Claims
- 1. A method for fabricating an electrochemical tree resistant high voltage electrical cable, said method comprising the steps of:
- extruding a multi-layer insulation structure over a continuously advancing stranded cable conductor;
- curing the insulation structure by applying a pressurized curing medium to the outer surface thereof;
- gradiently cooling the cable to approximately room temperature with a pressurized cooling fluid; and
- applying internal pressure through said conductor outwardly against the insulation structure, and maintaining the internal pressure throughout said cooling step, said internal pressure being less than that of said cooling fluid.
- 2. An electrochemical tree resistant high voltage electrical cable manufactured by the method of claim 1.
- 3. An insulated cable fabricated in accordance with the method of claim 2 wherein the insulation is a crosslinked polyethylene copolymer.
- 4. An insulated cable fabricated in accordance with the method of claim 3 wherein said polyethylene copolymer is unfilled, has a melt index of at least one, and contains at least five percent vinyl acetate or ethylacrylate.
- 5. In an apparatus for extruding an insulation layer over an electrical conductor including means for accepting the conductor, means operatively connected to said accepting means for extruding the insulation layer over said conductor, means operatively connected to said extruding means for curing the insulation layer and means operatively connected to said curing means for cooling said insulation layer, the improvment comprising:
- a source of pressurized fluid;
- means operatively connected to said accepting means for injecting said pressurized fluid into said conductor for applying pressure outwardly against the insulation layer during the cooling thereof by said cooling means.
- 6. The apparatus of claim 5 further comprising:
- means operatively connected to said curing means and said cooling means for applying external pressure inwardly against the insulation layer, said external pressure being greater than said internal pressure.
- 7. Apparatus in accordance with claim 6, wherein said curing means comprises:
- a mini-curing pipe connecting said extruding means to said cooling means;
- a source of pressurized fluid having an ingredient characterized by a dielectric constant less than 20, a resistivity greater than 10.sup.10 ohm-cm., a boiling point at curing pressure of greater than 85.degree. C. and a molecular weight of less than 300.
- 8. The apparatus of claim 5 wherein the diameter of the means for extruding said insulation layer over said conductor is substantially equal to the diameter of said insulation layer.
Parent Case Info
The present application is a continuation of application Ser. No. 235,090 filed Feb. 17, 1981, now U.S. Pat. No. 4,354,992, which was a continuation-in-part of Ser. No. 147,212 filed May 6, 1980, now abandoned.
US Referenced Citations (14)
Foreign Referenced Citations (1)
Number |
Date |
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505162 |
May 1939 |
GBX |
Continuations (1)
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Date |
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Parent |
235090 |
Feb 1981 |
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Continuation in Parts (1)
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147212 |
May 1980 |
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