1. Field of the Invention
The present invention relates to a transmission module assembly, and particularly to a transmission module assembly having a module cover receiving an electrical connector and a printed circuit board electrically connecting with the electrical connector.
2. Description of Related Art
Transmission module assemblies are widely used in computers or vehicles for controlling various functions. Such a transmission module assembly generally comprises a printed circuit board and contact elements electrically connecting with the printed circuit board. U.S. Pat. Nos. 4,993,956, 5,154,618 and 5,905,637 each disclose such an assembly.
U.S. Pat. No. 4,993,956 discloses an electrical connector comprising a base housing defining a cavity, a printed circuit board removably received in the cavity, contact elements disposed on opposite longitudinal walls of the cavity and having contact beams electrically engaging conductive pads on the printed circuit board and a cover covering the cavity to retain and protect the printed circuit board. With the printed circuit board received in the cavity of the base housing, walls of the cover are fitted within the cavity and held in place by respective downwardly facing shoulders on noses of the contact elements engaging upwardly facing shoulders on respective front and rear walls of the cover. The printed circuit board is held in place and urged against the contact beams by respective downwardly facing shoulders on the front and the rear walls of the cover. It is obvious that employing the cover to position the printed circuit board and urge an electrical engagement between the printed circuit board and the contact elements complicates the assembling process and increases the manufacturing cost.
U.S. Pat. No. 5,154,618 (hereinafter the '618 patent) discloses an electronic device including a first assembly and a second assembly interconnecting with each other. The second assembly is comprised of a base having forward and rearward portions configured to receive the first assembly in an overlapping relation. The rearward portion includes opposite upwardly extending sidewalls, a front wall and a rear wall defining a mounting space therebetween. A printed circuit board having an electrical connector mounted thereon is received in the mounting space. The front wall defines an opening configured to receive the electrical connector. After the printed circuit board together with the connector is received in the mounting space, a cover member is secured to the base.
U.S. Pat. No. 5,905,637 (hereinafter the '637 patent) discloses a module assembly comprising a casing defining a mounting space and plural insertion slots, a printed circuit board mounted in the mounting space and holding a front connector and a rear connector, and a top cover covered on the casing and fastened to the rear connector. Terminals on the front connector are disposed in alignment with the insertion slots of the casing for engaging with corresponding terminals of an electronic device.
Both the '618 patent and the '637 patent disclose that after the connector has been installed on the printed circuit board, a soldering procedure is performed to electrically connect the terminals of the connector and the printed circuit board together, and then the printed circuit board is fastened to the mounting space. Accordingly, the assembling process is complicated and the manufacturing cost is correspondingly increased.
Subsequently, some people skilled in the art make great efforts to develop a module assembly to solve the above-mentioned problems but still ineffective. The module assembly comprises a module housing with terminals insert molded therein and a printed circuit board assembled to the module housing to electrically connect with the terminals. However, the process of insert molding the terminals with the module housing is expensive. Further, a soldering procedure is still employed to connect the terminals and the printed circuit board. Therefore, the manufacturing cost is still not decreased.
Hence, an improved module assembly is required to overcome the disadvantages of the related art.
Accordingly, a first object of the present invention is to provide a transmission module assembly having an electrical connector and a printed circuit board conveniently assembled to a module cover, thereby reducing assembling process.
A second object of the present invention is to provide a transmission module assembly having an electrical connector installed in a module cover and a printed circuit board assembled into the module cover to have a solderless electrical connection with the electrical connector.
A third object of the present invention is to provide a transmission module assembly having a module cover not only receiving a printed circuit board and an electrical connector but also providing EMI (Electro Magnetic Interference) shielding.
In order to achieve the objects set forth, a module assembly comprises a module cover including a bottom wall, a front wall, a rear wall and two opposite side walls defining a receiving cavity therebetween, an electrical connector and a printed circuit board both received in the receiving cavity and a cover member covering the receiving cavity. The module cover has a mating portion with a mating space defined therein. The front wall defines a plurality of passageways communicating with the receiving cavity and the mating space. The connector comprises an insulating housing and a plurality of terminals retained in the housing. Each terminal includes an engaging portion extending beyond a front face of the housing into the mating space through a corresponding passageway and a press-tail extending upwardly beyond a top face of the housing. The printed circuit board defines plated through holes compliantly receiving the press-fit tails of the terminals.
According to one aspect of the present invention, the module cover is made from plastic material and is metalized on the inside area to provide EMI (Electro Magnetic Interference) shielding. The cover member is made from metal material. A grounding member is attached to a metal-coated inner face of the front wall and electrically connects the metal-coated inner face of the front wall to a grounding pad on the printed circuit board.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
Reference will now be made in detail to the preferred embodiment of the present invention.
Referring to
Referring to
The flange 12 is formed on a top of the body 10. The flange 12 defines four mounting holes 120 at four corners thereof each receiving a steel bushing 123, a recess 122 in a top thereof around the receiving space 105, and a slot 124 recessed downwardly from the recess 122. Four bolts (not shown) are used going through the four steel bushings 123 for mounting the module assembly 100 to the transmission of a vehicle somewhere in an engine compartment.
The module cover 1 is made from plastic material and is metalized on the inside area to provide EMI (Electro Magnetic Interference) shielding. A predetermined area of the inner face of the front wall 102 is masked from the metalization in order to keep electrical separation between each electrical circuit. In an alternative embodiment, a stamped and formed metal shield can also be used instead of metalizing the plastic.
Referring to
Each terminal 28 includes an engaging portion 280 extending beyond the front face 200 of the housing 20 through a corresponding aperture 23, a right-angled intermediate portion 282 extending from the engaging portion 280 and received in a corresponding aperture 23 and a corresponding slit 22 for retaining the terminal 28 in the housing 20, and a press-fit tail 284 extending upwardly from the intermediate portion 282 beyond the top face 203 of the housing 20. The press-fit tail 284 is perpendicular to the engaging portion 280.
It is understood that the terminals 28 can also be insert molded with the insulating housing 20.
Referring to
Referring to
After the connector 2 is installed in the receiving cavity 105 of the module cover 1, a potting compound 6 can be added to an interstitial space between the front wall 102 and the housing 20, i.e., the depression 21 of the housing 20 to achieve water sealing function for protecting the terminals 28. A pair of grounding members 5 (shown in
In the preferred embodiment, the cover 4 is made from metal material and functions as a heat sink to cool controller chips (not shown) on the printed circuit board 3. Referring to
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.