Top plate for semiconductor manufacturaing equipment

Information

  • Patent Grant
  • D1016761
  • Patent Number
    D1,016,761
  • Date Filed
    Thursday, June 10, 2021
    3 years ago
  • Date Issued
    Tuesday, March 5, 2024
    9 months ago
Abstract
Description


FIG. 1 is a perspective view of a top plate for semiconductor manufacturaing equipment showing our new design;



FIG. 2 is a front elevational view thereof, the rear elevational view being a mirror image thereof;



FIG. 3 is a right-side elevational view thereof, the left-side elevational view being a mirror image thereof;



FIG. 4 is a top plan view thereof;



FIG. 5 is a bottom plan view thereof;



FIG. 6 is another perspective view thereof;



FIG. 7 is a cross-sectional view taken along a line 7-7 of FIG. 4; and,



FIG. 8 is an enlarged view of portion 8 enclosed by a dot-dot-dash line in FIG. 6.


The broken lines shown are included for the purpose of illustrating portions of the design which form no part of the claimed design. The dot-dash lines indicate the boundary between the claimed portion and forms no part of the claimed design.


Claims
  • The ornamental design for a top plate for semiconductor manufacturaing equipment, as shown and described.
Priority Claims (3)
Number Date Country Kind
2020-026580 D Dec 2020 JP national
2020-026581 D Dec 2020 JP national
2021-011039 D May 2021 JP national
US Referenced Citations (6)
Number Name Date Kind
D404370 Kimura Jan 1999 S
5855680 Soininen Jan 1999 A
8999063 Ito Apr 2015 B2
D827592 Ichino Sep 2018 S
20120263569 Priddy Oct 2012 A1
20210082737 Kim Mar 2021 A1
Foreign Referenced Citations (2)
Number Date Country
2016207932 Dec 2016 JP
D208042 Nov 2020 TW
Non-Patent Literature Citations (1)
Entry
Taiwanese Office Action (TW OA) dated Feb. 25, 2022 issued in Taiwanese patent application No. 110302988 and its English translation.