Technical Field
This disclosure relates to increasing the input transconductance of an amplifier.
Description of Related Art
Transconductance (gm) boosting may be used to increase the input transconductance of an amplifier for achieving higher bandwidths. Several ways are described in literature. However, they may add noise, increase power consumption, and/or limit input voltage range.
A circuit may increase input transconductance. An input stage may receive an input voltage from an input. The input stage may include a field effect transistor (FET) that has a gate, source, drain, and body terminal. An amplifier may generate an amplified version of the input voltage that is applied to the body terminal of the FET. Application of the amplified version of the input voltage to the body terminal of the FET may increase the transconductance of the FET compared to what it would be in the same circuit without the amplified version being applied to the body terminal of the FET.
These, as well as other components, steps, features, objects, benefits, and advantages, will now become clear from a review of the following detailed description of illustrative embodiments, the accompanying drawings, and the claims.
The drawings are of illustrative embodiments. They do not illustrate all embodiments. Other embodiments may be used in addition or instead. Details that may be apparent or unnecessary may be omitted to save space or for more effective illustration. Some embodiments may be practiced with additional components or steps and/or without all of the components or steps that are illustrated. When the same numeral appears in different drawings, it refers to the same or like components or steps.
Illustrative embodiments are now described. Other embodiments may be used in addition or instead. Details that may be apparent or unnecessary may be omitted to save space or for a more effective presentation. Some embodiments may be practiced with additional components or steps and/or without all of the components or steps that are described.
Input stages of amplifiers may be built using a differential pair formed by two transistors (e.g. NMOS transistors). The input transconductance (gm) may be given by the gm of the input devices. The bulk-transconductance (gmb) of NMOS transistors is usually five times smaller and therefore may not be used for gm-generation.
The input voltage range of the amplifier illustrated in
The differential pair formed by U1 and U2 may generate gm.
The open loop gain (AOL) and gain bandwidth product (GBW) of the amplifier may be:
U3 and U4 may function as cascode transistors for U1 and U2, respectively. Their output impedance may be boosted by the amplifier built with U5, U6, U7, I4, I2 and I3. The bulk terminals of U1, U2, U3 and U4 may be connected to node common or gnd.
OUTN and OUTP may provide a differential output of the amplifier. CM may define the DC output level. Cmfbv may be representative of a common mode feedback voltage. E1 and E2 may function as voltage buffers.
The bulk/body transconductance (gmb) may be:
VSB . . . bulk source voltage,
γ . . . bulk threshold parameter, and
2φF . . . surface potential at strong inversion.
Gmb may be 5 times smaller than gm:
gmb=η*gm˜0.2gm
The differential pair formed by U1 and U2 may generate an effective gm, gmeff.
The voltage gain from node INP-INM to node A-B (AIN) may be determined by gm, gmb, R2, R7, and AIN (positive feedback):
If
If:
Noise contribution of R2:
The input referred noise may largely be dominated by the noise of the input transistor.
The gmb boosting approaches that have been described may use the bulk transconductance of MOS transistors for increasing the effective gm of a differential pair. The input signal may be amplified with the input transistors of a differential pair. The amplified signals may be cross coupled to bodies of the input transistors for generating a positive feedback. Cross coupling could be done by direct connection, by an active circuit (follower), or by capacitors if level shifting is desired. The amplification may be necessary because the bulk transconductance may be much smaller than the main gm. The described gm boosting technique may dramatically improve the power efficiency of amplifiers as it may add only a negligible amount of noise and may increase bandwidth for a given current.
The gmb boosting approaches that have been described may increase effective transconductance and preserve very low input current of a traditional MOS differential pair. They may amplify an input signal by a factor A. The amplified signal may be cross-coupled between bodies of input devices. The gmb-boosted input stage may significantly increase the effective input transconductance because gm and gmb*A may contribute. The effective input transconductance may be increased with almost no noise penalty, no extra current consumption, and/or no active components.
The gmb boosting approaches that have been described may generate only a little extra noise because they may use gmb for boosting the input referred transconductance and may not require extra transistors. The noise contribution of additional resistors may be mainly thermal noise and may be made negligible by appropriate sizing. Due to increased transconductance in the input stage, noise generated by downstream stages or components may be more suppressed when referred to the input. The same may hold true for input referred offset introduced by following stages/components.
The gmb boosting approaches that have been described are not limited to NMOS differential pairs. They may also be applied to PMOS differential pairs or a combination of NMOS and PMOS, comparable to what is shown in
The gmb boosting approaches that have been described may be used as an input stage for many different amplifier topologies and may have only little impact on the allowable input voltage range, as compared to a traditional differential pair.
The gmb boosting approaches that have been described may also be used in amplifiers of only a single input signal.
The components, steps, features, objects, benefits, and advantages that have been discussed are merely illustrative. None of them, nor the discussions relating to them, are intended to limit the scope of protection in any way. Numerous other embodiments are also contemplated. These include embodiments that have fewer, additional, and/or different components, steps, features, objects, benefits, and advantages. These also include embodiments in which the components and/or steps are arranged and/or ordered differently.
Unless otherwise stated, all measurements, values, ratings, positions, magnitudes, sizes, and other specifications that are set forth in this specification, including in the claims that follow, are approximate, not exact. They are intended to have a reasonable range that is consistent with the functions to which they relate and with what is customary in the art to which they pertain.
All articles, patents, patent applications, and other publications that have been cited in this disclosure are incorporated herein by reference.
The phrase “means for” when used in a claim is intended to and should be interpreted to embrace the corresponding structures and materials that have been described and their equivalents. Similarly, the phrase “step for” when used in a claim is intended to and should be interpreted to embrace the corresponding acts that have been described and their equivalents. The absence of these phrases from a claim means that the claim is not intended to and should not be interpreted to be limited to these corresponding structures, materials, or acts, or to their equivalents.
The scope of protection is limited solely by the claims that now follow. That scope is intended and should be interpreted to be as broad as is consistent with the ordinary meaning of the language that is used in the claims when interpreted in light of this specification and the prosecution history that follows, except where specific meanings have been set forth, and to encompass all structural and functional equivalents.
Relational terms such as “first” and “second” and the like may be used solely to distinguish one entity or action from another, without necessarily requiring or implying any actual relationship or order between them. The terms “comprises,” “comprising,” and any other variation thereof when used in connection with a list of elements in the specification or claims are intended to indicate that the list is not exclusive and that other elements may be included. Similarly, an element preceded by an “a” or an “an” does not, without further constraints, preclude the existence of additional elements of the identical type.
None of the claims are intended to embrace subject matter that fails to satisfy the requirement of Sections 101, 102, or 103 of the Patent Act, nor should they be interpreted in such a way. Any unintended coverage of such subject matter is hereby disclaimed. Except as just stated in this paragraph, nothing that has been stated or illustrated is intended or should be interpreted to cause a dedication of any component, step, feature, object, benefit, advantage, or equivalent to the public, regardless of whether it is or is not recited in the claims.
The abstract is provided to help the reader quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. In addition, various features in the foregoing detailed description are grouped together in various embodiments to streamline the disclosure. This method of disclosure should not be interpreted as requiring claimed embodiments to require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive subject matter lies in less than all features of a single disclosed embodiment. Thus, the following claims are hereby incorporated into the detailed description, with each claim standing on its own as separately claimed subject matter.
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