Tray

Information

  • Patent Grant
  • D742887
  • Patent Number
    D742,887
  • Date Filed
    Wednesday, July 22, 2015
    9 years ago
  • Date Issued
    Tuesday, November 10, 2015
    9 years ago
  • US Classifications
    Field of Search
    • US
    • D14 300-302
    • D14 308-313
    • D14 314
    • D14 348
    • D14 353-355
    • D14 432
    • D14 439-446
    • D14 240
    • 361 679020
    • 361 679310
    • 361 679500
    • 361 690000
    • 361 694000
    • 361 679230
    • 361 801000
    • 361 802000
    • 312 332100
    • 312 334100
    • D13 162
    • D10 50
    • CPC
    • B65H1/00
    • B65H1/266
    • B65H2402/441
    • B65H2405/311
    • B65H2405/313
  • International Classifications
    • 1402
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a top and right side perspective view of a tray showing my new design;



FIG. 2 is a front plan view thereof;



FIG. 3 is a rear plan view thereof;



FIG. 4 is a bottom and right side perspective view thereof;



FIG. 5 is a top and left side perspective view thereof;



FIG. 6 is a top plan view thereof;



FIG. 7 is a bottom plan view thereof;



FIG. 8 is a right side plan view thereof; and,



FIG. 9 is a left side plan view thereof.


Claims
  • The ornamental design for a tray, as shown and described.
US Referenced Citations (25)
Number Name Date Kind
4420767 Hodge et al. Dec 1983 A
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D393455 D'Agaro Apr 1998 S
5785799 Culnane et al. Jul 1998 A
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6442031 Liu Aug 2002 B1
D475061 Huang May 2003 S
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D483374 Hung Dec 2003 S
D490083 Wu May 2004 S
6737299 Jiang May 2004 B1
D555159 Cox Nov 2007 S
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D565573 Alo Apr 2008 S
8129742 Lin et al. Mar 2012 B2
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D735726 Chen Aug 2015 S
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Foreign Referenced Citations (1)
Number Date Country
201426214 Mar 2010 CN
Non-Patent Literature Citations (4)
Entry
American Standard Circuits, Inc., “High Temperature Organic Adhesive Bonding Films”, retrieved from http://www.asc-i.com/preview/technology/thermal-management/, on May 26, 2015, 5 pages.
CTS Corp., “Thermal Management Products Catalog”, retrieved from http://www.ctscorp.com/components/sfcatalog/Thermal—Mgmnt—Products.pdf, 2014, 22 pages.
Chung et al., “Low Tg Epoxy Adhesives for Thermal Management”, retrieved from https://www.aitechnology.com/uploads/pdf/WHITE%20PAPER/lowTgEpoxy.pdf, 14 pages.
Chapter 15, “Cooling of Electronic Equipment”, retrieved from http://highered.mheducation.com/sites/dl/free/0073398128/835451/Chapter15.pdf, 70 pages.