Claims
- 1. A uniformly shaped snack chip having raised surface features, comprising:
a. from about 12% to about 40% large surface features; b. from about 20% to about 40% medium surface features; and c. from about 25% to about 60% small surface features.
- 2. A uniformly shaped snack chip wherein:
a. the average thickness of the snack chip is from about 1 mm to about 3 mm; b. the average thickness of raised surface features is from about 2.3 mm to about 3.2 mm; c. the maximum thickness of the chip is less than about 5.5 mm; and d. the coefficient of variation of the chip thickness is greater than about 15%.
- 3. The chip of claim 2, wherein the maximum thickness of the chip is from about 3 mm to about 5.5 mm.
- 4. The chip of claim 2, wherein the coefficient of variation of the chip thickness is from about 15% to about 40%.
- 5. The chip of claim 2, wherein the coefficient of variation of the chip thickness is from about 15% to about 40%.
- 6. A uniformly shaped snack piece, wherein the snack piece comprises from about 5 to about 35 surface features per gram of snack piece.
- 7. The snack piece of claim 6, having a surface roughness of from about 1.5 to about 7 mm.
- 8. The snack piece of claim 6, having a bubble wall thickness of greater than about 0.1 mm.
- 9. The snack piece of claim 6, having a total volume occupied by solids greater than about 45%.
- 10. The snack piece of claim 6, having interior voids with a length of from about 1 to about 12 mm, and a height of from about 0.2 to about 2.5 mm.
- 11. The snack chip of claim 1, having:
a. a glass transition temperature of from about 165 to about 275° F. at a snack chip relative humidity of from about 2 to about 4%; b. a glass transition temperature of from about 180 to about 275° F. at a snack chip relative humidity of from about 6 to about 9%; and c. a glass transition temperature of from about 150 to about 235° F. at a snack chip relative humidity of from about 20 to about 30%.
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of priority to U.S. Provisional Application Serial No. 60/207,939, filed May 27, 2000, which is herein incorporated by reference.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60207939 |
May 2000 |
US |