Claims
- 1. A leadthrough configuration, comprising:
a plastic wall formed of a plastic material having a first coefficient of thermal expansion; a metallic conductor formed of a metal having a second coefficient of thermal expansion different from the first coefficient of thermal expansion, said conductor being embedded in said plastic wall and extending along a leadthrough path; and said conductor having a bent profile configured such that, upon a change in temperature, at least one portion of said metallic conductor remains in the leadthrough path wherein oppositely directed sealing forces act on said conductor.
- 2. The configuration according to claim 1, wherein said profile of said conductor in a first plane includes at least two oppositely curved bends.
- 3. The configuration according to claim 2, wherein said conductor is formed with at least two pairs of sealing projections, said sealing projections are spaced apart in an axial direction, directed away from each other, and extend in a direction perpendicular to the first plane.
- 4. The configuration according to claim 2, wherein said bends have a rectangular profile.
- 5. The configuration according to claim 1, wherein said profile of said conductor in a first plane includes one bend, and wherein a rigid counter-pressure element surrounds said bend at least in certain portions of an outer region thereof.
- 6. The configuration according to claim 5, wherein said counterpressure element is a capsule.
- 7. The configuration according to claim 5, wherein said conductor is formed with at least two pairs of sealing projections, said sealing projections are spaced apart in an axial direction, directed away from each other, and extend in a direction perpendicular to the first plane.
- 8. The configuration according to claim 5, wherein said bend or the bends have a rectangular profile.
- 9. The configuration according to claim 1, wherein said conductor has a rectangular cross-sectional profile.
- 10. A leadthrough configuration, comprising:
a plastic wall; a metallic conductor extending through said wall in tight sealing fashion, said conductor having at least two axially spaced, radial disk elements; and each said radial disk element being formed on both sides with in each case two raised, radially spaced-apart peripheral cross-pieces.
- 11. The configuration according to claim 10, wherein said conductor is one of a plurality of conductors grouped together in form of a leadframe.
- 12. A method of producing a tight leadthrough for a metallic conductor through a plastic wall, which comprises:
providing a metal conductor formed of a material having a coefficient of thermal expansion different from a plastics material of the plastic wall; embedding the conductor into the plastic wall to extend along a leadthrough path; and prior to embedding, bending the conductor to give the conductor a form such that, after embedding into the plastic material, and upon a change in temperature, at least a portion of the conductor remains in the leadthrough path, wherein oppositely directed sealing forces act on the conductor.
- 13. The method according to claim 12, wherein the embedding step comprises encapsulating the metal conductor with plastics material.
Priority Claims (1)
Number |
Date |
Country |
Kind |
199 36 370.6 |
Aug 1999 |
DE |
|
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of copending International Application No. PCT/DE00/02504, filed Jul. 28, 2000, which designated the United States.
Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/DE00/02504 |
Jul 2000 |
US |
Child |
10066873 |
Feb 2002 |
US |