This application claims the priority benefit of Taiwan application serial no. 102102028, filed on Jan. 18, 2013. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
1. Field of the Application
The invention relates to a touch panel, and more particularly, to a touch panel disposed with a light resistant layer.
2. Description of Related Art
Input interfaces for many information products have been transformed from the traditional devices, such as keyboard or mouse, to touch devices. Therefore, the touch panel has been subjected to a wide range of applications. Generally, in order to transmit signals generated by an operation of a user using the touch panel, a plurality of wires are usually required and preferably disposed at a peripheral region of the touch panel. In order to avoid the wires be exposed on the outside of the touch panel thereby improving an overall appearance of device, a decoration layer is commonly disposed around the touch panel for concealing these wires.
The decoration layer constructed for concealing these wires merely covers a portion of the surface of a substrate of the touch panel, so that the decoration layer is a bulge structure. Although using the decoration layer in a conventional process may conceal the wires, an adverse influence on a production of touch sensor electrodes is caused by the bulge structure of the decoration layer, or the material characteristics of the decoration layer. For example, in general, lithography and etching are used to pattern a conductive material for constructing the touch sensor electrodes; however, the amount of exposure on a photoresist pattern having a bulge structure may be unable to be well controlled. Moreover, when the conductive material is deposited continuously on the bulge structure and the substrate, an elevation difference and a slope between the bulge structure and the substrate may also affect a crystalline density of the conductive material to become uneven, and thereby problems, such as an over etching phenomenon and even an etching disconnection, may prone to occur near a junction of the bulge structure and the substrate. As shown in
The invention provides a touch panel capable of providing an easily patterned conductive element structure for enhancing a production yield of the touch panel.
A touch panel of the invention includes a substrate, a decoration layer and a plurality of conductive elements. The decoration layer is disposed on at least one side of the substrate and has an outer margin and an inner margin. The outer margin is closer to an edge of the substrate than the inner margin, and the inner margin is opposite to the outer margin. The inner margin is located between a reference line and the outer margin, and the reference line is at least 20 μm away form the inner margin. The conductive elements are disposed on the substrate, and include at least two cross-interface portions covering the decoration layer and a region on the substrate without the decoration layer. In a region outward of the reference line to the outer margin of the decoration layer, a distance between two cross-interface portions adjacent to each other includes a first distance, and in a region inward of the reference line towards a central direction of the substrate, a distance between two cross-interface portions adjacent to each other includes a second distance, and the first distance is greater than the second distance. The conductive elements at least construct a plurality of touch sensing units, and each touch sensing unit is used to form a capacitance coupling.
Another touch panel of the invention includes a substrate, a decoration layer and a plurality of conductive elements. The decoration layer is disposed on at least a side of the substrate. The decoration layer has a multi-layer structure, and an outermost lost layer structure away from the substrate in the multi-layer structure has an outer margin and an inner margin. The outer margin is closer to an edge of the substrate than the inner margin. Wherein, the inner margin is located between the outer margin and a reference line, and the reference line is at least 20 μm apart from the inner margin. The conductive elements are disposed on the substrate, and include at least two cross-interface portions. The cross-interface portions cover the decoration layer and a region on the substrate without the decoration layer. In a region outward of the reference line to the outer margin of the decoration layer, a distance between two cross-interface portions adjacent to each other includes a first distance, and in region inward of the reference line towards a central direction of the substrate, a distance between two cross-interface portions adjacent to each other includes a second distance, and the first distance is greater than a second distance. The conductive elements at least construct a plurality of touch sensing units, and each touch sensing unit is adapted to be used to form a capacitance coupling.
Yet another touch panel of the invention includes a substrate, a light resistant layer and a plurality of conductive elements. The light resistant layer is disposed on the substrate to form a budge structure, and the light resistant layer includes at least one layer structure. The conductive elements are disposed on the substrate, and include at least two cross-interface portions covering the light resistant layer and a region on the substrate without the light resistant layer. The at least one layer structure of the light resistant layer includes a contacting surface contact with the cross-interface portions, and an interaction between the contacting surface and the cross-interface portions is greater than an interaction between the substrate and the cross-interface portions. At least in a coverage of the contacting surface, a distance between two cross-interface portions adjacent to each other is greater than or equal to 35 μm. The conductive elements at least construct a plurality of touch sensing units, and each touch sensing unit is adapted to be used to form a capacitance coupling.
According to the foregoing, in the invention, the interval between the cross-interface portions of the conductive elements is adjusted, so that the two cross-interface portions adjacent to each other contacted on the decoration layer (light resistant layer) have a sufficient spacing therebetween. Therefore, even if the conductive elements is continuously deposited on both of the substrate and the bulge decoration layer (light resistant layer), a short-circuit due to a film residual phenomenon is not prone to occur between the cross-interface portions adjacent to each other, or, a disconnection of the cross-interface portions is avoided from occurring near the inner margin of the decoration layer (light resistant layer). Namely, the touch panel of the embodiment of the invention may ensure an electrical independence of each conductive pattern while having an ideal quality. At the same time, a configuration of the decoration layer (light resistant layer) may also be used to conceal elements in the device which are not wanted to be seen or light and thereby beautify an appearance of the touch panel.
In order to make the aforementioned and other features and advantages of the present application more comprehensible, several embodiments accompanied with figures are described in detail below.
The accompanying drawings are included to provide a further understanding of the application, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.
In terms of a touch device integrated with display function, the touch panel 100 may have a light transmissive region and a light resistant region. The light transmissive region is corresponded to a display element such as a liquid crystal display element or an organic light-emitting diode display device, and the light resistant region is corresponded to a region disposed with non-display elements that requires to be concealed, and this type of elements, for example, may be the visible connecting wires 132. In order to achieve a maximization of a display region in an electronic device, demands for a narrow border has growingly increased, in which the visible connecting wires 132 are usually disposed at a peripheral region of the substrate 110. Even more, the visible connecting wires 132 can be only disposed on one of the sides of the substrate 110. Based on the same factors, the light resistant region is also usually configured in at least one side of the touch panel 100 so as to be corresponded to the decoration layer 120 located on at least one side of the substrate 110. The decoration layer 120 is made of a light resistant material, which is defined as a material deemed to render a light lost when the light passes through an interface thereof, up to and including complete opacity, and is used to conceal elements or light not wanted to be seen. For example, light resistant material may be a substantially opaque material, or a light-absorbing but translucent material such as a coated or painted material. Moreover, when a surface of a region disposed with the decoration layer 120 on the substrate 110 has a difference in elevation with a surface of an adjacent region of the substrate 110, the region disposed with the decoration layer 120 may be referred to as a thick portion, and the adjacent region may be referred to as a thin portion.
The conductive elements 130 are disposed on the substrate 110 and the decoration layer 120, thereby include at least two cross-interface portions 131A covering the decoration layer 120 and a region on the substrate 110 without the decoration layer 120. As shown in
In the present embodiment, the decoration layer 120 may have an inner margin 122 and an outer margin 124 opposite to the inner margin 122 and adjacent to an edge of the substrate 110. A reference line L may be defined as being from the inner margin 122 with a distance d1 of at least 20 μm towards a center of the substrate 110; that is, the inner margin 122 is located between the reference line L and the outer margin 124, and the reference line L is at least 20 μm apart from the inner margin 122. A distance between the two cross-interface portions 131A adjacent to each other at a region extended outward of the reference line L includes a first distance G1, and at a region extended inward of the reference line L includes a second distance G2, wherein the first distance G1 is greater than the second distance G2. As such, electrical independence between the cross-interface portions 131A may certainly be maintained in a patterning process of forming the conductive elements 130. In all embodiments of the invention, a direction outward of the reference line L is referred to a direction from reference line L towards the outer margin 124 of the decoration layer 120, and a direction inward of the reference line L is referred to a direction from the reference line L towards the center of the substrate 110.
As shown in
In the present embodiment, the decoration layer 120 may be a black decoration layer 120a, wherein compositions of the black decoration layer 120a may include carbon black, chromium or chromium oxide, 3-methoxybutyl acetate, cyclohexanone, n-butyl acetate, propyleneglycol monomethyl ether acetate, acrylic resin and crosslinking agent, but the invention is not limited thereto. A conductive material constructing the conductive elements 130 may be deposited in the thick portion (the region with decoration layer 120) and the thin portion (the region without the decoration layer 120) via sputtering, but is not limited to, and when an interaction, such as acting force, between the conductive material and the decoration layer 120 is strong, for example, when the material of the conductive elements 130 includes indium tin oxide and the decoration layer 120 is the black decoration layer 120a, a surface energy of the black decoration layer 120a may enable a better adhesion between the black decoration layer 120a and the indium tin oxide. Therefore, in the process of forming the conductive elements 130 by patterning the conductive material, the conductive material predetermined to be removed is prone to occur an incomplete etching phenomenon, thus causing part of the conductive material to remain on the black decoration layer 120a. In order to avoid the residual conductive material from causing a short-circuit between the conductive elements 130 adjacent to each other, in the touch panel 100 of the present invention, the first distance G1 is required to be wide enough so as to provide enough line impedance between adjacent conductive elements 130 predetermined to be insulated from each other.
In one embodiment, when an inner region extended inward of the reference line L is disposed corresponding to a display area of a display panel, in order to prevent a user from being aware of the existence of the second distance G2, a size of the second distance G2 may be designed as at least maintaining the separation between the conductive elements 130, and often not greater than 30 μm. However, when the two cross-interface portion 131A adjacent to each other configure at the location of the decoration layer 120 with the aforementioned interval size, the short-circuit between the conductive elements 130 is most likely to be generated due to part of the conductive material is remained at the thicker photoresist portion or due to the conductive material is uneasy to be removed from the black decoration layer 120a. Therefore, the design of the present embodiment renders the first distance G1 to be greater than the second distance G2, and even renders the first distance G1 to be greater than 35 μm, so as to effectively avoid the conductive material from improperly remaining on the decoration layer 120 or a region nearby the inner margin 122 of the decoration layer 120 that cause a short-circuit between the conductive elements 130.
Moreover, in the present embodiment, a maximum size of the first distance G1 may be determined from a pitch P130 of the conductive elements 130 at an outer side the reference line L and a size of a linewidth W132 of the connecting wires 132. For example, the size of the first distance G1 may be increased to not greater than a value of subtracting the linewidth W132 from the pitch P130. Namely, in an embodiment, the pitch P130 of the conductive elements 130 may be equal to a total sum of the linewidth W132 and the first distance G 1. Now, a width of each conductive element 130 at the region outside of the reference line L is substantially equal to the linewidth W132 of the connecting wires 132.
In some embodiments, the touch panel 100 may further include a plurality of separated insulating patterns 250 disposed between the conductive elements 130 and the decoration layer 120, so as to separate the decoration layer 120 and the interval between the two adjacent cross-interface portions 131A at the outward of the reference line L. Compositions of the insulating patterns 250 may include 3-methoxybutyl acetate, cyclohexanone, n-butyl acetate, propyleneglycol monomethyl ether acetate, acrylic resin and crosslinking agent, but not limited to such compositions, and the insulating patterns 250 also may be mainly made of other inorganic or organic insulating materials. In the present embodiment, an interaction between the conductive material, which is the material of the conductive elements 130, and the insulating patterns 250 can be less than an interaction between the decoration layer 120 and the conductive material. For example, an adhesion force between the insulating patterns 250 and ITO is less than an adhesion force between the decoration layer 120 and ITO; however, the insulating patterns 250 may still enable ITO to be effectively adhered for the process of depositing ITO thereon. Therefore, in the present embodiment, the configuration of the insulating patterns 250 may reduce a condition of having an incomplete etching when conductive material is patterned to construct the conductive elements 130, so as to ensure the electrical independence between the conductive elements 130 in need of electrical insulation.
Moreover, in some embodiments, as shown in
In the present embodiment, a reference line L similar to the one shown in
Structures of the conductive elements 230 and the decoration layer 120 in the above embodiment are only provided as example for the description purposes, and the invention is not limited thereto. For example,
The insulating layer 350 may be an anti-reflective optical film, in which the anti-reflective optical film may selectively cover the conductive elements 330 or be disposed between the conductive elements 330 and the substrate 310, and are mainly used for improving an optical uniformity, so as to reduce a visibility of the touch sensing units 331. Therefore, the anti-reflective optical film 350 is at least disposed at a transmissive region of the touch panel 300. In an embodiment, the anti-reflective optical film 350 may be an insulating material having refractivity similar to that of a conductive material used to make the touch sensing units 331. In an embodiment, the anti-reflective optical film 350 may be a multi-layer structure covering the conductive elements 330, in which a refractivity of each layer of the multi-layer structure becomes lower as being closer to the substrate 310. In another embodiment, every two layers of the multi-layer structure have a refractivity change of low-high or high-low, and two of the layers being close to the touch sensing units 331 have a refractivity change of low-high-low or high-low-high with the touch sensing units 331. For example, the anti-reflective optical film 350 may be a two-layer structure, wherein a material of one layer thereof disposed on the touch sensing units 331 is silicon dioxide (SiO2) with a refractivity lower than that of the touch sensing units 331, and material of the other layer thereof disposed on the silicon dioxide is silicon nitride (SiNx) with a refractivity higher than that of the silicon dioxide. Moreover, when the anti-reflective optical film 350 is the multi-layer structure, a planarization effect may be provided so as to facilitate the subsequent fabrication or combination of other stacked layers. A material of the anti-reflective optical film 350 may be selected from alumina (Al2O3), niobium oxide (Nb2O5), titanium dioxide (TiO2), silicon nitride, silicon oxynitride, silicon dioxide, high refraction photoresist organic insulating material, high refraction hard coat or other transparent insulating material, and a laminated combination thereof, but not limited thereto. The protective layer 360 at least covers the connecting wires 332 made of conductive material with low electrical resistance, and is mainly used to avoid the connecting wires 332 oxidation. The protective layer 360, for example, may be made of an insulating material, such as organic insulating material, but the invention is not limited thereto.
As in contrast with the decoration layer 120, which is the single-layer structure, of the first embodiment, the decoration layer 320 of the present embodiment has a multi-layer structure, and an innermost layer structure thereof is an observed decoration layer, and in an outermost layer structure, a light shading material is included thereof. Wherein, the outermost layer structure is being referred to the structure in the decoration layer 320 most away from the substrate 310. The light shading material may include carbon black, chromium oxide, or other light resistant material with optical density larger than 3 and resistivity larger than 106 ohm-m, but the invention is not limited thereto. In the present embodiment, the decoration layer 320 includes a black decoration layer 322 and a non-black decoration layer 324, wherein the black decoration layer 322 is the outermost layer structure of the decoration layer 320 far away from the substrate 310, and the non-black decoration layer 324 is located between the black decoration layer 322 and the substrate 310. The non-black decoration layer 324, starting from the substrate 310, sequentially includes a first white decoration layer 324A, a second white decoration layer 324B and a third white decoration layer 324C.
The black decoration layer 322 is mainly used for enhancing a light shading ability, and the compositions thereof are as described in the previous embodiment; and it is to be noted that, the color of the outermost layer structure of the decoration layer 320 in the present invention is not limited to black. Moreover, in an embodiment, the outermost layer structure of the decoration layer 320 further provides an effect of planarizing a surface of the decoration layer 320. The non-black decoration layer 324 may be a non-black light resistant ink, but not limited thereto. In other embodiments, the multi-layer structure of the decoration layer 320 includes at least two layer structures having different colors substantially in contrast with each other, such as black stacked with white or gray stacked with white, etc. The first white decoration layer 324A, the second white decoration layer 324B and the third white decoration layer 324C may be made of different materials or a same material, and compositions thereof may include titania, powder, resin and diluent, but not limited thereto. In the present embodiment, the first white decoration layer 324A and the third white decoration layer 324C commonly encapsulate the second white decoration layer 324B. Namely, these white decoration layers 324A, 324B, 324C arranged according to the size of widths, from large to small, are the first white decoration layer 324A, the third white decoration layer 324C and the second white decoration layer 324B, sequentially. Certainly, the invention is not limited to the stacking structure of the non-black decoration layer 324. In other embodiments, the non-black decoration layer 324 may adopt a single-layer structure or a multi-layer stacking structure according to different design requirement. Moreover, the black decoration layer 322 may also selectively be constructed by a multi-layer stacking structure.
In the present embodiment, the conductive elements 330 are disposed on the substrate 310 and the decoration layer 120, and include a plurality of first inductive series 331A and a plurality of second inductive series 331B. The first inductive series 331A and the second inductive series 331B are electrically independent from each other. Each first inductive series 331A includes a plurality of first electrodes E1 and a plurality of bridge electrodes B1, and each second inductive series 331B includes a plurality of second electrodes E2 and a plurality of connecting electrodes B2. In order to reduce impedance, the bridge electrodes B1 may be high temperature deposited indium tin oxide or narrow metal wires for connecting the first electrodes E1 in series along a first direction D1. Moreover, the connecting electrodes B2 connect the second electrodes E2 in series along a second direction D2, and the first direction D1 intersects the second direction D2. The first electrodes E1 and the second electrodes E2 adjacent to each other may form capacitance couplings for constructing the touch sensing units 331. Through the touch sensing units 331, when a conductive object, such as finger, approaches to or contacts with an operating surface of the substrate 310 opposite to the surface where the conductive elements 330 is disposed, coupling capacitances between the object and the touch sensing units 331 will establish, thereby cause a change in capacitance effects to detect the position of the object or the motion of the object by a self capacitance measurement method or a mutual capacitance measurement method. Furthermore, a first insulating pattern 336 is disposed at each intersection of the first inductive series 331A and the second inductive series 331B, so that the first inductive series 331A and the second inductive series 331B are electrically independent of each other. Herein, the first electrodes E1 and the second electrodes E2, for example, are taken as diamond structures for an illustration purpose, but the invention is not limited thereto.
The conductive elements 330 include at least two cross-interface portions 333 covering the decoration layer 320 and a region on the substrate 310 without the decoration layer 320. In the present embodiment, the cross-interface portion 333 may be a terminal end of the first inductive series 331A or a terminal end of the second inductive series 331B. Or, the terminal end of the first inductive series 331A and the terminal end of the second inductive series 331B are both the cross-interface portions 333. In other words, the cross-interface portions 333 may construct a portion of the first inductive series 331A and a portion of the second inductive series 331B where are most close to the decoration layer 320. In the present embodiment, the decoration layer 320 is disposed on the periphery of the substrate 310, and it is to be understood that, even though
Of solving the aforementioned problem, the present embodiment further defined a reference line L′, which is located at a distance d1 of at least 20 μm apart from an inner margin 322A of the outermost layer structure of the decoration layer 320 and towards to the center of the substrate 310. A distance between two adjacent cross-interface portions 333 may include a first distance G1 outward of the reference line L′ and a second distance G2 inward of the reference line L′. The first distance G1 is greater than the second distance G2; or, the first distance G1 is greater than 35 μm. As such, in the process of fabricating the conductive elements 330, the electrical independence is ensured to be maintained between the cross-interface portions 333. In the present embodiment, the first distance G1 of the two adjacent cross-interface portions 333 is defined by two adjacent first electrodes E1 located at the terminal end of each series disposed on the outermost layer structure of the decoration layer 320; moreover, the second distance G2 of the two adjacent cross-interface portions 333 is then defined by a first electrode E1 and a second electrode E2 adjacent to each other. Namely, in the present embodiment, the two electrodes defining the first distance G1 may be different from the two electrodes defining the second distance G2. In the present invention, it is mainly to adjust the distance between the adjacent cross-interface portions 333 at different locations, so as to avoid an occurrence of adverse effects during the deposition or the patterning processes of the conductive material.
In the present embodiment, the non-black decoration layer 324 has a portion located at an inner side 304 of the reference line L′ and the other portion located at an outer side 302 of the reference line L′, but the invention is not limited thereto. In other embodiments, the non-black decoration layer 324 may completely be located in the outer side 302 of the reference line L′, or an inner margin of the non-black decoration layer 324 may be aligned to the reference line L′. According to the same reason as the previous embodiment, the size of the second distance G2 of the present embodiment may be designed as to at least maintaining the separation of the conductive elements 330, but not greater than 30 μm. Moreover, in the present embodiment, as shown in
When the touch panel 300 is fabricated with the components, such as the decoration layer 320 and the conductive elements 330, on the substrate 310 after the substrate 310 is cut into a predetermined size, the edge of the decoration layer 320 and the edge of the substrate 310 may be aligned with each other, but the invention is not limited thereto. For example,
A fabricating method of the touch panel 400, for example, is to firstly fabricate the components, such as the decoration layer 420, the conductive elements 330, the anti-reflective optical film 350 and the protective layer 360, on a mother substrate. Next, the mother substrate formed with the aforementioned components is cut into a required size, so as to form the substrate 310 having the aforementioned components thereon. However, a sidewall 312 of the substrate 310 may become relatively fragile due to the steps of cutting and splitting. Therefore, in the present embodiment, the strengthening layer 430 is disposed on the sidewall 312 of the substrate 310 for enhancing the strength of the substrate 310. The strengthening layer 430 may include a material such as UV resin or resin mixed with glass fiber and/or carbon nanotube, but the invention is not limited thereto.
Moreover, an edge 422, also called as the outer margin in the other embodiment, of the decoration layer 420 and an edge 314 of the substrate 310 may be separated with a gap d2 apart. Since the gap d2 usually does not correspond to a display region of a display element, in order to avoid a leakage of light through this gap d2 and to provide a more favorable display quality, or in order to have a more ideal appearance, the light shielding layer 440 at least covers a region between the edge 422 of the decoration layer 420 and the edge 314 of the substrate 310, namely, covers across the gap d2. In addition, the light shielding layer 440 may further partially or completely cover on the strengthening layer 430, so as to provide a more favorable light leakage preventing effect.
In the present embodiment, the light resistant layer 520 has a multi-layer structure, and an interaction between an outermost layer structure 522 and a cross-interface portions 530A is stronger than an interaction between each of the rest layers of the light resistant layer 520 and the cross-interface portions 530A and between the substrate 310 and the cross-interface portions 530A. In some embodiments, the interaction, such as adhesion, may be varied due to process of different conditions; for instance, a high temperature process may cause the outermost layer structure 522 to have a much stronger adhesion exerted to the conductive material. According to the above, since the light resistant layer 520 constructs a bulge structure on the substrate 310 and has a heterogeneous material (the outermost layer structure 522 of the present embodiment) that exerts a stronger interaction to the cross-interface portions 530, in the depositing and patterning processes of the conductive material, the previously described defects, such as a short-circuit phenomenon or an etching disconnection, are all possible to occur. Therefore, in the present embodiment, within a distribution range of the light resistant layer 520, at least within a range of the cross-interface portions 530A contacted with the outermost layer structure 522 of the light resistant layer 520, a distance between the two adjacent cross-interface portions 530A is greater than or equal to 35 μm. In a favorable embodiment, starting from a point, which is at least 20 μm inward of an inner margin of the outermost layer structure 522 of the light resistant layer 520, to an outer margin of the outermost layer structure 522, a distance G1 between the two adjacent cross-interface portions 530A is greater than or equal to 35 μm.
Specifically, the conductive elements 530, for example, include a plurality of first inductive series, a plurality of second inductive series and a plurality of auxiliary electrodes 536. Referring to
Specifically, in
In some embodiments, as shown in
In the present embodiment, the light resistant layer 620 is made of a heterogeneous material with a single-layer structure, an interaction between the heterogeneous material and the cross-interface portions 630A is stronger than an interaction between the substrate 610 and the cross-interface portion 630A. For example, a material of the cross-interface portions 630A may be indium tin oxide, and the heterogeneous material may be a black decoration layer with a stronger adhesion with the indium tin oxide. As mentioned above, since the light resistant layer 620 constructs a bulge structure on the substrate 610 and has the heterogeneous material that form a stronger interaction with the cross-interface portions 630A, in the depositing and patterning processes of the conductive material, the previously described defects, such as short-circuit or etching disconnection, are all possible to occur. Therefore, in the present embodiment, within a distribution range of the light resistant layer 620, at least within a range of the cross-interface portions 630A contacted with the light resistant layer 620, a distance between the adjacent two cross-interface portions 630A, for example, as a distance D13 shown in
Specifically, the conductive element 630 includes a plurality of first electrodes 631A, a plurality of second electrodes 632A and a plurality of connecting wires 633. The first electrodes 631A may be connected into series having a same extending direction. In the present embodiment, the connecting wires 633 are respectively and electrically connected to the second electrodes 632A and the first electrodes 631A, and the first electrodes 631A and the second electrodes 632A are electrically insulated with each others. The first electrodes 631A and the second electrodes 632A adjacent thereof may form capacitance couplings and construct the touch sensing units 630B. Moreover, a shielded wire 634A connected to a reference potential may be disposed between the touch sensing units 630B of different serial groups. In the present embodiment, each connecting wire 633 may be correspondingly connected to one of second electrodes 632A to output signals. Furthermore, the connecting wire 633 may correspondingly connect to the series constructed by each first electrode 631A to transmit the signals.
The cross-interface portions 630A of the connecting wires 633 may include at least one bent portion 633B, and each bent portion 633B is disposed at the region on the substrate 610 without the light resistant layer 620, so that, among the connecting wires 633, a minimum distance W1 between the two outermost connecting wires 633 on the light resistant layer 620 is greater than a minimum distance W2 between the two outermost connecting wires 633 at the region on the substrate 610 without the light resistant layer 620. In one of the embodiments, N amounts of the touch sensing units 630B construct a same serial group, and a minimum width of the connecting wires 633 is M μm, whereas a distance from the bent portion 633B farthest away from an inner margin of the light resistant layer 620 to the inner margin of the light resistant layer 620 is at least N multiplied by M μm. As illustrated in
As shown in
In some embodiments, in order to more effectively address the various problems caused by the bulge structure and material of the light resistant layer 620, the conductive material for making the conductive elements 630 may be deposited on a same material and then perform the subsequent etching. For example, a touch panel 700, as disclosed in
In summary, the touch panel in the embodiments of the invention has the cross-interface portions of the conductive elements separating at least a predetermined interval in the portion in contact with the light resistant layer (decoration layer). As a result, the short-circuit problem caused by the poor patterning of the conductive elements due to the bulge structure of the decoration layer (light resistant layer) or the etching disconnection problem due to the uneven deposition of the conductive material may all be solved. Therefore, the touch panel in the embodiments of the invention may have the ideal quality.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the application without departing from the scope or spirit of the application. In view of the foregoing, it is intended that the application cover modifications and variations of this application provided they fall within the scope of the following claims and their equivalents.
Number | Date | Country | Kind |
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102102028 | Jan 2013 | TW | national |