Claims
- 1. A method of producing a transparent conductive layered structure having a transparent substrate, a transparent conductive layer and a transparent coating layer, the transparent conductive layer and the transparent coating layer being formed successively in this order on the transparent substrate, comprising the steps of:applying a coating liquid for forming a transparent conductive layer to a transparent substrate, the main components of the coating liquid being a solvent and gold microparticles or gold-coated silver microparticles in which the surface of silver particles has been coated with gold, the gold microparticles or the gold-coated silver particles having a mean particle diameter of 1 to 100 nm and dispersed in the solvent; thereafter applying a coating liquid for forming a transparent coating layer, whose main components are a binder, a solvent and a functional group-containing compound having at least one functional group selected from mercapto groups (—SH), sulfide groups (—S—), and polysulfide groups (—Sx—, x≧2); and performing heat treatment.
- 2. A method of producing a transparent conductive layered structure according to claim 1, wherein the gold content of the gold-coated silver microparticles is set within a range of 50 to 95 wt %.
- 3. A method of producing a transparent conductive layered structure according to claim 1, wherein the binder is an inorganic binder whose main component is silica sol.
- 4. A method of producing a transparent conductive layered structure according to claim 1, wherein the coating liquid for forming a transparent conductive layer comprises an inorganic binder whose main component is silica sol.
- 5. A method of producing a transparent conductive layered structure having a transparent substrate, a transparent conductive layer and a transparent coating layer, the transparent conductive layer and the transparent coating layer being formed successively in this order on the transparent substrate, comprising the steps of:applying a coating liquid for forming a transparent conductive layer to a transparent substrate, the main components of the coating liquid being a solvent, gold microparticles or gold-coated silver microparticles in which the surface of silver particles has been coated with gold, the gold microparticles or the gold-coated silver microparticles having a mean particle diameter of 1 to 100 nm and dispersed in the solvent, and a functional group-containing compound having at least one functional group selected from mercapto groups (—SH), sulfide groups (—S—), and polysulfide groups (—Sx—, x≧2); thereafter applying a coating liquid for forming a transparent coating layer whose main components are a binder and a solvent; and performing heat treatment.
- 6. A method of producing a transparent conductive layered structure according to claim 5, wherein the gold content of the gold-coated silver microparticles is set within a range of 50 to 95 wt %.
- 7. A method of producing a transparent conductive layered structure according to claim 5, wherein the binder is an inorganic binder whose main component is silica sol.
- 8. A method of producing a transparent conductive layered structure according to claim 5, wherein the coating liquid for forming a transparent conductive layer comprises an inorganic binder whose main component is silica sol.
Priority Claims (3)
Number |
Date |
Country |
Kind |
11-239771 |
Aug 1999 |
JP |
|
2000-041887 |
Feb 2000 |
JP |
|
2000-187580 |
Jun 2000 |
JP |
|
Parent Case Info
This application is a division of prior application Ser. No. 09/645,471 filed Aug. 24, 2000.
US Referenced Citations (6)
Number |
Name |
Date |
Kind |
4611892 |
Kawashima et al. |
Sep 1986 |
A |
5492958 |
Haluska et al. |
Feb 1996 |
A |
5681890 |
Tanaka et al. |
Oct 1997 |
A |
5785897 |
Toufuku et al. |
Jul 1998 |
A |
5814703 |
Yamaya et al. |
Sep 1998 |
A |
6086790 |
Hayashi et al. |
Jul 2000 |
A |
Foreign Referenced Citations (9)
Number |
Date |
Country |
0803551 |
Mar 1998 |
EP |
0911859 |
Apr 1999 |
EP |
08-77832 |
Mar 1996 |
JP |
09-55175 |
Feb 1997 |
JP |
09-286936 |
Nov 1997 |
JP |
10-188681 |
Jul 1998 |
JP |
10-204336 |
Aug 1998 |
JP |
11-203943 |
Jul 1999 |
JP |
11-203943 |
Jul 1999 |
JP |
Non-Patent Literature Citations (2)
Entry |
Abstract—JP Publication 09-115438 dated May 2, 1997. |
Abstract—JP Publication 07-282745 dated Oct. 27, 1997. |