Patent Application
20210272527
This application claims the priority benefit of Taiwan application serial no. 109106660, filed on Mar. 2, 2020. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
The invention relates to a trace structure, and particularly relates to a trace structure of a display panel.
In a display panel, there are various ways to resolve a problem of circuit burnout caused by excessive electrical over stress (EOS). One way is to place a capacitor next to a panel driver circuit, and a placement position thereof should be as close to the circuit as possible, and another way is to change a framework of a circuit design. However, the way of placing the capacitor next to the panel driver circuit is simpler and easier for verification. In the related art, the panel driver circuit may be disposed on a display panel in a chip on glass (COG) manner where the panel driver circuit is directly disposed on glass or in a chip on film (COF) manner where the panel driver circuit is disposed on a flexible circuit board. However, in the former configuration, it is not possible to place the capacitor next to the panel driver circuit, and the latter configuration requires a change to be made to a package design.
Therefore, in the related art, it is difficult to resolve the problem of circuit burnout caused by electrical over stress.
The invention is directed to a trace structure of a display panel, which is adapted to resolve a problem of circuit burnout caused by electrical over stress.
The invention provides a trace structure of a display panel including a first metal layer and a second metal layer. The first metal layer is configured to transmit a first voltage. The second metal layer is disposed under the first metal layer and is configured to transmit a second voltage. The first metal layer and the second metal layer form the trace structure on the display panel, such that the trace structure has a capacitor structure. The trace structure is configured to connect a power input and a panel driver circuit.
In an embodiment of the invention, the power input transmits the first voltage and the second voltage to the panel driver circuit through the trace structure.
In an embodiment of the invention, the first voltage is selected from one of a first power voltage and a second power voltage. The first power voltage is greater than the second power voltage.
In an embodiment of the invention, the second voltage is a ground voltage.
In an embodiment of the invention, the trace structure further includes a third metal layer. The third metal layer is disposed on the first metal layer. The third metal layer is configured to transmit a third voltage.
In an embodiment of the invention, the third voltage is a ground voltage.
In an embodiment of the invention, the display panel includes a display area and a non-display area. The panel driver circuit is disposed in the non-display area.
In an embodiment of the invention, the panel driver circuit is a gate driver integrated circuit.
In an embodiment of the invention, the display panel is an electronic paper display panel.
Based on the above description, in the embodiment of the invention, the trace structure of the display panel has a capacitor structure, which can resolve the problem of circuit burnout caused by electrical over stress.
To make the aforementioned more comprehensible, several embodiments accompanied with drawings are described in detail as follows.
In the embodiment, the power input 120 is, for example, connected to the display panel 130 through a flexible printed circuit board. The gate driver integrated circuit 110 and the trace structure 140 are disposed in the non-display area PA. The non-display area PA is an area outside the display area AA for configuring peripheral circuits. The trace structure 140 is configured to connect the power input 120 and the gate driver integrated circuit 110. The power input 120 transmits a first voltage V1 and a second voltage V2 required for operation of the gate driver integrated circuit 110 to the gate driver integrated circuit 110 through the trace structure 140. The trace structure 140 includes a first metal layer 142 and a second metal layer 144. The second metal layer 144 is disposed under the first metal layer 142. The first metal layer 142 is configured to transmit the first voltage V1, and the second metal layer 144 is configured to transmit the second voltage V2.
In the embodiment, the trace structure 140 is, for example, a gate power rail. The first voltage V1 is selected from one of a first power voltage and a second power voltage, wherein the first power voltage is greater than the second power voltage. The first power voltage is, for example, a high power voltage required for operation of the gate driver integrated circuit 110, and the second power voltage is, for example, a low power voltage required for operation of the gate driver integrated circuit 110. The second voltage V2 is, for example, a ground voltage.
In the embodiment, the first metal layer 142 and the second metal layer 144 form the trace structure 140 on the display panel 130, so that the trace structure 140 has a capacitor structure, which may resolve the problem of circuit burnout caused by electrical over stress (EOS). A capacitance value of the capacitor structure is, for example, between a few nanofarads (nF) and a few microfarads (μF). In an embodiment, if the trace structure 140 has a capacitance value of 1 μF, the electrical over stress may be reduced from 52 volts to 34 volts. The above values are only for an illustrative purpose and are not used to be limiting of the invention.
In summary, in the embodiment of the invention, the capacitor structure is constructed in the trace structure of the display panel, which is adapted to resolve the problem of circuit burnout caused by electrical over stress.
It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the invention covers modifications and variations provided they fall within the scope of the following claims and their equivalents.
| Number | Date | Country | Kind |
|---|---|---|---|
| 109106660 | Mar 2020 | TW | national |
