Patent Application
20140131188
The present application claims priority under 35 U.S.C. §119 of Japanese Patent Application No. 2012-249827 filed on Nov. 14, 2012, the disclosure of which is expressly incorporated by reference herein in its entity.
1. Technical Field
The invention relates to capacitive touch sensors and methods of manufacturing the touch sensors.
2. Background Art
A conventional touch sensor of this kind is disclosed in WO2010/095797. This touch sensor includes a plurality of layers and an optically clear adhesive for bonding the layers.
In recent years, touch sensors have been used for increasing range of uses, and there have been demands for use under harsh environments, such as under high-temperature environments (e.g. in a car having an internal temperature of 50 degrees or higher) and under a condition that the touch sensor is bent in a curved shape. Touch sensors used under such harsh environments are subject to increased stress factors, such as differences in shrinkage ratio between layered members, differences in residual stress between the layers, and outgassing from the layers.
In the above conventional touch sensor, the layers are bonded together only with an optically clear adhesive. The above stress factors exerted on the layers over time may cause delamination because the optically clear adhesive may not be able to provide the layers with a sufficient level of bonding strength therebetween.
In view of the above circumstances, the invention provides a touch sensor having layers with improved bonding strength therebetween. The invention also provides a method of manufacturing the touch sensor.
A touch sensor according to an aspect of the invention includes first and second layers and a first welding layer. The first and second layers are laminated together. The first welding layer is provided between the first and second layers and welding the first and second layers together at least partially.
In the touch sensor of this aspect of the invention, the first welding layer welds the first and second layers together at least partially, increasing the bonding strength between the first and second layers. Therefore, the invention can reduce the possibility of delamination of the first and second layers even if used under a harsh environment.
At least one layer of the first and second layers may be a plastic layer. The first welding layer may be made from a portion of the one layer that has melted and then solidified to weld the one layer at least partially to the other layer of the first and second layers.
In the touch sensor of this aspect, one and the other layers are welded together utilizing a portion of the one layer, leading to a reduced number of components and welding steps.
The touch sensor may further include an electrode layer provided between the first and second layers.
The electrode layer may include a meshed or fibrous electrode including interstices. The first welding layer may weld to the other layer through the interstices of the electrode.
In the touch sensor of this aspect, the first welding layer welds to the other layer through the interstices of the electrode. Therefore, the bonding strength between the first and second layers will not be adversely affected by providing the electrode layer between the first and second layer.
The touch sensor may further include a third layer and a second welding layer. The third layer may be laminated to the second layer. The second welding layer may be provided between the second and third layers and welding the second and third layers together at least partially.
In the touch sensor of this aspect, the second and third layers are welded together at least partially by the second welding layer, leading to an improved bonding strength between the second and third layers. Therefore, this aspect of the invention can reduce the possibility of delamination of the second and third layers even if used under a harsh environment.
At least one layer of the second and third layers may be a plastic layer. The second welding layer may be made from a portion of the one layer of the second and third layers that has melted and then solidified to weld the one layer at least partially to the other layer of the second and third layers.
In the touch sensor of this aspect, one and the other layers are welded together utilizing a portion of the one layer, leading to a reduced number of components and welding steps.
The second layer may be a buffer layer made of a plastic material more suitable to be welded to the first and third layers than to weld the first and third layers together. The first welding layer may be made from a portion of the buffer layer that has melted and then solidified to weld the buffer layer to the first layer. The second welding layer may be made from another portion of the buffer layer melted and then solidified to weld the buffer layer to the third layer.
In the touch sensor of this aspect, the first layer and the third layer, if having poor welding compatibility with each other, can bond to each other through the second layer.
The buffer layer may be made of a thermoplastic plastic material having a melting point lower than those of the first and third layers.
In the touch sensor of this aspect, a portion of the buffer layer melts before the first layer and the third layer do. This configuration can reduce thermal damage to the first and third layers during the welding process.
The third layer may be a cover panel layer or a reinforcing layer.
The second layer may be a protective layer to protect the electrode layer.
In the touch sensor of this aspect, the protective layer covering the electrode layer can prevent the electrode layer from directly contacting a welding machine during the welding process. Therefore, the electrode layer is less likely to be physically damaged during the welding process.
The first layer may be a cover panel layer.
At least one of the first, second, and third layers may be in film shape.
The first and second layers may have translucency. The first, second, and third layers may have translucency.
A method of manufacturing a touch sensor according to the invention includes laminating a first and second layers together, at least one layer of the first and second layers being a plastic layer, and welding the one layer at least partially to the other layer of the first and second layers by melting and then solidifying a portion of the one layer.
In the manufacturing method of this aspect, a portion of the one layer of the first and second layers melts and then solidifies to weld the one layer to the other layer at least partially, so that the bonding strength between the first and second layers is improved. Therefore, the method of this aspect can reduce the possibility of delamination of first and second layers even if used under a harsh environment. Further advantageously, one and the other layers are welded together utilizing a portion of the one layer, leading to a reduced number of components and welding steps.
The method may further include placing the laminated first and second layers in a die, and injection-molding a plastic material on the second layer in the die to laminate a third layer on the second layer. The welding of the one layer at least partially to the other layer may include melting the portion of the one layer of the first and second layers by use of heat and pressure during the injection molding process and solidifying the melted portion of the one layer.
In the manufacturing method of this aspect, while the third layer is molded on the second layer, the first and second layers can be welded. Thus, the number of the welding steps of the touch sensor can be reduced.
The method may further include forming an electrode layer on one of the first and second layer prior to the laminating of the first and second layers together.
The electrode layer may include a meshed or fibrous electrode including interstices. The welding of the one layer at least partially to the other layer may include bonding the melted portion of the one layer to the other layer through the interstices of the electrode and then solidifying the melted portion of the one layer.
In the manufacturing method of this aspect, the bonding strength between the first and second layers will not be adversely affected by providing the electrode layer between the first and second layer.
One layer of the second layer and a third layer may be made of a plastic material. The method may further include laminating the third layer on the second layer and welding the one layer at least partially to the other layer of the second and third layers by melting and then solidifying a portion of the one layer.
In the manufacturing method of this aspect, the second and third layers are welded together utilizing a portion of one of these layers, leading to a reduced number of components and welding steps.
The second layer may be a buffer layer made of a plastic material more suitable to be welded to the first and third layers than to weld the first and third layers together.
The manufacturing method of this aspect can weld the first and third layers together if they have poor welding compatibility with each other.
The buffer layer may be made of a thermoplastic plastic material having a melting point lower than those of the first and third layers.
In the manufacturing method of this aspect, a portion of the buffer layer melts before the first and third layers do. The method can therefore reduce thermal damage to the first and third layers during the welding process.
The second layer may be a protective layer to protect the electrode layer. In the manufacturing method of this aspect, the protective layer covering the electrode layer can prevent the electrode layer from directly contacting a welding machine during the welding process. Therefore, the electrode layer is less likely to be physically damaged during the welding process.
The first layer may be a cover panel layer. The third layer may be a cover panel layer or a reinforcing layer.
The following discusses first and second embodiments of the invention.
First, a touch sensor T according to the first embodiment of the invention will be described with reference to
The base layer 100 as shown in
As shown in
The first welding layer 500a is made from a portion of the base layer 100 and a portion of the buffer layer 200a (i.e. respective portions of these layers contacting each other) that melt, get into interstices 411a or 412a of electrodes 410a of the electrode layer 400a (to be described), bond to the base layer 100 and the buffer layer 200a, and then solidify. The first welding layer 500a welds the entire surface areas of the base layer 100 and the buffer layer 200a.
As shown in
As shown in
The second welding layer 600a is made from a portion of the buffer layer 200a and a portion of the cover panel layer 300a (i.e. respective portions of these layers contacting each other) that melt, bond to the buffer layer 200a and the cover panel layer 300a, and then solidify. The second welding layer 600a welds the entire surface areas of the buffer layer 200a and the cover panel layer 300a.
The protective layer 200b is laminated to the second face 120 of the base layer 100 and welded to the base layer 100 by the first welding layer 500b. The protective layer 200b is a flexible transparent film of a plastic material such as polymer. The protective layer 200b covers and protects the electrode layer 400b.
The first welding layer 500b is made from a portion of the base layer 100 and a portion of the protective layer 200b (i.e. respective portions of these layers contacting each other) that melt, get into interstices of electrodes 410b of the electrode layer 400b (to be described), bond to the base layer 100 and the protective layer 200b, and then solidify. The first welding layer 500b welds the entire surface areas of the base layer 100 and the protective layer 200b.
As shown in
As shown in
The second welding layer 600b is made from a portion of the protective layer 200b and a portion of the reinforcing layer 300b (i.e. respective portions of these layers contacting each other) that melt, bond to the protective layer 200b and the reinforcing layer 300b, and then solidify. The second welding layer 600b welds the entire surface areas of the protective layer 200b and the reinforcing layer 300b.
The touch sensor configured as described above may be manufactured in the following steps and as illustrated in
The next step is to prepare the buffer layer 200a. The buffer layer 200a is laminated on the first face 110 of the base layer 100, so that the electrode layer 400a is located between the base layer 100 and the buffer layer 200a. The next step is to weld the base layer 100 and the buffer layer 200a together using a welding machine. It should be recalled here that the buffer layer 200a is made of a plastic material having a melting point lower than that of the base layer 100. Accordingly, the portion of the buffer layer 200a in contact with the base layer 100 melts, and then the portion of the base layer 100 in contact with the buffer layer 200a melts. Then, both the melted portions come into contact with each other through the interstices 411a or 412a of the electrodes 410a of the electrode layer 400a, and then they solidify. The solidified portion becomes the first welding layer 500a. The first welding layer 500a is thus bonded to the base layer 100 and the buffer layer 200a, with the electrode layer 400a embedded in the first welding layer 500a.
The next step is to prepare the cover panel layer 300a. The cover panel layer 300a is laminated on the buffer layer 200a. Then, the buffer layer 200a and the cover panel layer 300a are then welded together using a welding machine. It should be recalled here that the buffer layer 200a is made of a thermoplastic plastic having a melting point lower than that of the cover panel layer 300a. Accordingly, the portion of the buffer layer 200a in contact with the cover panel layer 300a melts, and then the portion of the cover panel layer 300a in contact with the buffer layer 200a melts. Then, both the melted portions come into contact with each other and then solidify. The solidified portion becomes the second welding layer 600a. The second welding layer 600a is thus bonded to the buffer layer 200a and the cover panel layer 300a.
The next step is to prepare the protective layer 200b. The protective layer 200b is laminated on the second face 120 of the base layer 100, so that the electrode layer 400b is located between the base layer 100 and the protective layer 200b. The next step is to weld the base layer 100 and the protective layer 200b using a welding machine. More particularly, the portion of the base layer 100 in contact with the protective layer 200b and a portion of the protective layer 200b in contact with the base layer 100 melt, come in contact with each other through the interstices of the electrodes 410b of the electrode layer 400b, and then solidify. The solidified portion becomes the first welding layer 500b. The first welding layer 500b is thus bonded to the base layer 100 and the protective layer 200b, with the electrode layer 400b embedded in the first welding layer 500b.
The next step is to prepare the reinforcing layer 300b. The reinforcing layer 300b is laminated on the protective layer 200b. Then, the protective layer 200b and the reinforcing layer 300b are welded together in the welding machine. More particularly, the portion of the protective layer 200b in contact with the reinforcing layer 300b and the portion of the reinforcing layer 300b in contact with the protective layer 200b melt, come in contact with each other, and then solidify. The solidified portion becomes the second welding layer 600b. The second welding layer 600b is thus bonded to the protective layer 200b and the reinforcing layer 300b. This is how to manufacture the touch panel T. It should be noted that the welding processes discussed above may be performed by thermal welding, ultrasonic welding, high-frequency welding, semiconductor laser welding, or other means.
The above touch sensor T described above have many technical features as discussed below. First, the first welding layer 500a welds the entire surface areas of the base layer 100 and the buffer layer 200a together, and the first welding layer 500b welds the entire surface areas of the base layer 100 and the protective layer 200b together. Also, the second welding layer 600a welds the entire surface areas of the buffer layer 200a and the cover panel layer 300a together, and the second welding layer 600b welds the entire surface areas of the protective layer 200b and the reinforcing layer 300b together. These structures can improve bonding strengths between the base layer 100 and the buffer layer 200a, between the base layer 100 and the protective layer 200b, between the buffer layer 200a and the cover panel layer 300a, and between the protective layer 200b and the reinforcing layer 300b. Hence, if used under a harsh environment (such as under a high-temperature environment or if bended in a curved shape), the touch sensor T is less likely to suffer from delamination between the base layer 100 and the buffer layer 200a, between the base layer 100 and the protective layer 200b, between the buffer layer 200a and the cover panel layer 300a, and/or between the protective layer 200b and the reinforcing layer 300b.
Further advantageously, the first welding layer 500a is made from portions of the base layer 100 and the buffer layer 200a that have melted and then solidified. The first welding layer 500b is made from portions of the base layer 100 and the protective layer 200b that have melted and then solidified. The second welding layer 600a is made from portions of the buffer layer 200a and the cover panel layer 300a that have melted and then solidified. The second welding layer 600b is made from portions of the protective layer 200b and the reinforcing layer 300b that have melted and then solidified. These structures do not require additional members for bonding the base layer 100 and the buffer layer 200a, the base layer 100 and the protective layer 200b, the buffer layer 200a and the cover panel layer 300a, and the protective layer 200b and the reinforcing layer 300b. Therefore, the touch sensor T has a reduced number of components and can be manufactured with a reduced number of welding processes, so that the touch sensor T can be manufactured with a reduced cost.
Still advantageously, the buffer layer 200a is interposed between the base layer 100 and the cover panel layer 300a. If the base layer 100 and the cover panel layer 300a have poor welding compatibility with each other, the buffer layer 200a can act as an intermediary in bonding the base layer 100 and the cover panel layer 300a together. Also, the buffer layer 200a is made of a thermoplastic plastic material having a melting point lower than those of the base layer 100 and the cover panel layer 300a, a portion of the base layer 200a melts before portions of the base layer 100 and the cover panel layer 300a do. This can reduce thermal damage to the base layer 100 and the cover panel layer 300a during the welding process.
Further advantageously, the protective layer 200b, serving as a protective layer to cover the electrode layer 400b, can prevent the electrode layer 400b from coming in direct contact with the welding machine during the welding process. Therefore, the electrode layer 400b is less likely to be physically damaged during the welding process.
Next, a touch sensor T′ according to the second embodiment of the invention will be described with reference to
The reinforcing layer 300b′ is a rigid plate made of polycarbonate, acrylic, or other plastic material. This reinforcing layer 300b′ is also laminated to the protective layer 200b and welded in the entire surface are to the protective layer 200b by the second welding layer 600b′.
The touch sensor T′ described above may be manufactured in the following steps and as illustrated in
The next step is to prepare the buffer layer 200a. The buffer layer 200a is laminated on the first face 110 of the base layer 100, so that the electrode layer 400a is located between the base layer 100 and the buffer layer 200a. The next step is to prepare the cover panel layer 300a. The cover panel layer 300a is laminated on the buffer layer 200a. Also prepared is the protective layer 200b. The protective layer 200b is laminated on the second face 120 of the base layer 100, so that the electrode layer 400b is located between the base layer 100 and the protective layer 200b.
The next step is to place the cover panel layer 300a, the buffer layer 200a, the electrode layer 400a, the base layer 100, the electrode layer 400b, and the protective layer 200b into a die of an injection molding machine. Then, polycarbonate, acrylic, or other plastic material is injected for molding onto the protective layer 200b in the die. The plastic material hardens on the protective layer 200b to become the reinforcing layer 300b′. The reinforcing layer 300b′ is thus laminated on the protective layer 200b. In this molding process, a portion of the plastic material is welded to the protective layer 200b to form the second welding layer 600b′.
Simultaneously in the die, the heat and pressure during the injection molding process causes welding of the base layer 100 and the buffer layer 200a, the buffer layer 200a and the cover panel layer 300a, and the base layer 100 and the protective layer 200b. More specific welding processes are as follows.
By use of the heat and pressure during the injection molding process, the portion of the buffer layer 200a in contact with the base layer 100 melts, and then the portion of the base layer 100 in contact with the buffer layer 200a melts. Both the melted portions come in contact with each other through the interstices 411a or 412a of the electrodes 410a of the electrode layer 400a, and then they solidify. The solidified portion becomes the first welding layer 500a. The first welding layer 500a is thus bonded to the base layer 100 and the buffer layer 200a, with the electrode layer 400a embedded in the first welding layer 500a.
By use of the heat and pressure during the injection molding process, the portion of the buffer layer 200a in contact with the cover panel layer 300a melts, and then the portion of the cover panel layer 300a in contact with the buffer layer 200a melts. Both the melted portions contact each other and then solidify. The solidified portion becomes the second welding layer 600a. The second welding layer 600a is thus bonded to the buffer layer 200a and the cover panel layer 300a.
By use of the heat and pressure during the injection molding process, the portion of the base layer 100 in contact with the protective layer 200b and the portion of the protective layer 200b in contact with the base layer 100 melt, come in contact with each other through the interstices of the electrodes 410b of the electrode layer 400b, and then they solidify. The solidified portion becomes the first welding layer 500b. The first welding layer 500b is thus bonded to the base layer 100 and the protective layer 200b, with the electrode layer 400b embedded in the first welding layer 500b.
The above touch sensor T′ described above provide the same effects as those provided by the touch sensor T. In addition, the heat and pressure during the injection molding process can be effectively used for forming the first welding layers 500a and 500b and the second welding layers 600a and 600b′. Therefore, the touch sensor T′ can be manufactured with a reduced number of welding processes, so that the touch sensor T′ can be manufactured with a reduced cost.
It is appreciated that the above touch sensors T and T′ and the methods for manufacturing them are not limited to those of the above first and second embodiments, and they may be modified in any manner within the scope of the claims. Some of specific modifications will be described below.
According to the above first and second embodiments, the touch sensor includes the base layer, the buffer layer, the protective layer, the cover panel layer, the reinforcing layer, the electrode layer, the first welding layer, and the second welding layer. However, the touch sensor of the invention may be modified in any manner as long as it includes laminated first and second layers, and a first welding layer being provided between the first and second layers and welding the first layer and the second layer together at least partially.
The above first and second embodiments prescribe that the base layer 100 is the first layer and the buffer layer 200a and the protective layer 200b are each the second layer. However, the first and second layers of the invention may be any adjacent layers of a plurality of laminated layers in a touch sensor. For example,
In the touch sensor T″, the entire surface areas of the cover panel layer 300a and the buffer layer 200a are welded together by a first welding layer 500. The first welding layer 500 is made from a portion of the cover panel layer 300a and a portion of the buffer layer 200a (i.e. respective portions of these layers contacting each other) that melt, bond to the cover panel layer 300a and the buffer layer 200a, and then solidify. The base layer 100 and the buffer layer 200a are bonded together by an optically clear adhesive 700a. The base layer 100 and the protective layer 200b are bonded together by an optically clear adhesive 700b. The protective layer 200b and the reinforcing layer 300b are bonded by an optically clear adhesive 700c.
The touch sensor T″ may be manufactured in the following steps. First, the electrodes 410a of the electrode layer 400a are formed on the first face 110 of the base layer 100, and the electrodes 410b of the electrode layer 400b are formed on the second face 120 of the base layer 100. Then, the buffer layer 200a is bonded to the first face 110 of the base layer 100 by the optically clear adhesive 700a. Then, the cover panel layer 300a is laminated on the buffer layer 200a. Then, the buffer layer 200a and the cover panel layer 300a are welded together using a welding machine. It should be recalled here that the buffer layer 200a is made of a thermoplastic plastic having a melting point lower than that of the cover panel layer 300a, the portion of the buffer layer 200a in contact with the cover panel layer 300a melts, and then the portion of the cover panel layer 300a in contact with the buffer layer 200a melts. Then, both the melted portions come into contact with each other, and then they solidify. The solidified portion becomes the first welding layer 500. It should be noted that the above welding process may be performed by thermal welding, ultrasonic welding, high-frequency welding, semiconductor laser welding, or other means. Then, the protective layer 200b is bonded to the first face 110 of the base layer 100 by the optically clear adhesive 700b. Onto the protective layer 200b the reinforcing layer 300b is bonded by the optically clear adhesive 700c. This is how to manufacture the variant touch sensor T″. Alternatively, the first welding layer 500 may be formed by use of the heat and pressure during the injection molding process as in the second embodiment.
The touch sensor of the invention may also be modified such that the reinforcing layer 300b serves as the first layer and the protective layer 200b serves as the second layer. In this case, the first welding layer may weld the entire surface areas of the reinforcing layer 300b and the protective layer 200b. The other interlayer bondings may be provided by an optically clear adhesive or an unclear adhesive.
In the first and second embodiments and some of the above modifications, the cover panel layer and the reinforcing layer each serve as the third layer. However, the third layer of the invention may be any layer laminated on the second layer. In the above first and second embodiments and the above modifications, the first, second, and third layers are all made of plastic materials, but all or any of the first, second, and third layers may be made of a material other than plastic material. In addition, one or a plurality of layers may be laminated on the third layer.
In the above first and second embodiments and the above modification, the first welding layer and/or the second welding layer weld the entire surface areas of the layers to be laminated. However, the first welding layer and/or the second welding layer may be modified in any manner as long as they can weld layers to be laminated at least partially. The portions other than the welded portions of the layers may be bonded by an optically clear adhesive or an unclear adhesive. The first welding layer may be made from a portion of one layer of the first and second layers that has melted and then solidified to weld the one layer at least partially to the other layer of the first and second layers. The second welding layer may be made from a portion of one layer of the second and third layers that has melted and then solidified to weld the one layer at least partially to the other layer of the second and third layers. In addition, if the first, second, and third layers are made of a material other than plastic material, the first layer and the second layer and/or the second layer and the third layer may be welded together at least partially by a plastic material sandwiched between the first layer and the second layer and/or the second layer and the third layer. Also in a case where the first and second layers are made of a material other than a plastic material and the electrode layer is formed on the first layer, the first layer and the second layer may be welded together by a plastic material sandwiched between the first layer and the second layer. In the case where the electrodes of the electrode layer are in mesh or fibrous shape, the sandwiched plastic material may melt, come in contact with the second layer through the interstices of the electrodes, and then solidify. The solidified plastic may serve as the first welding layer to weld the first layer and the second layer.
In the above first and second embodiments and the above modifications, the buffer layer is provided between the cover panel layer and the base layer. The buffer layer may be replaced with a protective layer to be disposed between the cover panel layer and the base layer. In the above first and second embodiments and the above modification, the protective layer is provided between the reinforcing layer and the base layer. The protective layer may be replaced with a buffer layer to be disposed between the reinforcing layer and the base layer.
In the above first and second embodiments and the above modifications, the buffer layer is provided between the cover panel layer (the third layer) and the base layer (the first layer) and made of a thermoplastic plastic material having a relatively low melting point. However, the buffer layer of the invention may be modified in any manner as long as it is provided between the first and third layers and made of a plastic material more suitable to be welded to the first and third layers than to weld the first and third layers together
In the above first and second embodiments and the above modifications, the electrode layer 400a is formed on the first face 110 of the base layer 100, and the electrode layer 400b is formed on the second face 120 of the base layer 100. However, the electrode layers 400a and 400b may be provided on one and the same face of the base in the thickness direction. In this case, an insulating layer may be provided between the electrode layers 400a and 400b.
In the above first and second embodiments and the above modifications, the electrodes 410a and 410b of the electrode layers 400a and 400b are in mesh or fibrous shape. However, the electrodes of the electrode layer of the invention may be a solid filling such as transparent conductive films of ITO (indium tin oxide), PEDOT (polyethylenedioxythiophene), or other material. The electrodes of the electrode layer may be optically opaque. Further, the electrode layer may require at least one electrode. This modification applies to cases such as when the touch sensor is a touch switch as discussed below.
In the above first and second embodiments and the above modifications, the base layer is a flexible transparent plastic film. However, the base layer of the invention may be a translucent plastic film, an opaque plastic film, a translucent rigid substrate (e.g. a glass or ceramic substrate), or an opaque rigid substrate. Any of the buffer layer, the cover panel layer, the protective layer, and the reinforcing layer of the above first and second embodiments and the above modifications may also be a translucent plastic film, an opaque plastic film, a translucent rigid substrate (e.g. a glass or ceramic substrate), or an opaque rigid substrate.
The touch sensors of the above first and second embodiments and the above modifications may be manufactured by any method including laminating a first and second layers together, at least one layer of the first and second layers being a plastic layer, and welding the one layer at least partially to the other layer of the first and second layers by melting and then solidifying a portion of the one layer. The manufacturing method may further include placing the laminated first and second layers in a die, and injection-molding a plastic material on the second layer in the die to laminate a third layer on the second layer. In this case, the welding of the one layer at least partially to the other layer may includes melting the portion of the one layer of the first and second layers by use of heat and pressure during the injection molding process and solidifying the melted portion of the one layer.
It should be appreciated that the embodiments and modifications are described above by way of examples only. The materials, shapes, dimensions, numbers, arrangements, and other configurations of the touch sensors may be modified in any manner if they can perform similar functions. The touch sensor of the invention may be a capacitive touch panel as described above but is not limited thereto. For example, the touch sensor may be a touch panel of a type other than capacitive (e.g. resistive type and in-cell type), or a touch switch (touch switch of capacitive, resistive, in-cell, or other type). Furthermore, the invention is not limited to touch sensors but applicable to any devices having a plurality of layers bonded to each other.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2012-249827 | Nov 2012 | JP | national |
