The present application claims priority from Japanese application JP2004-357538 filed on Dec. 10, 2004, the content of which is hereby incorporated by reference into this application.
The present invention relates to a transceiver apparatus. In particular, the present invention relates to components for facilitating the design and reducing the size and power dissipation of radio frequency integrated circuits for full duplex system.
Conventional radio frequency circuits are formed using discrete components for each of function blocks (such as amplifiers for amplifying signals, mixers for converting signal frequencies, and filters for passing only desired bands of signals). Owing to the improvement of semiconductor techniques in recent years, it has become possible to integrate a plurality of function blocks included in the radio frequency signal circuit into one semiconductor chip (hereafter referred to as RFIC). The radio frequency circuit integrated into one or several semiconductor chips converts a high frequency signal received from an antenna to a signal in a lower frequency band with high qualities (such as low noise, high linearity, and suppression of signals in bands other than a desired band).
For implementing the radio frequency circuit at low cost, it is necessary to integrate a larger number of function blocks included in the radio frequency circuit into a single semiconductor chip. As one of obstacles to this purpose, it can be mentioned to integrate a filter circuit for suppressing signals in bands other than the desired band into the semiconductor chip. In general, a SAW (Surface Acoustic Wave) filter, a dielectric filter, or the like is used as this filter circuit. As a result, signals in bands other than the desired band are suppressed. However, the SAW filter or the dielectric filter cannot be integrated into the semiconductor chip.
Radio frequency circuits using discrete components typically have a configuration called super heterodyne, and need SAW filters or dielectric filters. However, these filters cannot be integrated into the semiconductor chip. If a radio frequency circuit manufactured using semiconductor has the super heterodyne configuration, therefore, SAW filters or dielectric filters are attached to the outside of the semiconductor chip. This increases the number of components and the area for mounting.
Therefore, a radio frequency circuit scheme that utilizes the advantage of the semiconductor circuit (although absolute values of component constants vary between semiconductor chips, relative values of component constants in one semiconductor chip coincide with specified values with high precision) and that does not need SAW filters or dielectric filters has been proposed. This is a zero IF (direct conversion) scheme or a low IF scheme. Either of them does not need SAW filters or dielectric filters attached to the outside, and suppression of signals that are present in bands other than the desired band is conducted by a filter that can be integrated into the semiconductor chip. It sometimes becomes necessary to attach partial filters to the outside because of requirements from the radio scheme or the system.
The basic principle of the zero IF scheme and the low IF scheme is described, for example, in DIRECT CONVERSION RECEIVERS IN WIDE-BAND SYSTEMS, written by Aarno Parssinen and published by Kluwer Academic Publishers.
On the other hand, expansion of communication frequencies is being studied or executed in order to cope with an increase in the number of subscribers of portable telephone and enrichment of communication contents. For example, in the W-CDMA scheme in the 3GPP (3rd Generation Partnership Project) standards, communication bands of six kinds ranging from Band-I to Band-VI are prescribed and communication can be conducted in a band that is suitable according to radio wave utilization situations and plans in various countries (ETSI TS 125 101). If in this case each portable telephone terminal has a function of coping with a plurality of bands, convenience in the situations such as international roaming is enhanced. Therefore, demands for the multi-band function are increasing.
In the portable telephone terminal, the full duplex system conducts transmission and reception simultaneously. Even if the zero IF or low IF is used, therefore, it is difficult to suppress a transmission signal having a high level by using only the RFIC especially as multi-band implementation is promoted. If a transmission signal having a high level is present, receiver sensitivity for a received signal is degraded by an interference component as shown in
In
Denoting a frequency of the transmission signal 1 by ftx, and a frequency of the interference signal 3 by fjam, a frequency fi of the intermodulation interference 4 caused on the receiver channel by the transmission signal 1 and the interference signal 3 is represented by the following Equation (1).
fi=2fjam−ftx (1)
Intermodulation interference also occurs in the case shown in
fi=2ftx−fjam (2)
In the case of
If the interference signal is in close vicinity to the receiver band, the received signal is subjected to influence of cross modulation distortion as shown in
Since the receiver sensitivity degradation shown in FIGS. 3(a)-3(c) can be reduced by suppressing the transmission signal with a filter, a configuration as shown in
In
The RFIC 50 conducts processing on the radio frequency signal by using a receiver scheme such as the zero IF or the low IF. Furthermore, the RFIC 50 outputs signals for changing over a gain and a bias current of the LNA 30, and thereby changes over the gain and the bias current according to the receiver level.
Since the RFIC 50 is intended for the full duplex system, the RFIC 50 conducts transmission simultaneously with the reception. As for a transmission signal output from the RFIC 50, signals in bands other than the desired band are suppressed by the BPF 60. A resultant signal is input to the PA 70. The PA 70 amplifies the transmission signal to a desired level, and outputs a resultant signal to the isolator 80. The isolator 80 is provided to cause the PA 70 to be capable of conducting power amplification efficiently even under an impedance variation of the antenna 10. The impedance variation of the antenna 10 is caused when, for example, the portable telephone is used with the antenna in contact with the head.
An output of the isolator 80 is output from the antenna 10 via the duplexer 20.
When seen from the receiver side (the input of the LNA 30), the duplexer 20 has an effect of suppressing the transmission signal (i.e., suppressing all signals in bands other than the receiver band). When seen from the transmission side (the output of the isolator 80), the duplexer 20 has an effect of suppressing spurious signals supplied from the receiver side (i.e., suppressing all signals in bands other than the transmission band). As a result, interference shown in
If a multi-band configuration is implemented in
The current consumed by the LNA 30 depends on the transmission signal suppression degree Ltxrx [dB] of the duplexer 20. It is now supposed that the transmission signal level at the output of the isolator 80 is Ptx [dBm] and the power gain of the LNA 30 is PG_LNA [dB]. It is also supposed that each port impedance of the duplexer 20, the input impedance and output impedance of the LNA 30, the output impedance of the isolator 80, and the input impedance of the BPF 40 is 50Ω. At this time, an input level P_LNAout [dBm] of the BPF 40 is represented by the following Equation (3).
P—LNAout=Ptx−Ltxrx+PG—LNA (3)
From
Therefore, it is desirable that the RFIC 50 and the LNA 30 are separated from each other and a designer who selects the duplexer designs the LNA 30 as well. In the multi-band implementation, however, we cannot help utilizing an LNA IC having as many LNAs 30 as correspond to the number of bands integrated therein, from the viewpoint of the mounting area. Since in general the designer of the LNA IC is also different from the selector of the duplexer in the same way as the designer of the RFIC 50, however, the difficulty that the design that does not depend on Ltxrx must be conducted occurs in the same way.
In accordance with the present invention, the problems are solved by a module that can be applied to a transceiver apparatus, the transceiver apparatus including an antenna, a duplexer for passing only a desired band in a signal from the antenna or a signal to the antenna, a low noise amplifier circuit for amplifying an output signal of the duplexer, a first band pass filter for passing only a desired band in an output signal of the low noise amplifier circuit, a radio frequency integrated circuit for conducting frequency conversion to a low frequency band on an output signal of the first band pass filter, a second band pass filter for passing only a desired band in a transmission signal generated by the radio frequency integrated circuit, a power amplifier circuit for amplifying an output signal of the second band pass filter, and an isolator inserted so as to make it possible for the power amplifier circuit to conduct power amplification efficiently even if impedance of the antenna changes and so as to stabilize impedance of the antenna seen from the power amplifier, the duplexer passing only a desired band in an output signal of the isolator and outputting the passed signal to the antenna, wherein the module includes the duplexer, the low noise amplifier circuit, and the first band pass filter. As a result, it is possible to facilitate design and reduce the size and power dissipation of the radio frequency integrated circuit for full duplex system.
The module according to the present invention is formed to include a coupler for branching an output signal of the isolator and a detector circuit for detecting a signal level of an output of the coupler, wherein a bias current in the low noise amplifier circuit is increased when an output level of the detector circuit is high, and the bias current in the low noise amplifier circuit is decreased when the output level of the detector circuit is low. As a result, the power dissipation of the transceiver apparatus is decreased.
The module according to the present invention is formed to include the duplexer, the low noise amplifier circuit, the first band pass filter, the coupler, and the detector circuit. As a result, it is possible to facilitate design and reduce the size and power dissipation of the radio frequency integrated circuit for full duplex system.
The module is formed to include a plurality of duplexers, a plurality of low noise amplifier circuits, a plurality of first band pass filters, a radio frequency integrated circuit, a plurality of second band pass filters, a plurality of couplers, and a plurality of detector circuits so as to associate with a plurality of transceiver bands. As a result, it is possible to facilitate design and reduce the size and power dissipation of the radio frequency integrated circuit for full duplex system.
In addition, a control signal for turning on a low noise amplifier circuit intended only for a corresponding band among the low noise amplifier circuits is supplied from the radio frequency integrated circuit external to the module. As a result, it is possible to further facilitate design and reduce the size and power dissipation of the radio frequency integrated circuit for full duplex system.
As for mounting, a transceiver apparatus according to the present invention includes a switch for changing over a plurality of transceiver signals, a plurality of duplexers connected to the switch to conduct frequency separation on the transceiver signals, a plurality of low noise amplifiers for amplifying output receiver signals of the duplexers, and a plurality of band pass filters connected respectively to the low noise amplifiers, and the band pass filters output balanced signals. As a result, it is possible to reduce the size and distortion. Furthermore, it is possible to reduce the size and distortion by arranging balanced signal output terminals so as to be opposed to input terminals of direct conversion mixer circuits. Furthermore, it is possible to further reduce the size and stabilize the performance by forming the duplexers, the low noise amplifiers, and the band pass filters as monolithic ICs so as to associate a monolithic IC with each of a plurality of receiver bands. Furthermore, it is possible to further reduce the size by forming the whole of the switch, the duplexers, the low noise amplifiers, and the band pass filters as a monolithic IC.
According to the present invention, it is possible to facilitate design and reduce the size and power dissipation of the radio frequency integrated circuit for full duplex system.
Other objects, features and advantages of the invention will become apparent from the following description of the embodiments of the invention taken in conjunction with the accompanying drawings.
Hereafter, aspects of the present invention will be described.
[Aspect 1]
The RFIC 50 conducts processing on the radio frequency signal by using a receiver scheme such as the zero IF or the low IF. Furthermore, the RFIC 50 outputs signals for changing over a gain and a bias current of the LNA 30, and thereby changes over the gain and the bias current according to the receiver level.
Since the RFIC 50 is intended for the full duplex system, the RFIC 50 conducts transmission simultaneously with the reception. As for a transmission signal output from the RFIC 50, signals in bands other than the desired band are suppressed by the BPF 60. A resultant signal is input to the PA 70. The PA 70 amplifies the transmission signal to a desired level, and outputs a resultant signal to the isolator 80. The isolator 80 is provided to cause the PA 70 to be capable of conducting power amplification efficiently even under an impedance variation of the antenna 10. The impedance variation of the antenna 10 is caused when, for example, the portable telephone is used with the antenna in contact with the head.
An output of the isolator 80 is output from the antenna 10 via the duplexer 20.
When seen from the receiver side (the input of the LNA 30), the duplexer 20 has an effect of suppressing the transmission signal (i.e., suppressing all signals in bands other than the receiver band). When seen from the transmission side (the output of the isolator 80), the duplexer 20 has an effect of suppressing spurious signals supplied from the receiver side (i.e., suppressing all signals in bands other than the transmission band). As a result, interference shown in
The high frequency front-end module 100 is formed by mounting the duplexer 20, the LNA 30 and the BPF 40 on a single module. For implementing a multi-band configuration, an antenna switch is disposed between the antenna 10 and the duplexer 20 to conduct signal changeover between bands, although not illustrated. In addition, power on/off changeover of the LNA 30 desired for each band is also conducted. An inter-band changeover signal for the antenna switch and the LNA 30 is sent from the RFIC 50.
Owing to the high frequency front-end module 100, the designer of the high frequency front-end module 100 participates in the optimum design of the bias current of the LNA 30. Therefore, it becomes easy to set the gain of the LNA 30 to a design value or stabilize the gain. On the other hand, since the leak of the transmission signal to the receiver side is sufficiently suppressed by the duplexer 20 and the BPF 40, it is not necessary to care about the leak level of the transmission signal to the receiver side at the time of design of the RFIC 50. Furthermore, since the LNA 30 is integrated into the high frequency front-end module 100, the low noise requirement for the RFIC 50 becomes weak and consequently it becomes possible to manufacture the RFIC 50 by using, for example, the low cost CMOS process.
If the FBAR or BAW filter technique or the like is used, the duplexer 20 and the BPF 40 can be integrated onto a silicon substrate on which the LNA 30 is manufactured. Thus, it is possible to form the high frequency front-end module 100 as a duplexer IC.
[Aspect 2]
On the other hand, it is rare to manufacture the RFIC 50 by using a process capable of using the Schottky diode. For integrating the power detector 120 into the RFIC 50, therefore, the power detector 120 must include an amplifier circuit, and consequently it is not suitable for low power dissipation.
According to the present aspect, it is possible to facilitate the design and reduce the size and power dissipation of RFIC 50 for full duplex system.
[Aspect 3]
As for the transmission side, a signal modulated from the baseband is converted to a desired high frequency modulation signal by a transmitter unit 52, amplified to a power level required for sending from the antenna by power amplifiers 70, and then input to transmission inputs of the duplexers.
In the present aspect, duplexers, LNAs, and BPFs are provided for respective receiver bands, connected to the high frequency switch for changeover, and formed as a module. Also in the case where multi-band configuration is used, it is possible to improve the distortion characteristics and reduce the dissipated current. Since the duplexers and the BPFs connected as input and output loads concerning the performance of the LNAs can be arranged so as to be adjacent to each other, an advantage of facilitating the optimization of the matching condition is obtained. Furthermore, since outputs of the BPFs are balanced, they can be advantageously connected to the direct conversion mixers 501, 502 and 503 connected outside the module and suppression of external noise can be anticipated. Furthermore, since the LNAs and the direct conversion mixers are separated from each other, semiconductor processes that are optimum respectively to the LNAs and the direct conversion mixers can be selected and advantages of increased degree of design freedom and improved performance are obtained.
By the way, in the present aspect, the RFIC 50 is shown to be divided to a direct conversion receiver 51 and a transmitter unit 52. Even if they are formed as a single chip, however, effects of the present invention are effective.
[Aspect 4]
[Aspect 5]
[Aspect 6]
[Aspect 7]
[Aspect 8]
[Aspect 9]
[Aspect 10]
As for industrial applicability, the present invention can be applied to CDMA portable telephone and the high frequency front end module used in the CDMA portable telephone.
It should be further understood by those skilled in the art that although the foregoing description has been made on embodiments of the invention, the invention is not limited thereto and various changes and modifications may be made without departing from the spirit of the invention and the scope of the appended claims.
Number | Date | Country | Kind |
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2004-357538 | Dec 2004 | JP | national |