Claims
- 1. A metallized article comprising:a substrate; a polyurethane basecoat disposed upon said substrate; a layer of electrically discrete metallic islands of a corrosion prone metal disposed upon the basecoat; a polyurethane topcoat disposed on and encapsulating the discrete metallic islands, the topcoat comprising an epoxy silane.
- 2. The metallized article according to claim 1 wherein said epoxy silane is present at about 0.25-8.0 wt. % of said polyurethane topcoat.
- 3. The metallized article according to claim 1 further comprising an aminosilane.
- 4. The metallized article according to claim 3 having an epoxy silane to aminosilane ratio of about 1:20 to 1:5.
- 5. The metallized article according to claim 4 having an epoxy silane to aminosilane ratio of about 1:10.
- 6. The metallized article according to claim 3 having an epoxy silane to aminosilane ratio of about 20:1 to 5:1.
- 7. The metallized article according to claim 6 having an epoxy silane to aminosilane ratio of about 10:1.
- 8. The metallized article according to claim 1 wherein said substrate comprises a dielectric substrate comprising thermoplastic materials or thermoset materials.
- 9. The metallized article according to claim 8 wherein said thermoplastic material is selected from the group consisting of polyolefins, polyacrylonitrile-butadiene-styrene, poly(vinyl chloride), ionomer resins, polyester, and polyester elastomers.
- 10. The metallized article according to claim 8 wherein said substrate comprises plastic sheet stock.
- 11. The metallized article according to claim 8 wherein said substrate includes an adhesion promoter.
- 12. The metallized article according to claim 1 wherein said substrate comprises a conductive substrate.
- 13. The metallized article according to claim 12 wherein said conductive substrate is selected from the group consisting of aluminum, aluminum alloy, carbon steel, iron, brass, copper, nickel, nickel alloy, stainless steel, magnesium alloy and zinc based materials.
- 14. The metallized article according to claim 12 wherein said conductive substrate includes a corrosion resistant coating.
- 15. The metallized article according to claim 1 wherein said corrosion prone metal disposed on the surface of the base coat are selected from the group consisting of tantalum, copper, silver, nickel, chromium, tin, aluminum and alloys thereof.
- 16. A method for preparing a metallized article comprising the steps of:vacuum metallizing a substrate with a corrosion prone metal to produce a layer of discrete metallic islands on the substrate; forming an epoxy silane modified polyurethane top coat composition; applying the top coat composition to the vacuum metallized substrate to form a top coat layer; and curing the top coat layer, whereupon a urethane polymer is formed and the epoxy silane bonds to the urethane polymer and to the metallic islands.
- 17. The method according to claim 16 further comprising the steps of applying a urethane basecoat composition to the substrate prior to vacuum metallizing the substrate, and curing the base coat.
- 18. The method according to claim 16 wherein the epoxy silane is present to about 0.25-8.0 wt. % of the polyurethane topcoat.
- 19. The method according to claim 16 wherein the top coat is formed further comprising an aminosilane.
- 20. The method according to claim 19 wherein the epoxy silane and the amino silane are present in a ratio of about 20:1 to 5:1.
- 21. The method according to claim 19 wherein the epoxy silane and the aminosilane are present in a ratio of about 1:20 to 1:5.
CROSS REFERENCE TO RELATED CASES
This application is a continuation-in-part of U.S. Application Ser. No. 08/576,072, filed Dec. 12, 1995, now abandoned. This application also relies in part upon U.S. Provisional Application Ser. No. 60/002,812, filed Aug. 25, 1995.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/US97/03333 |
|
WO |
00 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO98/37986 |
9/3/1998 |
WO |
A |
US Referenced Citations (46)
Non-Patent Literature Citations (2)
Entry |
Thin Film Phenomena, Kasturi L. Chopra, Robert E. Kreige Publishing Company, Huntington, N.Y., 1979 p. 163-189. |
Handbook of Thin Film Technology, Leon I. Maissel and Reinhard Glang, McGraw-Hill Book Company, New York, N.Y., 1970 p. 8-32-8-43. |
Provisional Applications (1)
|
Number |
Date |
Country |
|
60/002812 |
Aug 1995 |
US |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
08/576072 |
Dec 1995 |
US |
Child |
09/380440 |
|
US |