This application claims the priority benefit of Taiwan application serial no. 98131390, filed on Sep. 17, 2009. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of specification.
1. Field of the Invention
The present invention relates to a touch panel, more particularly, to a touch apparatus integrated to a display panel.
2. Description of Related Art
With quick development of technology, touch panels are equipped to a plurality of electronic devices (such as personal digital assistants (PDAs), mobile phones, etc.) for operation convenience. Conventionally, the electronic device having the touch panel can be formed by attaching an independent touch panel and an independent display module. However, considering a fabrication cost, an idea of integrating the touch panel with a display panel of the display module is provided, so as to reduce the fabrication cost of the electronic device having the touch panel.
When the selection line SL receives a selection signal SS, and an upper substrate 101b (which is generally a color filter substrate) of the display panel 101 that is located above the conductive bump CB is pressed by a finger or other medium, since the MOS transistor T is now conducted, a common voltage Vcom received by a conductive layer (which is generally a indium-tin oxide layer) of the upper substrate 101b is transmitted to the readout line RL through the conductive bump CB and the MOS transistor T. Therefore, by determining whether the readout line RL obtains the common voltage Vcom, it can be determined whether the upper substrate 101b of the display panel 101 that is located above the conductive bump CB is pressed.
The present invention provides a touch apparatus integrated to a display panel. The touch apparatus includes an upper substrate and a lower substrate. The lower substrate at least includes a first selection line, a first readout line intersected with the first selection line, a first conductive bump, and a second conductive bump. The first conductive bump is disposed at an intersection of the first selection line and the first readout line, and is electrically connected to the first selection line. The second conductive bump is disposed at the intersection of the first selection line and the first readout line, and is electrically connected to the first readout line. The upper substrate at least includes a first conductive layer without potential, which is disposed above the first and the second conductive bumps. When an external force is exerted to the first conductive layer without potential, the first and the second conductive bumps are electrically connected to each other by the first conductive layer without potential.
In order to make the aforementioned and other features and advantages of the present invention comprehensible, several exemplary embodiments accompanied with figures are described in detail below.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
In the present embodiment, the readout line RL1 is individually intersected with the selection lines SL1 and SL2, and the readout line RL2 is also individually intersected with the selection lines SL1 and SL2. The conductive bump CB1 is disposed at an intersection of the selection line SL1 and the readout line RL1, and is electrically connected to the selection line SL1. The conductive bump CB2 is also disposed at the intersection of the selection line SL1 and the readout line RL1, and is electrically connected to the readout line RL1. Similarly, the conductive bump CB3 is disposed at an intersection of the selection line SL2 and the readout line RL1, and is electrically connected to the selection line SL2. The conductive bump CB4 is also disposed at the intersection of the selection line SL2 and the readout line RL1, and is electrically connected to the readout line RL1.
The conductive bump CB5 is disposed at an intersection of the selection line SL1 and the readout line RL2, and is electrically connected to the selection line SL1.
The conductive bump CB6 is also disposed at the intersection of the selection line SL1 and the readout line RL2, and is electrically connected to the readout line RL2. The conductive bump CB7 is disposed at an intersection of the selection line SL2 and the readout line RL2, and is electrically connected to the selection line SL2. The conductive bump CB8 is also disposed at the intersection of the selection line SL2 and the readout line RL2, and is electrically connected to the readout line RL2.
The conductive layer without potential CL1 is disposed above the conductive bumps CB1 and CB2, and when an external force (for example, by a finger or other medium) is exerted to the conductive layer without potential CL1, the conductive bumps CB1 and CB2 are electrically connected to each other by the conductive layer without potential CL1. Similarly, the conductive layer without potential CL2 is disposed above the conductive bumps CB3 and CB4, and when the external force is exerted to the conductive layer without potential CL2, the conductive bumps CB3 and CB4 are electrically connected to each other by the conductive layer without potential CL2.
The conductive layer without potential CL3 is disposed above the conductive bumps CB5 and CB6, and when the external force is exerted to the conductive layer without potential CL3, the conductive bumps CB5 and CB6 are electrically connected to each other by the conductive layer without potential CL3. The conductive layer without potential CL4 is disposed above the conductive bumps CB7 and CB8, and when the external force is exerted to the conductive layer without potential CL4, the conductive bumps CB7 and CB8 are electrically connected to each other by the conductive layer without potential CL4.
According to the above description, when the selection line SL1 receives the selection signal SS1, and meanwhile a user presses the conductive layer without potential CL1 through a finger or other medium, since the conductive bumps CB1 and CB2 are electrically connected to each other by the conductive layer without potential CL1, the selection signal SS1 is transmitted to the readout line RL1, so that the readout line RL1 obtains the selection signal SS1. Now, if the user does not press the conductive layer without potential CL3 through the finger or other medium, the readout line RL2 does not obtain the selection signal SS1. Therefore, the read mechanism 203 determines that the user now presses the conductive layer without potential CL1 through the finger or other medium according to a fact that the readout line RL1 obtains the selection signal SS1.
On the other hand, when the selection line SL1 receives the selection signal SS1, and meanwhile the user simultaneously presses the conductive layers without potential CL1 and CL3 through the finger or other medium, since the readout lines RL1 and RL2 simultaneously obtain the selection signal SS1, the read mechanism 203 determines that the user now simultaneously presses the conductive layers without potential CL1 and CL3 through the finger or other medium according to a fact that the readout lines RL1 and RL2 simultaneously obtain the selection signal SS1. Similarly, the read mechanism 203 can also determine whether the user presses the conductive layer without potential CL3 and/or the conductive layer without potential CL4 through the finger or other medium according to whether the readout line RL1 and/or the readout line RL2 obtain/obtains the selection signal SS2, and detailed descriptions thereof are not repeated.
In the present embodiment, it is assumed that the conductive layer with potential CE respectively surrounds the conductive layers without potential CL1-CL4 in the same plane, and is not electrically connected to the conductive layers without potential CL1-CL4, though in another embodiment of the present invention, as shown in
Accordingly, two conductive bumps are disposed at the intersection of the selection line and the readout line to electrically connect with the selection line and the readout line, respectively, and a conductive layer without potential is disposed above the two conductive bumps. By such means, once the selection line receives the selection signal, by determining whether the readout line obtains the selection signal, it can be determined whether the conductive layer without potential that is disposed above the two conductive bumps is pressed. Therefore, compared to the conventional technique, the structure of the touch panel of the present invention is quite simple, and a method for detecting a touch operation is also simple. Moreover, since a technique of detecting the touch operation of the present invention is to determine whether the conductive layer without potential is electrically connected to the conductive bumps, almost no power is consumed during the process of detecting the touch operation, so that a power consumption of the applied electronic/touch apparatus can be reduced.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Number | Date | Country | Kind |
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98131390 | Sep 2009 | TW | national |