 132 and a memory film 125 formed over semiconductor channel 132. The meaning of “over” here, besides the explanation stated above, should also be interpreted “over” something from the top side or from the lateral side. In some implementations, channel structure 118 may also include a dielectric core 129 in the center of channel structure 118. In some implementations, memory film 125 may include a tunneling layer 130 over semiconductor channel 132, a storage layer 128 over tunneling layer 130, and a blocking layer 126 over storage layer 128.

Dielectric core 129, semiconductor channel 132, tunneling layer 130, storage layer 128, and blocking layer 126 are arranged radially from the center toward the outer surface of channel structure 118 in this order, according to some implementations. In some implementations, tunneling layer 130 may include silicon oxide, silicon oxynitride, or any combination thereof. In some implementations, storage layer 128 may include silicon nitride, silicon oxynitride, silicon, or any combination thereof. In some implementations, blocking layer 126 may include silicon oxide, silicon oxynitride, high dielectric constant (high-k) dielectrics, or any combination thereof. In one example, the memory film may include a composite layer of silicon oxide/silicon oxynitride (or silicon nitride)/silicon oxide (ONO).

As shown in FIG. 1, channel structure 118 and channel structure 119 may have similar structures, but the bottom portions of channel structure 118 and channel structure 119 are different. The bottom portion of channel structure 118 includes semiconductor channel 132 extending into a semiconductor layer 136, and the bottom portion of channel structure 119 includes semiconductor channel 132 not extending into semiconductor layer 136. The difference between channel structure 118 and channel structure 119 will be further discussed later in FIG. 2.

As shown in FIG. 1, a dummy channel structure 124 may be formed in stack structure 111 extending along the z-direction. In some implementations, a contact structure 134 may be formed in stack structure 111 extending along the z-direction. It is understood that, in the actual structure, stack structure 111 and the staircase region (including dummy channel structure 124 and/or contact structure 134) may not be seen in the same cross-section. For the purpose of better describing the present disclosure, the cross-sections of stack structure 111 and the staircase region are illustrated in the same drawings in the present disclosure, and the coordinates of x-direction and y-direction are noted in FIG. 1 to show the perpendicularity of the cross-sections of stack structure 111 and the staircase region.

A gate line slit 133 may be formed in stack structure 111 extending along the z-direction, as shown in FIG. 1. In some implementations, gate line slit 133 may include a dielectric layer 135, a dielectric layer 139, and a slit core, e.g., a conductive layer 141. In some implementations, dielectric layer 135 and dielectric layer 139 may surround conductive layer 141. In some implementations, conductive layer 141 may further include one or more conductive layers, such as polysilicon, tungsten (W), or the combination of polysilicon and W. As shown in FIG. 1, dielectric layer 135 and dielectric layer 139 may have different widths in the cross-section of 3D memory device 100. In some implementations, the width of dielectric layer 135 may be greater than the width of dielectric layer 139 in the cross-section of 3D memory device 100. In other words, the width of dielectric layer 135 near the source of the 3D memory device 100 may be greater than the width of dielectric layer 139 away from the source of the 3D memory device 100 in the cross-section of 3D memory device 100.

In some implementations, a peripheral device may be formed above or beneath 3D memory device 100, and the conductive paths formed by contact structures 134 may be used to connect the peripheral device. For example, the source terminals of 3D memory device 100 may be connected to the peripheral device through the conductive paths formed by one or multiple contact structures 134, and therefore the peripheral device may control the operations of 3D memory device 100. In some implementations, the conductive paths formed by contact structures 134 may be used to connected other devices disposed above, below, or aside 3D memory device 100. In some implementations, the peripheral device may include one or more peripheral circuits. In some implementations, the peripheral circuits may be electrically connected to 3D memory device 100 through the conductive wires, such as the redistribution layers.

FIG. 2 illustrates a cross-section of a bottom portion of channel structure 118 and channel structure 119 of 3D memory device 100, according to some aspects of the present disclosure. As shown in FIG. 2, the bottom portion of channel structure 118 and channel structure 119 may include a bending structure of semiconductor channel 132, tunneling layer 130, and storage layer 128. Semiconductor layer 136 may be disposed under stack structure 111, as shown in FIG. 1 and FIG. 2. In some implementations, semiconductor layer 136 may be a conductive layer. In some implementations, semiconductor layer 136 may be a polysilicon layer. In some implementations, semiconductor layer 136 is in direct contact with semiconductor channel 132. In some implementations, semiconductor layer 136 is in direct contact with the bottom surface of semiconductor channel 132 and a portion of a side surface of semiconductor channel 132 at the bottom portion of channel structure 118. In some implementations, the bottom surface of memory film 125, including blocking layer 126, storage layer 128, and tunneling layer 130, is above the bottom surface of semiconductor channel 132, as shown in FIG. 2.

The difference between channel structure 118 and channel structure 119 is the bottom of the channel structures. In some implementations, the difference between channel structure 118 and channel structure 119 is the bottom portion of semiconductor channel 132. The bottom portion of semiconductor channel 132 of channel structure 118 may extend into semiconductor layer 136, and the bottom portion of semiconductor channel 132 of channel structure 119 may not extend into semiconductor layer 136. In some implementations, channel structure 118 and channel structure 119 may have the same structure.

In some implementations, each of channel structure 118 and channel structure 119 may be a circular structure in a plan view of 3D memory device 100. In some implementations, dielectric core 129, semiconductor channel 132, tunneling layer 130, storage layer 128, and blocking layer 126 are arranged radially from the center toward the outer surface of channel structure 118 and channel structure 119. As shown in FIG. 2, semiconductor channel 132 at the bottom portion of channel structure 118 and channel structure 119 may have a different diameter compared to semiconductor channel 132 at the upper portion of channel structure 118 and channel structure 119. In some implementations, in the plan view of 3D memory device 100, semiconductor channel 132 at the bottom portion of channel structure 118 and channel structure 119 may have an outer diameter, or an outer width, W1, semiconductor channel 132 at the upper portion of channel structure 118 and channel structure 119 may have an outer diameter, or an outer width, W2, and W1 is smaller than W2. Here, the upper portion of channel structure 118 and channel structure 119 refers to channel structure 118 and channel structure 119 above the bending structure, and the bottom portion of channel structure 118 and channel structure 119 refers to channel structure 118 and channel structure 119 under the bending structure, as shown in FIG. 2.

In some implementations, the bending structure of channel structure 118 and channel structure 119 may be formed as an angled structure in the cross-section of channel structure 118 and channel structure 119. For example, as shown in FIG. 2, semiconductor channel 132 may be formed as two right angle structures. In some implementations, semiconductor channel 132 may be formed as obtuse angle structures, acute angle structures, right angle structures, arc angle structures, or any combination of these angled structures. The outer diameter W1 of semiconductor channel 132 at the bottom portion of channel structure 118 and channel structure 119 below the angled structure is smaller than the outer diameter W2 of semiconductor channel 132 at the upper portion of channel structure 118 and channel structure 119 above the angled structure.

In some implementations, as shown in FIG. 1, a semiconductor layer 106, e.g., a first semiconductor layer, may be formed below the stack structure 111. In some implementations, semiconductor layer 106 may be formed below a bottom surface of dielectric layer 135. In some implementations, semiconductor layer 106 may be formed below a bottom surface of semiconductor channel 132 of channel structure 119. In some implementations, semiconductor layer 106 may be a p-type doping (p-doping) polysilicon layer.

In some implementations, a semiconductor layer 110, e.g., the second semiconductor layer, may be formed between semiconductor layer 136 and stack structure 111. In some implementations, a dielectric layer 116 may be formed between semiconductor layer 110 and channel structure 118. In other words, dielectric layer 116 insulates channel structure 118 and semiconductor layer 110. It is noted that, in some implementations, dielectric layer 116 and blocking layer 126 may be formed by the same material, e.g., silicon oxide, and in the cross-sectional view of 3D memory device 100, semiconductor layer 110 may be in contact with channel structure 118 through dielectric layer 116.

In some implementations, semiconductor layer 110 may be formed between semiconductor layer 106 and stack structure 111. In some implementations, a top surface of semiconductor layer 110 is coplanar to the bottom surface of dielectric layer 135. In some implementations, semiconductor layer 110 may be an undoped polysilicon layer.

FIGS. 3-14 illustrate cross-sections of 3D memory device 100 at different stages of a manufacturing process, according to some aspects of the present disclosure. FIG. 15 illustrates a flowchart of an exemplary method 1500 for forming 3D memory device 100, according to some aspects of the present disclosure. For the purpose of better describing the present disclosure, the cross-sections of 3D memory device 100 in FIGS. 3-14 and method 1500 in FIG. 15 will be discussed together. It is understood that the operations shown in method 1500 are not exhaustive and that other operations may be performed as well before, after, or between any of the illustrated operations. Further, some of the operations may be performed simultaneously, or in a different order than shown in FIGS. 3-14 and FIG. 15.

As shown in FIG. 3 and operation 1502 in FIG. 15, a dielectric layer 104, semiconductor layer 106, a dielectric layer 108, semiconductor layer 110, a dielectric layer 117, a dielectric layer 121, and a dielectric layer 123 may be sequentially formed on a substrate 102.

In some implementations, substrate 102 may be a doped or undoped semiconductor layer. In some implementations, dielectric layer 104 may be a silicon oxide layer. In some implementations, semiconductor layer 106 may be a p-type doping (p-doping) polysilicon layer. In some implementations, dielectric layer 108 may be a silicon oxide layer. In some implementations, semiconductor layer 110 may be an undoped polysilicon layer. In some implementations, dielectric layer 117 may be a silicon oxide layer. In some implementations, dielectric layer 121 may be a silicon nitride layer. In some implementations, dielectric layer 123 may be a silicon oxide layer. In some implementations, dielectric layer 104, semiconductor layer 106, dielectric layer 108, semiconductor layer 110, dielectric layer 117, dielectric layer 121, and dielectric layer 123 may be sequentially deposited by one or more thin film deposition processes including, but not limited to, chemical vapor deposition (CVD), physical vapor deposition (PVD), atomic layer deposition (ALD), or any combination thereof.

In some implementations, semiconductor layer 106 may have an oxidation rate higher than the oxidation rate of semiconductor layer 110. In some implementations, after the formation of semiconductor layer 106 and semiconductor layer 110, an ammonia (NH₃) treatment may be performed on semiconductor layer 106 and semiconductor layer 110. In some implementations, the NH₃treatment may be performed on top surfaces of semiconductor layer 106 and semiconductor layer 110. In some implementations, the NH₃treatment on top surfaces of semiconductor layer 106 and semiconductor layer 110 may prevent an oxide layer formed along top surfaces of semiconductor layer 106 and semiconductor layer 110 in a later oxidation process. In some implementations, the thickness of semiconductor layer 106 is greater than the thickness of semiconductor layer 110.

As shown in FIGS. 4 and 5 and operation 1504 in FIG. 15, dielectric layer 135 may be formed extending through dielectric layer 117, semiconductor layer 110, dielectric layer 108, semiconductor layer 106, and dielectric layer 104 in contact with substrate 102. In some implementations, an opening 127 may be first formed in dielectric layer 104, semiconductor layer 106, dielectric layer 108, semiconductor layer 110, dielectric layer 117, dielectric layer 121, and dielectric layer 123 to expose substrate 102, as shown in FIG. 4. In some implementations, opening 127 may be formed by using dry etch, wet etch, or other suitable processes. Then dielectric layer 135 may be formed in opening 127, and a planarization operation, e.g., a chemical mechanical polishing (CMP) processes, may be performed to remove portions of dielectric layer 135, dielectric layer 121, and dielectric layer 123, as shown in FIG. 5.

In some implementations, dielectric layer 135 may be used as a barrier in a later oxidation operation to limit the oxidation operation of semiconductor layer 106 being performed in a predefined area. In some implementations, dielectric layer 135 may be used to limit the oxidation of semiconductor layer 106 in the core area of 3D memory device 100. Because the thickness of semiconductor layer 106 will be different after the oxidation operation, dielectric layer 135 may prevent the uneven situation of semiconductor layer 106 in the staircase area.

As shown in FIG. 6 and operation 1506 in FIG. 15, a dielectric stack 103 including interleaved dielectric layers 107 and dielectric layers 109 may be formed on semiconductor layer 110 and dielectric layer 135. In some implementations, dielectric stack 103 is formed on dielectric layer 117, semiconductor layer 110, dielectric layer 108, semiconductor layer 106, dielectric layer 104, and dielectric layer 135. In some implementations, dielectric layers 109 may be sacrificial layers and will be removed in a later operation. In some implementations, each dielectric layer 107 may include a layer of silicon oxide, and each dielectric layer 109 may include a layer of silicon nitride. In some implementations, dielectric stack 103 may be formed by one or more thin film deposition processes including, but not limited to, CVD, PVD, ALD, or any combination thereof.

As shown in FIG. 7 and operation 1508 in FIG. 15, one or more than one channel hole 112 may be formed penetrating dielectric stack 103, semiconductor layer 110, and semiconductor layer 106 to expose substrate 102. In some implementations, channel hole 112 may be formed vertically. In some implementations, channel hole 112 may be formed extending along the z-direction. As shown in FIG. 7, semiconductor layer 110 and semiconductor layer 106 are exposed by the sidewalls of channel hole 112. In some implementations, fabrication processes for forming channel hole 112 may include wet etching and/or dry etching, such as deep reactive ion etching (DRIE).

As shown in FIG. 8 and operation 1510 in FIG. 15, an oxidation operation may be performed to form a dielectric layer 114 on semiconductor layer 106 exposed by sidewalls of channel hole 112 and form a dielectric layer 116 on semiconductor layer 110 exposed by sidewalls of channel hole 112.

Because semiconductor layer 106 is a p-doping polysilicon layer and semiconductor layer 110 is an undoped polysilicon layer, the oxidation rate of semiconductor layer 106 and semiconductor layer 110 may be different. In some implementations, the oxidation rate of semiconductor layer 106 exposed by sidewalls of channel hole 112 is higher than the oxidation rate of semiconductor layer 110 exposed by sidewalls of channel hole 112.

In some implementations, because the NH₃treatment is performed on top surfaces of semiconductor layer 106 and semiconductor layer 110 during the formation of semiconductor layer 106 and semiconductor layer 110, dielectric layer 114 and dielectric layer 116 may be formed on sidewalls of channel hole 112 along the x-direction and y-direction which is a plane perpendicular to the z-direction.

In the plan view of 3D memory device 100, channel hole 112 may be a circle, and the exposed sidewall is the circumference of the circle. In some implementations, the formation of dielectric layer 114 and dielectric layer 116 begins from the circumference of the circle and then extends to the center of the circle.

In some implementations, based on the formation speed of dielectric layer 114, dielectric layer 114 formed on one side of semiconductor layer 106 in channel hole 112 may be in contact with dielectric layer 114 formed on the other side of polysilicon layer 106. In some implementations, dielectric layer 114 formed on one side of polysilicon layer 106 in channel hole 112 may be separated with dielectric layer 114 formed on the other side of polysilicon layer 106 by a gap. It is understood that the one side or the other side of channel hole 112 described here are the viewpoints from the cross-sectional view. In the actual structure, from a plan view, channel hole 112 may be a hole, and dielectric layer 114 formed on semiconductor layer 106 may be formed from the circumference to the center. In some implementations, in the plan view, dielectric layer 114 formed on semiconductor layer 106 may cover the whole channel hole 112. In some implementations, in the plan view, dielectric layer 114 formed on semiconductor layer 106 may have a gap (a hole) at the center of channel hole 112. In some implementations, the width of the gap may be controlled during the formation operation, and the size of the gap may further cause various structures of the memory film formed in a later process. In some implementations, the width of the gap may be controlled to cause parts of the memory film or the whole memory film filled in the gap. For example, the memory film including the tunneling layer, the storage layer, and the blocking layer may be formed, filling the gap. For another example, the blocking layer may be formed, filling the gap. It is understood that, in FIG. 8, the sizes of the gaps in two channel holes 112 are different; however, the sizes of the gaps in two channel holes 112 may be the same in other implementations.

In some implementations, dielectric layer 116 may be formed on semiconductor layer 110 exposed by sidewalls of channel hole 112. Because semiconductor layer 106 includes doped polysilicon, and semiconductor layer 110 includes undoped polysilicon, the formation speed of dielectric layer 114 may be higher than dielectric layer 116. Hence, the area of dielectric layer 114 may be larger than the area of dielectric layer 116. It is understood that in the cross-sectional view of FIG. 8, dielectric layer 116 is formed from two sides of semiconductor layer 110, however, in the plan view of the structure, dielectric layer 116 is formed on semiconductor layer 110 from the circumference to the center.

During the oxidation operation, semiconductor layer 106 is divided by dielectric layer 135 into two portions: one is the first portion between sidewalls of channel hole 112 and dielectric layer 135 and the other is the second portion behind dielectric layer 135. The oxidation operation of semiconductor layer 106 may be blocked by dielectric layer 135, and the oxidation operation of semiconductor layer 106 will be limited in the area of the first portion only.

As shown in FIG. 9 and operation 1512 in FIG. 15, channel structure 118 and channel structure 119 may be formed in channel hole 112. Each of channel structure 118 and channel structure 119 may include memory film 125 and semiconductor channel 132. In some implementations, each of channel structure 118 and channel structure 119 may also include dielectric core 129 in the center of channel structure. In some implementations, memory film 125 is a composite layer including tunneling layer 130, storage layer 128 (also known as a “charge trap layer”), and blocking layer 126. Channel structure 118 and channel structure 119 can have a cylinder shape (e.g., a pillar shape), and the bottom portion of the cylinder shape may be shrunk at the portion having dielectric layer 116 formed on sidewalls of channel hole 112. In some implementations, channel structure 118 and channel structure 119 may be a cone shape, and the bottom portion of the cone shape is smaller than the upper portion of the cone shape. In this situation, the bottom portion of the cone shape may be shrunk at the portion having dielectric layer 116 formed on sidewalls of channel hole 112.

In some implementations, when dielectric layer 114 formed on semiconductor layer 106 has a gap (a hole) at the center of channel hole 112, memory film 125 including tunneling layer 130, storage layer 128, and blocking layer 126 may be formed to fill the gap. In some implementations, memory film 125 may fully fill the gap, such as channel structure 119. Hence, by controlling the size of the gap or the hole formed by dielectric layer 114 through the oxidation operation, the portion of channel structure 118 that is above dielectric layer 114 is formed by memory film 125 and semiconductor channel 132. The portion of channel structure 119 that is under dielectric layer 114 is formed only by memory film 125 including tunneling layer 130, storage layer 128, and blocking layer 126 (the ONO layers). In some implementations, memory film 125 may not fully fill the gap, and semiconductor channel 132 may also fill the gap, such as channel structure 118.

Dielectric core 129, semiconductor channel 132, tunneling layer 130, storage layer 128, and blocking layer 126 are arranged radially from the center toward the outer surface of the pillar in this order, according to some implementations. In some implementations, tunneling layer 130 may include silicon oxide, silicon oxynitride, or any combination thereof. In some implementations, storage layer 128 may include silicon nitride, silicon oxynitride, silicon, or any combination thereof. In some implementations, blocking layer 126 may include silicon oxide, silicon oxynitride, high dielectric constant (high-k) dielectrics, or any combination thereof. In one example, memory film 125 may include a composite layer of silicon oxide/silicon oxynitride (or silicon nitride)/silicon oxide (ONO).

A gate line slit opening may be further formed along the z-direction penetrating through dielectric stack 103 and dielectric layer 135 to expose substrate 102. The gate line slit opening may be formed by performing dry etch, wet etch, or other suitable processes. In some implementations, the gate line slit opening may extend to substrate 102.

Then, a word line replacement operation may be performed, and dielectric layers 109 may be removed and replaced by word lines, e.g., conductive layers 113. For example, dielectric layers 109 may be removed by dry etch, wet etch, or other suitable processes to form a plurality of cavities. Conductive layers 113 may be formed in the cavities by sequentially deposing the gate dielectric layer made from high-k dielectric materials, the adhesion layer including titanium/titanium nitride (Ti/TiN) or tantalum/tantalum nitride (Ta/TaN), and the gate conductor made from tungsten. After the word line replacement operation, stack structure 111 is formed, as shown in FIG. 10.

In some implementations, a removal process may be performed to clean the gate line slit opening. The removal process may remove the residues of former procedures from the gate line slit opening. For example, the high-k dielectric materials may be removed from the gate line slit opening. Then, in some implementations, gate line slit 133 may be formed in the gate line slit opening. In some implementations, gate line slit 133 may include dielectric layer 139 and a slit core, e.g., conductive layer 141. In some implementations, conductive layer 141 may include one or more conductive layers, such as polysilicon, tungsten (W), or the combination of polysilicon and W.

In some implementations, dummy channel structure 124 may be formed in stack structure 111 extending along the z-direction. In some implementations, contact structure 134 may be formed in stack structure 111 extending along the z-direction. In some implementations, contact structure 134 may be in contact with semiconductor layer 110. In some implementations, gate line slit 133 may be formed before the word line replacement operation. In some implementations, after forming gate line slit 133, dummy channel structure 124, and contact structure 134 on substrate 102, one or more interconnection layers may be further formed on the memory array. In addition, a peripheral circuit may be formed on another substrate and bonded with the memory array in a later process.

As shown in FIGS. 11-12 and operation 1514 in FIG. 15, a substrate removal operation is performed. In some implementations, substrate 102, a bottom portion of dummy channel structure 124, a bottom portion of gate line slit 133, a bottom portion of dielectric layer 135, a bottom portion of channel structure 118, and a bottom portion of channel structure 119 may be removed by the CMP process, and the CMP process may be stopped at dielectric layer 104. In some implementations, the bottom portion of channel structure 118 and channel structure 119 may be exposed after the CMP process. In some implementations, substrate 102 may be peeled off.

In some implementations, in which substrate 102 includes silicon, substrate 102 may be removed using silicon CMP, which can be automatically stopped when reaching the stop layer having materials other than silicon, i.e., the bottom portion of channel structure 118. In some implementations, substrate 102 may be further removed by the wet etch, dry etching, or other suitable processes until being stopped by dielectric layer 104. When using wet etch to remove substrate 102, the bottom portion of channel structure 118, the bottom portion of gate line slit 133, and the bottom portion of dummy channel structure 124 may still remain. In some implementations, substrate 102 is removed using wet etching by tetramethylammonium hydroxide (TMAH), which is automatically stopped when reaching the stop layer having materials other than silicon, i.e., dielectric layer 104. In some implementations, substrate 102 may be removed by the CMP processes, and the bottom portion of channel structure 118, the bottom portion of gate line slit 133, and the bottom portion of dummy channel structure 124 may be removed together

As shown in FIG. 12, dielectric layer 104, dielectric layer 114, partials of the bottom portion of channel structure 118 and channel structure 119, partials of the bottom portion of gate line slit 133, and partials of the bottom portion of dummy channel structure 124 may be then removed. In some implementations, dielectric layer 104, dielectric layer 114, partials of the bottom portion of channel structure 118 and channel structure 119, partials of the bottom portion of gate line slit 133, and partials of the bottom portion of dummy channel structure 124 may be removed by wet etch, dry etch, CMP, or other suitable processes.

Because the portion of channel structure 119 under dielectric layer 114 is formed only by memory film 125 including tunneling layer 130, storage layer 128, and blocking layer 126 (the ONO layers), when removing dielectric layer 104, memory film 125 under dielectric layer 114 may be completely removed as well. Further, the portion of channel structure 118 under dielectric layer 114 is formed by memory film 125 and semiconductor channel 132; when removing dielectric layer 104, memory film 125 under dielectric layer 114 may be completely removed, and semiconductor channel 132 may still remain. Hence, by using the polysilicon oxidation operation performed on semiconductor layer 106, the depth of channel structure 118 and channel structure 119 can be controlled in a predefined range, and the depth or the bottom profile of channel structure 118 and channel structure 119 will not be affected by the residues formed in channel hole 112. The control of channel profile is therefore improved.

Because during the formation of channel structure 118, dielectric layer 116 forms a protrusion on sidewalls of channel hole 112 along the x-direction and/or y-direction, the bottom portion of the cylinder shape of channel structure 118 and channel structure 118 is affected by dielectric layer 116 and forms a shrunk structure, or a depression, as shown in FIG. 12. After the bottom portion of the memory film is removed, in some implementations, the exposed portions of tunneling layer 130 and storage layer 128 may have a critical dimension (or a diameter from the plan view) smaller than tunneling layer 130 and storage layer 128 located at the upper portion of channel structure 118 and channel structure 119, as shown in FIG. 12. Furthermore, in some implementations, the exposed portion of semiconductor channel 132 at the bottom portion of channel structure 118 and channel structure 119 has a critical dimension (or a diameter from the plan view) smaller than semiconductor channel 132 located at the upper portion of channel structure 118 and channel structure 119 as well.

In another implementation, dielectric layer 108 may be removed by CMP process, and the bottom surface of gate line slit 133 and the bottom surface of dummy channel structure 124 may be coplanar to or substantially coplanar to the bottom surface of semiconductor layer 110.

As shown in FIG. 13 and operation 1516 in FIG. 15, semiconductor layer 136 may be formed over the exposed channel structure 118 and channel structure 119. In some implementations, semiconductor layer 136 may be formed by CVD, PVD, ALD, or other suitable processes.

As shown in FIG. 14, a through silicon contact (TSC) is formed to expose the contact structure, and a spacer layer 137, e.g., a silicon oxide layer, may be formed covering the sidewalls of the TSC. A contact hole is formed on spacer layer 137. Then, a contact pad 138 is formed in contact with contact structure 134 or in contact with semiconductor layer 136.

By forming dielectric layer 114 on semiconductor layer 106 exposed by sidewalls of channel hole 112, channel hole 112 may be fully or partially filled by dielectric layer 114. Hence, the bottom portion of channel structure 118 and channel structure 119 may be defined by the position of dielectric layer 114 and semiconductor layer 106. The bottom portion of channel structure 118 and channel structure 119 will not be affected by channel hole etch gouging, and therefore the process window of the formation of channel holes will be greatly increased.

FIG. 16 illustrates a block diagram of an exemplary system 1600 having a memory device, according to some aspects of the present disclosure. System 1600 can be a mobile phone, a desktop computer, a laptop computer, a tablet, a vehicle computer, a gaming console, a printer, a positioning device, a wearable electronic device, a smart sensor, a virtual reality (VR) device, an argument reality (AR) device, or any other suitable electronic devices having storage therein. As shown in FIG. 16, system 1600 can include a host 1608 and a memory system 1602 having one or more memory devices 1604 and a memory controller 1606. Host 1608 can be a processor of an electronic device, such as a central processing unit (CPU), or a system-on-chip (SoC), such as an application processor (AP). Host 1608 can be configured to send or receive data to or from memory devices 1604.

Memory device 1604 can be any memory device disclosed in the present disclosure. As disclosed above in detail, memory device 1604, such as a NAND Flash memory device, may have a controlled and predefined discharge current in the discharge operation of discharging the bit lines. Memory controller 1606 is coupled to memory device 1604 and host 1608 and is configured to control memory device 1604, according to some implementations. Memory controller 1606 can manage the data stored in memory device 1604 and communicate with host 1608. For example, memory controller 1606 may be coupled to memory device 1604, such as 3D memory device 100 described above, and memory controller 1606 may be configured to control the operations of channel structure 118 through the peripheral device. By forming the dielectric layer on the polysilicon layer exposed by sidewalls of the channel holes, the bottom portion of channel structures will not be affected by channel hole etch gouging, and therefore the process window of forming 3D memory device 100 will be greatly increased.

In some implementations, memory controller 1606 is designed for operating in a low duty-cycle environment like secure digital (SD) cards, compact Flash (CF) cards, universal serial bus (USB) Flash drives, or other media for use in electronic devices, such as personal computers, digital cameras, mobile phones, etc. In some implementations, memory controller 1606 is designed for operating in a high duty-cycle environment SSDs or embedded multi-media-cards (eMMCs) used as data storage for mobile devices, such as smartphones, tablets, laptop computers, etc., and enterprise storage arrays. Memory controller 1606 can be configured to control operations of memory device 1604, such as read, erase, and program operations. Memory controller 1606 can also be configured to manage various functions with respect to the data stored or to be stored in memory device 1604 including, but not limited to bad-block management, garbage collection, logical-to-physical address conversion, wear leveling, etc. In some implementations, memory controller 1606 is further configured to process error correction codes (ECCs) with respect to the data read from or written to memory device 1604. Any other suitable functions may be performed by memory controller 1606 as well, for example, formatting memory device 1604. Memory controller 1606 can communicate with an external device (e.g., host 1608) according to a particular communication protocol. For example, memory controller 1606 may communicate with the external device through at least one of various interface protocols, such as a USB protocol, an MMC protocol, a peripheral component interconnection (PCI) protocol, a PCI-express (PCI-E) protocol, an advanced technology attachment (ATA) protocol, a serial-ATA protocol, a parallel-ATA protocol, a small computer small interface (SCSI) protocol, an enhanced small disk interface (ESDI) protocol, an integrated drive electronics (IDE) protocol, a Firewire protocol, etc.

Memory controller 1606 and one or more memory devices 1604 can be integrated into various types of storage devices, for example, be included in the same package, such as a universal Flash storage (UFS) package or an eMMC package. That is, memory system 1602 can be implemented and packaged into different types of end electronic products. In one example as shown in FIG. 17A, memory controller 1606 and a single memory device 1604 may be integrated into a memory card 1702. Memory card 1702 can include a PC card (PCMCIA, personal computer memory card international association), a CF card, a smart media (SM) card, a memory stick, a multimedia card (MMC, RS-MMC, MMCmicro), an SD card (SD, miniSD, microSD, SDHC), a UFS, etc. Memory card 1702 can further include a memory card connector 1704 coupling memory card 1702 with a host (e.g., host 1608 in FIG. 16). In another example as shown in FIG. 17B, memory controller 1606 and multiple memory devices 1604 may be integrated into an SSD 1706. SSD 1706 can further include an SSD connector 1708 coupling SSD 1706 with a host (e.g., host 1608 in FIG. 16). In some implementations, the storage capacity and/or the operation speed of SSD 1706 is greater than those of memory card 1702.

The foregoing description of the specific implementations can be readily modified and/or adapted for various applications. Therefore, such adaptations and modifications are intended to be within the meaning and range of equivalents of the disclosed implementations, based on the teaching and guidance presented herein.

The breadth and scope of the present disclosure should not be limited by any of the above-described exemplary implementations, but should be defined only in accordance with the following claims and their equivalents.

Number	Date	Country	Kind
202210021158.1	Jan 2022	CN	national
202211502869.7	Nov 2022	CN	national

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

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