Transmit/receive distributed antenna systems

Information

  • Patent Grant
  • 6621469
  • Patent Number
    6,621,469
  • Date Filed
    Tuesday, May 1, 2001
    23 years ago
  • Date Issued
    Tuesday, September 16, 2003
    21 years ago
Abstract
A distributed antenna device includes a plurality of transmit antenna elements, a plurality of receive antenna elements and a plurality of amplifiers. One of the amplifiers is a power amplifier operatively coupled with each of the transmit antenna elements and mounted closely adjacent to the associated transmit antenna element, such that no appreciable power loss occurs between the power amplifier and the associated antenna element. At least one of the amplifiers is a low noise amplifier and is built into the distributed antenna device for receiving and amplifying signals from at least one of the receive antenna elements. Each power amplifier is a relatively low power, relatively low cost per watt linear amplifier chip.
Description




BACKGROUND OF THE INVENTION




This invention is directed to novel antenna structures and systems including an antenna array for both transmit (Tx) and receive (Rx) operations.




In communications equipment such as cellular and personal communications service (PCS), as well as multi-channel multi-point distribution systems (MMDS) and local multi-point distribution systems (LMDS) it has been conventional to receive and retransmit signals from users or subscribers utilizing antennas mounted at the tops of towers or other structures. Other communications systems such as wireless local loop (WLL), specialized mobile radio (SMR) and wireless local area network (WLAN) have signal transmission infrastructure for receiving and transmitting communications between system users or subscribers which may also utilize various forms of antennas and transceivers.




All of these communications systems require amplification of the signals being transmitted and received by the antennas. For this purpose, it has heretofore been the practice to use conventional linear power amplifiers, wherein the cost of providing the necessary amplification is typically between U.S. $100 and U.S. $300 per watt in 1998 U.S. dollars. In the case of communications systems employing towers or other structures, much of the infrastructure is often placed at the bottom of the tower or other structure with relatively long coaxial cables connecting with antenna elements mounted on the tower. The power losses experienced in the cables may necessitate some increase in the power amplification which is typically provided at the ground level infrastructure or base station, thus further increasing expense at the foregoing typical costs per unit or cost per watt. Moreover, conventional power amplification systems of this type generally require considerable additional circuitry to achieve linearity or linear performance of the communications system. For example, in a conventional linear amplifier system, the linearity of the total system may be enhanced by adding feedback circuits and pre-distortion circuitry to compensate for the nonlinearities at the amplifier chip level, to increase the effective linearity of the amplifier system. As systems are driven to higher power levels, relatively complex circuitry must be devised and implemented to compensate for decreasing linearity as the output power increases.




Output power levels for infrastructure (base station) applications in many of the foregoing communications systems is typically in excess of ten watts, and often up to hundreds of watts which results in a relatively high effective isotropic power requirement (EIRP). For example, for a typical base station with a twenty watt power output (at ground level), the power delivered to the antenna, minus cable losses, is around ten watts. In this case, half of the power has been consumed in cable loss/heat. Such systems require complex linear amplifier components cascaded into high power circuits to achieve the required linearity at the higher output power. Typically, for such high power systems or amplifiers, additional high power combiners must be used.




All of this additional circuitry to achieve linearity of the overall system, which is required for relatively high output power systems, results in the aforementioned cost per unit/watt (between $100 and $300).




The present invention proposes distributing the power across multiple antenna (array) elements, to achieve a lower power level per antenna element and utilize power amplifier technology at a much lower cost level (per unit/per watt).




SUMMARY OF THE INVENTION




In accordance with one aspect of the invention a distributed antenna device comprises a plurality of transmit antenna elements, a plurality of receive antenna elements and a plurality of power amplifiers, one of said power amplifiers being operatively coupled with each of said transmit antenna elements and mounted closely adjacent to the associated transmit antenna element, such that no appreciable power loss occurs between the power amplifier and the associated antenna element, at least one of said power amplifiers comprising a low noise amplifier and being built into said distributed antenna device for receiving and amplifying signals from at least on of said receive antenna elements, each said power amplifier comprising a relatively low power, relatively low cost per watt linear power amplifier chip.











BRIEF DESCRIPTION OF THE DRAWINGS




In the drawings:





FIG. 1

is a simplified schematic of a transmit antenna array utilizing power amplifier chips/modules;





FIG. 2

is a schematic similar to

FIG. 1

in showing an alternate embodiment;





FIG. 3

is a block diagram of an antenna assembly or system;





FIG. 4

is a block diagram of a transmit/receive antenna system in accordance with one form of the invention;





FIG. 5

is a block diagram of a transmit/receive antenna system in accordance with another form of the invention;





FIG. 6

is a block diagram of a transmit/receive antenna system including a center strip in accordance with another form of the invention;





FIG. 7

is a block diagram of an antenna system employing transmit and receive elements in a linear array in accordance with another aspect of the invention;





FIG. 8

is a block diagram of an antenna system employing antenna array elements in a layered configuration with microstrip feedlines for respective transmit and receive functions oriented in orthogonal directions to each other;





FIG. 9

is a partial sectional view through a multi-layered antenna element which may be used in the arrangement of

FIG. 8

;





FIGS. 10 and 11

show various configurations of directing input and output RF from a transmit/receive antenna such as the antenna of

FIGS. 8 and 9

;





FIGS. 12 and 13

are block diagrams showing two embodiments of a transmit/receive active antenna system with respective alternative arrangements of diplexers and power amplifiers;





FIG. 14

is an exploded view of an embodiment of an active antenna system;





FIG. 15

is an assembled view of an embodiment of

FIG. 14

;





FIG. 16

is an exploded view, similar to

FIG. 14

, showing another embodiment of an active antenna system; and





FIG. 17

is an assembled view of the embodiment of FIG.


16


.











DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENT




Referring now to the drawings, and initially to

FIGS. 1 and 2

, there are shown two examples of a multiple antenna element antenna array


10


,


10




a


in accordance with the invention. The antenna array


10


,


10




a


of

FIGS. 1 and 2

differ in the configuration of the feed structure utilized,

FIG. 1

illustrating a parallel corporate feed structure and

FIG. 2

illustrating a series corporate feed structure. In other respects, the two antenna arrays


10


,


10




a


are substantially identical. Each of the arrays


10


,


10




a


includes a plurality of antenna elements


12


, which may comprise monopole, dipole or microstrip/patch antenna elements. Other types of antenna elements may be utilized to form the arrays


10


,


10




a


without departing from the invention.




In accordance with one aspect of the invention, an amplifier element


14


is operatively coupled to the feed of each antenna element


12


and is mounted in close proximity to the associated antenna element


12


. In one embodiment, the amplifier elements


14


are mounted sufficiently close to each antenna element so that no appreciable losses will occur between the amplifier output and the input of the antenna element, as might be the case if the amplifiers were coupled to the antenna elements by a length of cable or the like. For example, the power amplifiers


14


may be located at the feed point of each antenna element. In one embodiment, the amplifier elements


14


comprise relatively low power, linear integrated circuit chip components, such as monolithic microwave integrated circuit (MMIC) chips. These chips may comprise chips made by the gallium arsenide (GaAs) heterojunction transistor manufacturing process. However, silicon process manufacturing or CMOS process manufacturing might also be utilized to form these chips.




Some examples of MMIC power amplifier chips are as follows:




1. RF Microdevices PCS linear power amplifier RF 2125P, RF 2125, RF 2126 or RF 2146, RF Micro Devices, Inc., 7625 Thorndike Road, Greensboro, N.C. 27409, or 7341-D W. Friendly Ave., Greensboro, N.C. 27410;




2. Pacific Monolithics PM 2112 single supply RF IC power amplifier, Pacific Monolithics, Inc., 1308 Moffett Park Drive, Sunnyvale, Calif.;




3. Siemens CGY191, CGY180 or CGY181, GaAs MMIC dual mode power amplifier, Siemens AG, 1301 Avenue of the Americas, New York, N.Y.;




4. Stanford Microdevices SMM-208, SMM-210 or SXT-124, Stanford Microdevices, 522 Almanor Avenue, Sunnyvale, Calif.;




5. Motorola MRFIC1817 or MIFIC1818, Motorola Inc., 505 Barton Springs Road, Austin, Tex.;




6. Hewlett Packard HPMX-3003, Hewlett Packard Inc., 933 East Campbell Road, Richardson, Tex.;




7. Anadigics AWT1922, Anadigics, 35 Technology Drive, Warren, N.J. 07059;




8. SEI P0501913H, SEI Ltd., 1, Taya-cho, Sakae-ku, Yokohama, Japan; and




9. Celeritek CFK2062-P3, CCS1930 or CFK2162-P3, Celeritek, 3236 Scott Blvd., Santa Clara, Calif. 95054.




In the antenna arrays of

FIGS. 1 and 2

, array phasing may be adjusted by selecting or specifying the element-to-element spacing (d) and/or varying the line length in the corporate feed. The array amplitude coefficient adjustment may be accomplished through the use of attenuators before or after the power amplifiers


14


, as shown in FIG.


3


.




Referring now to

FIG. 3

, an antenna system in accordance with the invention and utilizing an antenna array of the type shown in either

FIG. 1

or

FIG. 2

is designated generally by the reference numeral


20


. The antenna system


20


includes a plurality of antenna elements


12


and associated power amplifier chips


14


as described above in connection with

FIGS. 1 and 2

. Also operatively coupled in series circuit with the power amplifiers


14


are suitable attenuator circuits


22


. The attenuator circuits


22


may be interposed either before or after the power amplifier


14


; however,

FIG. 3

illustrates them at the input to each power amplifier


14


. A power splitter and phasing network


24


feeds all of the power amplifiers


14


and their associated series connected attenuator circuits


22


. An RF input


26


feeds into this power splitter and phasing network


24


.




Referring now to the remaining

FIGS. 4-11

, the various embodiments of the invention shown have a number of characteristics, three of which are summarized below:




1) Use of two different patch elements; one transmit, and one receive. This results in substantial RF signal isolation (over 20 dB isolation, at PCS frequencies, by simply separating the patches horizontally by 4 inches) without requiring the use of a frequency diplexer at each antenna element (patch). This technique can be used on virtually any type of antenna element (dipole, monopole, microstrip/patch, etc.).




In some embodiments of a distributed antenna system, we use a collection of elements (M vertical Tx elements


12


, and M vertical Rx elements


30


), as shown in

FIGS. 4

,


5


and


6


.

FIGS. 4 and 5

show the elements in a series corporate feed structure, for both the Tx and Rx. Note, that they can also be in a parallel corporate feed structure (not shown); or the Tx in a parallel corporate feed structure, and receive elements in a series feed structure (or vice-versa).




2) Use of a “built in” Low Noise Amplifier (LNA) circuit or device; that is, built directly into the antenna, for the receive (Rx) side.

FIG. 4

shows the LNA


40


after the antenna elements


30


are summed via the series (or parallel) corporate feed structure.

FIG. 5

shows the LNA devices


40


(discrete devices) at the output of each Rx element (patch), before being RF summed.




The LNA device


40


at the Rx antenna reduces the overall system noise figure (NF), and increases the sensitivity of the system, to the signal emitted by the remote radio. This therefore, helps to increase the range of the receive link (uplink).




The similar use of power amplifier devices


14


(chips) at the transmit (Tx) elements has been discussed above.




3) Use of a low power frequency diplexer


50


(shown in FIGS.


4


and


5


). In conventional tower top systems (such as “Cell Boosters”), since the power delivered to the antenna (at the input) is high power RF, a high power frequency diplexer must be used (within the Cell Booster, at the tower top). In our system, since the RF power delivered to the (Tx) antenna is low (typically less than 100 milliwatts), a low power diplexer


50


can be used.




Additionally, in conventional system, the diplexer isolation is typically required to be well over 60 dB; often up to 80 or 90 dB isolation between the uplink and downlink signals.




Since the power output from our system, at each patch, is low power (less than 1-2 Watts typical), and since we have already achieved (spatial) isolation via separating the patches, the isolation requirements of our diplexer is much less.




In each of the embodiments illustrated herein, a final transmit rejection filter (not shown) would be used in the receive path. This filter might be built into the or each LNA if desired; or might be coupled in circuit ahead of the or each LNA.




Referring now to

FIG. 6

, this embodiment uses two separate antenna elements (arrays), one for transmit


12


, and one for receive


30


, e.g., a plurality of transmit (array) elements


12


, and a plurality of receive (array) elements


30


. The elements can be dipoles, monopoles, microstrip (patch) elements, or any other radiating antenna element. The transmit element (array) will use a separate corporate feed (not shown) from the receive element array. Each array (transmit


30


and receive


12


) is shown in a separate vertical column; to shape narrow elevation beams. This can also be done in the same manner for two horizontal rows of arrays (not shown); shaping narrow azimuth beams.




Separation (spatial) of the elements in this fashion increases the isolation between the transmit and receive antenna bands. This acts similarly to the use of a frequency diplexer coupled to a single transmit/receive element. Separation by over half a wavelength typically assures isolation greater than 10 dB.




The backplane/reflector


55


can be a flat ground plane, a piecewise or segmented linear folded ground plane, or a curved reflector panel (for dipoles). In either case, one or more conductive strips


60


(parasitic) such as a piece of metal can be placed on the backplane to assure that the transmit and receive element radiation patterns are symmetrical with each other, in the azimuth plane; or in the plane orthogonal to the arrays.

FIG. 6

illustrates an embodiment where a single center strip


60


is used for this purpose and is described below. However, multiple strips could also be utilized, for example over more strips to either side of the respective Tx and Rx antenna element(s). This can also be done for antenna elements (Tx, Rx) oriented in a horizontal array (not shown); i.e., assuring symmetry in the elevation plane. For antenna elements (Tx, Rx) which are non-centered on the ground plane


55


, as shown in

FIG. 6

, the resulting radiation patterns are typically non-symmetric; that is, the beams tend to skew away from the azimuth center point. The center strip


60


(metal) “pulls” the radiation pattern beam, for each array, back towards the center. This strip


60


can be a solid metal (aluminum, copper, . . . ) bar; in the case of dipole antenna elements, or a simple copper strip in the case of microstrip/patch antenna elements. In either case, the center strip


60


can be connected to ground or floating; i.e., not connected to ground. Additionally, the center strip


60


(or bar) further increases the isolation between the transmit and receive antenna arrays/elements.




The respective Tx and Rx antenna elements can be orthogonally polarized relative to each other to achieve even further isolation. This can be done by having the receive elements


30


in a horizontal polarization, and the transmit elements


14


in a vertical polarization, or vice-versa. Similarly, this can be accomplished by operating the receive elements


30


in slant-45 degree (right) polarization, and the transmit elements


14


in slant-45 degree (left) polarization, or vice-versa.




Vertical separation of the elements


14


in the transmit array is chosen to achieve the desired beam pattern, and in consideration of the amount of mutual coupling that can be tolerated between the elements


14


(in the transmit array). The receive elements


30


are vertically spaced by similar considerations. The receive elements


30


can be vertically spaced differently from the transmit elements


14


; however, the corporate feed(s) must be compensated to assure a similar receive beam pattern to the transmit beam pattern, across the desired frequency band(s). The phasing of the receive corporate feed usually will be slightly compensated to assure a similar pattern to the transmit array.




Most existing Cellular/PCS antennas use the same antenna element or array for both transmit and receive. The typical arrangement has a RF cable going to the antenna, which uses a parallel corporate feed structure; thus all the feed paths, and the elements, handle both the transmit and receive signals. Thus, for these types of systems, there isn't a need to separate the elements into separate transmit and receive functionalities. The characteristics of this approach are:




a) A single (1) antenna element (or array) used; for both Tx and Rx operation.




b) No constriction or restriction on geometrical configuration.




c) One (1) single corporate feed structure, for both Tx and Rx operation.




d) Element is polarized in the same plane for both Tx and Rx.




For (c) and (d), there are some cases (i.e. dual polarized antennas) that use cross-polarized antennas (literally two antenna structures, or sub-elements, within the same element), with the Tx functionality with its own sub-element and corporate feed structure, and the Rx functionality with its own sub-element and separate corporate feed structure.




In

FIG. 6

, we split up the transmit and receive functionalities into separate transmit and receive antenna elements, so as to allow separation of the distinct bands (transmit and receive). This provides added isolation between the bands, which in the case of the receive path, helps to attenuate (reduce the power level of the signals in the transmit band), prior to amplification. Similarly, for the transmit paths, we only (power) amplify the transmit signals using the active components (power amplifiers) prior to feeding the amplified signal to the transmit antenna elements.




As mentioned above, the center strip aids in correcting the beams from steering outwards. In a single column array, where the same elements are used for transmit and receive, the array would likely be placed in the center of the antenna (ground plane) (see e.g.,

FIG. 7

, described below). Thus the azimuth beam would be centered (symmetric) orthogonal to the ground plane. However, by using adjacent vertical arrays (one for Tx and one for Rx), the beams become asymmetric and steer outwards by a few degrees. Placement of a parasitic center strip between the two arrays “pulls” each beam back towards the center. Of course, this can be modeled to determine the correct strip width and placement(s) and locations of the vertical arrays, to accurately center each beam.




The characteristics of this approach are:




a) Two (2) different antenna elements (or arrays) used; one for Tx and one for Rx.




b) Geometrical configuration is spaced apart, adjacent placement of Tx and Rx elements (as shown in FIG.


6


).




c) Two (2) separate corporate feed structures used, one for Tx and one for Rx.




d) Each element can be polarized in the same plane, or an arrangement can be constructed where the Tx element(s) are in a given polarization, and the Rx elements are all in an orthogonal polarization.




The embodiment of

FIG. 7

uses two separate antenna elements, one for transmit


14


, and one for receive


30


, or a plurality of transmit (array) elements, and a plurality of receive (array) elements. The elements can be dipoles, monopoles, microstrip (patch) elements, or any other radiating antenna element. The transmit element array will use a separate corporate feed from the receive element array. However, all elements are in a single vertical column; for beam shaping in the elevation plane. This arrangement can also be used in a single horizontal row (not shown), for beam shaping in the azimuth array. This method assures highly symmetric (centered) beams, in the azimuth plane, for a column (of elements); and in the elevation plane, for a row (of elements).




The individual Tx and Rx antenna elements in

FIG. 7

, can be orthogonally polarized to each other to achieve even further isolation. This can be done by having the receive patches


30


(or elements, in the receive array) in the horizontal polarization, and the transmit patches


14


(or elements) in the vertical polarization, or vice-versa. Similarly, this can be accomplished by operating the receive elements in slant-45 degree (right) polarization, and the transmit elements in slant-45 degree (left) polarization, or vice-versa.




This technique allows placing the all elements down a single center line. This results in symmetric (centered) azimuth beams, and reduces the required width of the antenna. However, it also increases the mutual coupling between antenna elements, since they should be packed close together, so as to not create ambiguous elevation lobes.




The characteristics of this approach are:




a) Two (2) different antenna elements (or arrays) used; one for Tx and one for Rx.




b) Geometrical configuration is adjacent, collinear placement.




c) Two (2) separate corporate feed structures used, one for Tx and one for Rx.




d) Each element is polarized in the same plane, or the Tx element(s) are all in a given polarization, and the Rx elements are all in an orthogonal polarization.




The embodiment of

FIG. 8

uses a single antenna element (or array), for both the transmit and receive functions. In this case, a patch (microstrip) antenna element is used. The patch element


70


is created via the use of a multi-element (4-layer) printed circuit board, with dielectric layers


72


,


74


,


76


(see

FIG. 8



a


). The antennas can be fed with either a coaxial probe (not shown), or aperture coupled probes or microstriplines


80


,


82


. For the receive function, the feed microstripline


82


is oriented orthogonal to the feed stripline (probe)


80


for the transmit function.




The elements can be cascaded, in an array, as shown in

FIG. 8

, for beam shaping purposes. The RF input


90


is directed towards the radiation elements via a separate corporate feed from the RF output


92


(on the receive corporate feed), ending at point “A”. Note that either or both corporate feeds


80


,


82


can be parallel or series corporate feed structures.




The diagram of

FIG. 8

shows that the receive path RF is summed in a series corporate feed, ending at point “A” (


92


) preceded by a low noise amplifier (LNA). However, low noise amplifiers, (LNAs), can be used directly at the output of each of the receive feeds (not shown in FIG.


8


), prior to summing, similar to the showing in

FIG. 4

, as discussed above.




The transmit and receive RF isolation is achieved via orthogonal polarization taps from the same antenna (patch) element, as shown and described above with reference to

FIGS. 8 and 9

.

FIG. 9

indicates, in cross-section, the general layered configuration of each element


70


of FIG.


8


. The respective feeds


80


,


82


are separated by a dielectric layer


83


. Another dielectric layer


85


separates the feed


82


from a ground plane


86


, while yet a further dielectric layer separates the ground plane


86


from a radiating element or “patch”


88


.




This concept uses the same antenna physical location for both functionalities (Tx and Rx). A single patch element (or cross polarized dipole) can be used as the antenna element, with two distinct feeds (one for Tx, and the other for Rx at orthogonal polarization). The two antenna elements (Tx and Rx) are orthogonally polarized, since they occupy the same physical space.




The characteristics of this approach are:




a) One (1) single antenna element (or array), used for both Tx and Rx.




b) No construct on geometrical configuration.




c) Two (2) separate corporate feed structures used, one for Tx and one for Rx.




d) Each element contains two (2) sub-elements, cross polarized (orthogonal) to one another.




The embodiments of

FIGS. 10-11

show two (2) ways to direct the input and output RF from the Tx/Rx active antenna, to the base station.





FIG. 10

shows the output RF energy, at point


92


(of FIG.


8


), and the input RF energy, going to point


90


(of FIG.


8


), as two distinctly different cables


94


,


96


. These cables can be coaxial cables, or fiber optic cables (with RF/analog to fiber converters, at points “A” and “B”). This arrangement does not require a frequency diplexer at the antenna (tower top) system. Additionally, it does not require a frequency diplexer (used to separate the transmit band and receive band RF energies) at the base station.





FIG. 11

shows the case where the output RF energy (from the receive array) and the input RF energy (going to the transmit array), are diplexed together (via a frequency diplexer


100


), within the antenna system so that a single cable


98


runs down the tower (not shown) to the base station


104


. Thus, the output/input to the base station


104


is via a single coaxial cable (or fiber optic cable, with RF/analog to fiber optic converter). This system requires another frequency diplexer


102


at the base station


104


.





FIGS. 12 and 13

show another arrangement which may be used as a transmit/receive active antenna system. The array comprises of a plurality of antenna elements


110


(dipoles, monopoles, microstrip patches, . . . ) with a frequency diplexer


112


attached directly to the antenna element feed of each element.




In

FIG. 12

, the RF input energy (transmit mode) is split and directed to each element, via a series corporate feed structure


115


(this can be microstrip, stripline, or coaxial cable), but can also be a parallel corporate feed structure (not shown). Prior to each diplexer


112


, is a power amplifier (PA) chip or module


114


. The RF output (receive mode) is summed in a separate corporate feed structure


116


, which is amplified by a single LNA


120


, prior to point “A,” the RF output


122


.




In

FIG. 13

, there is an LNA


120


at the output of each diplexer


112


, for each antenna (array) element


110


. Each of these are then summed in the corporate feed


125


(series or parallel), and directed to point “A,” the RF output


122


.




The arrangements of

FIGS. 12 and 13

can employ either of the two connections (described in FIGS.


10


and


11


), for connection to the base station


104


(transceiver equipment).




In

FIGS. 14-17

like reference numerals are utilized to designate like elements and components to those shown, for example, in the previous figures.




In

FIGS. 14 and 15

, a housing including a radome cover


200


and a radome back


210


enclose an active antenna structure including patches


88


which are mounted on a dielectric board


87


and may have a number of drain lines


202


, formed on the dielectric board for lightning or other electro static discharge (ESD) protection. These drain lines


202


are coupled to a source of ground potential such as a ground plane. The embodiment of

FIGS. 14 and 15

also includes a ground plane


86


as described above with reference to

FIGS. 8 and 9

. In

FIG. 14

, the ground plane is a dielectric sheet with metallization on the side facing the dielectric sheet


87


. The opposite side of ground plane


86


has an etched feed pattern forming a feed network for the patches


88


. Through apertures


204


are provided for coupling the feed network to the patches


88


. This back surface of sheet


86


may also carry some of the electronic components, as shown in

FIGS. 11-13

.




The radome back or housing


210


also mounts a PC board


215


which may contain electronic components, such as one or more amplifiers


114


,


120


and diplexers


100


,


102


and/or


112


, as shown for example in

FIGS. 11-13

. Additional end covers


212


,


214


for the housing comprising the radome cover and back


200


,


210


are also illustrated in

FIGS. 14 and 15

. It will be seen that two columns of patch antenna elements


88


are illustrated in

FIG. 14

, whereby one of these columns may act as transmit antenna elements and the other as receive antenna elements, if desired.




In the embodiment of

FIGS. 16 and 17

, a similar dielectric layer


87


mounts a plurality of patch elements


88


(in a single column) which are provided with drain lines


202


, for example, printed on the dielectric surface


87


for electro static discharge protection. These drain lines


202


, as described above, with reference to

FIG. 14

, are coupled to a suitable ground potential. The ground plane


86


is constructed similarly to that described above with reference to FIG.


14


. An electronics PC board is indicated by reference numeral


315


. Similar to the embodiment of

FIGS. 14 and 15

, a radome cover


300


and radome back


310


are provided, as well as respective end covers


312


,


314


.




What has been shown and described herein is a novel antenna array employing power amplifier chips or modules at the feed of individual array antenna elements, and novel installations utilizing such an antenna system.




While particular embodiments and applications of the present invention have been illustrated and described, it is to be understood that the invention is not limited to the precise construction and compositions disclosed herein and that various modifications, changes, and variations may be apparent from the foregoing descriptions, and are to be understood as forming a part of the invention insofar as they fall within the spirit and scope of the invention as defined in the appended claims.



Claims
  • 1. A distributed antenna device comprising:a plurality of transmit antenna elements; a plurality of receive antenna elements; a plurality of power amplifiers, a power amplifier being operatively coupled with each of said transmit antenna elements and mounted closely adjacent to the associated transmit antenna element, such that no appreciable power loss occurs between the power amplifier and the associated antenna element; and at least one low noise amplifier for receiving and amplifying signals from at least one of said receive antenna elements; each said power amplifier comprising a relatively low power, relatively low cost per watt linear power amplifier; and said device being configured such that said transmit antenna elements and said power amplifiers coupled thereto, and said receive antenna elements and said at least one low noise amplifier coupled thereto are continuously active and capable of simultaneous respective transmit and receive operations; wherein said receive antenna elements are in a first array and said transmit antenna elements are in a second array spaced apart from and parallel to said first array; and further including an electrically conductive center strip element positioned between the first and second arrays.
  • 2. The antenna device of claim 1 wherein said transmit antenna elements are spaced apart to achieve a given beam pattern and no more than a given amount of mutual coupling, and wherein said receive antenna elements are spaced apart to achieve a given beam pattern and no more than a given amount of mutual coupling.
  • 3. The antenna device of claim 1 wherein each said power amplifier chip has an output not greater than about one watt.
  • 4. The antenna device of claim 1 and further including a plurality of low noise amplifiers, each operatively coupled with one of said receive antenna elements.
  • 5. The antenna device of claim 1 wherein each antenna element is a dipole.
  • 6. The antenna device of claim 1 wherein each antenna element is a monopole.
  • 7. The antenna device of claim 1 wherein each antenna is a microstrip/patch antenna element.
  • 8. The antenna device of claim 1 wherein a single low noise amplifier is operatively coupled to a summed output of all of said receive elements.
  • 9. The antenna device of claim 1 and further including a low power frequency diplexer operatively coupled with all of said power amplifiers for coupling a single RF cable to all of said transmit and receive antenna elements.
  • 10. The antenna device of claim 1 wherein said receive antenna elements are coupled to one of a series and a parallel corporate feed structure.
  • 11. The antenna device of claim 10 wherein said transmit antenna elements are coupled to a one of a series and a parallel corporate feed structure.
  • 12. The antenna device of claim 1 wherein a single transmit RF cable is coupled to all of said power amplifiers to carry signals to be transmitted to said antenna device and a single receive RF cable is coupled to said at least one low noise amplifier to carry received signals away from said antenna device.
  • 13. The antenna device of claim 1 wherein said receive antenna elements, said transmit antenna elements and said center strip element are all mounted to a common backplane.
  • 14. The antenna device of claim 13 wherein all of said power amplifiers are also mounted to said backplane.
  • 15. The antenna device of claim 1 and further including a transmit corporate feed structure operatively coupled with said transmit antenna elements and a receive corporate feed structure operatively coupled with said receive antenna elements, and wherein one or both of said corporate feed structures are adjusted to cause the transmit beam pattern and receive beam pattern to be substantially similar.
  • 16. A distributed antenna device comprising:a plurality of transmit antenna elements; a plurality of receive antenna elements; and a plurality of power amplifiers, a power amplifier being operatively coupled with each of said transmit antenna elements and mounted closely adjacent to the associated transmit antenna element, such that no appreciable power loss occurs between the power amplifier and the associated antenna element; and at least one low noise amplifier for receiving and amplifying signals from at least one of said receive antenna elements; each said power amplifier comprising a relatively low power, relatively low cost per watt linear power amplifier; and said device being configured such that said transmit antenna elements and said power amplifiers coupled thereto, and said receive antenna elements and said at least one low noise amplifier coupled thereto are continuously active and capable of simultaneous respective transmit and receive operations; wherein said transmit antenna elements and said receive antenna elements are arranged in a single linear array in alternating order.
  • 17. The distributed antenna device of claim 16 wherein said transmit antenna elements are polarized in one polarization and the receive antenna elements are polarized orthogonally to the polarization of said transmit antenna elements.
  • 18. The antenna device of claim 16 wherein said transmit antenna elements are coupled to a one of a series and a parallel corporate feed structure and said receive antenna elements are coupled to a one of a series and a parallel corporate feed structures.
  • 19. A distributed antenna device comprising:a plurality of transmit antenna elements; a plurality of receive antenna elements; and a plurality of power amplifiers, a power amplifier being operatively coupled with each of said transmit antenna elements and mounted closely adjacent to the associated transmit antenna element, such that no appreciable power loss occurs between the power amplifier and the associated antenna element; and at least one low noise amplifier for receiving and amplifying signals from at least one of said receive antenna elements; each said power amplifier comprising a relatively low power, relatively low cost per watt linear power amplifier; and said device being configured such that said transmit antenna elements and said power amplifiers coupled thereto, and said receive antenna elements and said at least one low noise amplifier coupled thereto are continuously active and capable of simultaneous respective transmit and receive operations; wherein said transmit antenna elements and said receive antenna elements comprise separate arrays of antenna elements and wherein said transmit antenna elements are polarized in one polarization and the receive antenna elements are polarized orthogonally to the polarization of said transmit antenna elements; and further including an electrically conductive center strip element positioned between the separate arrays.
  • 20. A method of operating a distributed antenna comprising:arranging a plurality of transmit antenna elements in a first array; arranging a plurality of receive antenna elements in a second array that is spaced apart from and parallel to said first array; coupling a power amplifier with each of said transmit antenna elements mounted closely adjacent to the associated transmit antenna element, such that no appreciable power loss occurs between the power amplifier and the associated antenna element; providing at least one low noise amplifier built into said distributed antenna for receiving and amplifying signals from at least one of said receive antenna elements; simultaneously transmitting from said transmit antenna elements and receiving from said receive antenna elements; and positioning an electrically conductive center strip element between the first and second arrays.
  • 21. The method of claim 20 and further comprising spacing said transmit antenna elements apart to achieve a given beam pattern and no more than a given amount of mutual coupling, and spacing said receive antenna elements apart to achieve a given beam pattern and no more than a given amount of mutual coupling.
  • 22. A method of operating a distributed antenna comprising:arranging a plurality of transmit antenna elements in an array; arranging a plurality of receive antenna elements in an array; coupling a power amplifier with each of said transmit antenna elements mounted closely adjacent to the associated transmit antenna element, such that no appreciable power loss occurs between the power amplifier and the associated antenna element; providing at least one low noise amplifier built into said distributed antenna for receiving and amplifying signals from at least one of said receive antenna elements; simultaneously transmitting from said transmit antenna elements and receiving from said receive antenna elements; and further including arranging said transmit antenna elements and said receive antenna elements in a single array in alternating order.
  • 23. A method of operating a distributed antenna comprising:arranging a plurality of transmit antenna elements in a first array; arranging a plurality of receive antenna elements in a second array that is spaced apart from and parallel to the first array; positioning an electrically conductive center strip element between the first and second arrays; coupling a power amplifier with each of said transmit antenna elements mounted closely adjacent to the associated transmit antenna element, such that no appreciable power loss occurs between the power amplifier and the associated antenna element; providing at least one low noise amplifier built into said distributed antenna for receiving and amplifying signals from at least one of said receive antenna elements; simultaneously transmitting from said transmit antenna elements and receiving from said receive antenna elements; and further including polarizing said transmit antenna elements in one polarization and polarizing the receive antenna elements orthogonally to the polarization of said transmit antenna elements.
CROSS-REFERENCE TO RELATED APPLICATION

This is a continuation-in-part of prior U.S. patent application Ser. No. 09/422,418, filed Oct. 21, 1999, and entitled “Transmit/Receive Distributed Antenna Systems” which is a continuation-in-part of U.S. patent application Ser. No. 09/299,850, filed Apr. 26, 1999, and entitled “Antenna Structure and Installation.”

US Referenced Citations (79)
Number Name Date Kind
4124852 Steudel Nov 1978 A
4246585 Mailloux Jan 1981 A
4360813 Fitzsimmons Nov 1982 A
4566013 Steinberg et al. Jan 1986 A
4607389 Halgrimson Aug 1986 A
4614947 Rammos Sep 1986 A
4689631 Gans et al. Aug 1987 A
4825172 Thompson Apr 1989 A
4849763 DuFort Jul 1989 A
4890110 Kuwahara Dec 1989 A
4994813 Shiramatsu et al. Feb 1991 A
5034752 Pourailly et al. Jul 1991 A
5038150 Bains Aug 1991 A
5061939 Nakase Oct 1991 A
5230080 Fabre et al. Jul 1993 A
5247310 Waters Sep 1993 A
5248980 Raguenet Sep 1993 A
5270721 Tsukamoto et al. Dec 1993 A
5280297 Profera, Jr. Jan 1994 A
5327150 Cherrette Jul 1994 A
5355143 Zurcher et al. Oct 1994 A
5379455 Koschek Jan 1995 A
5412414 Ast et al. May 1995 A
5437052 Hemmie et al. Jul 1995 A
5457557 Zarem et al. Oct 1995 A
5513176 Dean et al. Apr 1996 A
5548813 Charas et al. Aug 1996 A
5554865 Larson Sep 1996 A
5568160 Collins Oct 1996 A
5596329 Searle et al. Jan 1997 A
5604462 Gans et al. Feb 1997 A
5610510 Boone et al. Mar 1997 A
5619210 Dent Apr 1997 A
5623269 Hirshfield et al. Apr 1997 A
5644622 Russell et al. Jul 1997 A
5646631 Arntz Jul 1997 A
5657374 Russell et al. Aug 1997 A
5659322 Caille Aug 1997 A
5710804 Bhame et al. Jan 1998 A
5714957 Searle et al. Feb 1998 A
5724666 Dent Mar 1998 A
5751250 Arntz May 1998 A
5754139 Turcotte et al. May 1998 A
5758287 Lee et al. May 1998 A
5770970 Ikeda et al. Jun 1998 A
5771017 Dean et al. Jun 1998 A
5784031 Weiss et al. Jul 1998 A
5802173 Hamilton-Piercy et al. Sep 1998 A
5809395 Hamilton-Piercy et al. Sep 1998 A
5825762 Kamin, Jr. et al. Oct 1998 A
5832389 Dent Nov 1998 A
5854611 Gans et al. Dec 1998 A
5856804 Turcotte et al. Jan 1999 A
5862459 Charas Jan 1999 A
5878345 Ray et al. Mar 1999 A
5933113 Newberg et al. Aug 1999 A
5936577 Shoki et al. Aug 1999 A
5966094 Ward et al. Oct 1999 A
5987335 Knoedl, Jr. et al. Nov 1999 A
6008763 Nystrom et al. Dec 1999 A
6016123 Barton et al. Jan 2000 A
6018643 Golemon et al. Jan 2000 A
6020848 Wallace et al. Feb 2000 A
6037903 Lange et al. Mar 2000 A
6043790 Derneryd et al. Mar 2000 A
6047199 DeMarco Apr 2000 A
6072434 Papatheodorou Jun 2000 A
6091360 Reits Jul 2000 A
6094165 Smith Jul 2000 A
6104935 Smith et al. Aug 2000 A
6140976 Locke et al. Oct 2000 A
6144652 Avidor et al. Nov 2000 A
6157343 Andersson et al. Dec 2000 A
6160514 Judd Dec 2000 A
6222503 Gietema et al. Apr 2001 B1
6233466 Wong et al. May 2001 B1
6240274 Izadpanah May 2001 B1
6269255 Waylett Jul 2001 B1
6377558 Dent Apr 2002 B1
Foreign Referenced Citations (10)
Number Date Country
0551 556 Jul 1993 EP
0 994 567 Apr 2000 EP
2286749 Aug 1996 GB
08-102618 Apr 1996 JP
11-330838 Nov 1999 JP
WO 9526116 Sep 1995 WO
WO 9534102 Dec 1995 WO
WO 9809372 Mar 1998 WO
WO 9811626 Mar 1998 WO
WO 9850981 Nov 1998 WO
Non-Patent Literature Citations (7)
Entry
Levine, E., Malamud, G., Shtrikman, S., and Treves, D., “A study of Microstrip Array Antennas with the Feed Network,” IEEE Trans. Antenna Propagation, vol. 37, No. 4, Apr. 1989, pp. 426-434.
Herd, J., “Modelling of Wideband Proximity Microstrip Array Elements,” Electronic Letters, vol. 26, No. 16, Aug. 1990, pp. 1282-1284.
Hall, P.S., and Hall, C.M., “Coplanar Corporate Feed Effects in Microstrip Patch Array Design,” Proc. IEEE, vol. 135, pt. H, Jun. 1988, pp. 180-186.
Zurcher, J.F., “The SSFIP: A Global Concept for High Performance Broadband Planar Antennas,” Electronic Letters, vol. 24, No. 23, Nov. 1988, pp. 1433-1435.
Zurcher, J.F. and Gardiol, F., Broadband Patch Antennas, Artech House, 1995, pp. 45-60.
Song, H.J. and Bialkowski, M.E., “A Multilayer Microstrip Patch Antenna Subarray Design using CAD,” Microwave Journal., Mar. 1997, pp. 22-34, 8 pages.
Song, H.J. and Bialkowski, M.E., “Ku-Band 16×16 Planar Array with Aperture-Coupled Microstrip-Patch Elements,” IEEE Antennas and Propagation Magazine, vol. 40, No. 5, Oct. 1998, pp. 25-29.
Continuation in Parts (2)
Number Date Country
Parent 09/422418 Oct 1999 US
Child 09/846790 US
Parent 09/299850 Apr 1999 US
Child 09/422418 US