Two-Component Adhesive for Fabrication of Semifinished Products and Sandwich Composites

Abstract
Two-component adhesives (K), which includes two components K1 and K2. Component K1 includes at least one epoxy resin A with more than one epoxy group per molecule on average; at least one epoxy adduct B with more than one epoxy group per molecule on average that is an epoxy adduct of type B1 and optionally combined with an epoxy adduct of type B2; at least one reaction product F between an epoxy adduct B and a compound C, which has at least two isocyanate groups, in addition to at least one curing agent D for epoxy resins, which is activated by increased temperature. The component K2 comprises a compound E, which includes at least two isocyanate groups.
Description

BRIEF DESCRIPTION OF THE DRAWINGS

Fabrication of a semifinished product H or a sandwich composite S is further illustrated schematically below with the help of the drawings. The same reference numbers are attached to the same elements in the different figures. Movements and forces are indicated by arrows.



FIG. 1 shows a schematic representation of development of strength or viscosity of adhesive K as a function of time.



FIG. 2 schematically shows the fabrication of a semifinished product H.



FIG. 3 schematically shows the fabrication and design of formed part U and sandwich composite S.





In FIG. 1, the time is divided into 5 periods. The durations of these periods are not drawn to scale.


The first time period I indicates the situation before mixing. At least component K1 is heated, and consequently its viscosity η1 decreases. In this example, component K2 is not heated and has viscosity η2.


The second time period II indicates the situation during mixing. The mixture of components K1 and K2 has viscosity ηM immediately after mixing.


The third time period III indicates the stage of crosslinking and storage of semifinished product H. The strength or viscosity rises, due to cooling and crosslinking, from the mixture viscosity ηM to a constant viscosity or strength ηH of the semifinished product H.


The fourth time period IV indicates the forming process. The viscosity or strength remains essentially constant during the forming process.


The fifth time period V indicates the curing and construction of sandwich composite S. The viscosity or strength rises throughout the second crosslinking stage, and after cooling reaches the final strength ηE of the sandwich composite S.



FIG. 2 schematically shows the fabrication of a semifinished product H. This is shown on a schematic cross section by means of an example of industrial equipment for fabrication of semifinished products. At least component K1 is heated. The two components K1 and K2 of the two-component adhesive K are added to application device 1, where they are mixed using mixing elements. The mixed adhesive K then is applied at the outlet end to moving substrate S1. Further downstream, the adhesive K makes contact with a second substrate S2 and is pressed to the desired thickness by the rotating rollers 3. Further downstream, cooling station 4 is shown. In the example shown, cooling is carried out by blowing cool air 5. Not shown is the finishing further downstream, such as a cutting station and a stacking unit for preparing a stack of semifinished product H cut to length or a coiling station for semifinished product H as coils.



FIG. 3 schematically shows, in cross section, different times in fabrication of a formed part U and a sandwich composite S.



FIG. 3
a here shows a semifinished product H which is placed in a forming apparatus. The forming apparatus has a die cavity 6 as well as a punch 7. The punch 7 is moved toward the die cavity by means of a press, such as a hydraulic press, whereby semifinished product H is pressed into the recess of die cavity 6 by the punch.



FIG. 3
b shows the final stage of the pressing process. Formed part U was made from semifinished product H, which had conformed to the contours of die cavity 6 without wavy, puckered, or wrinkled bulges being formed and without the adhesive being squeezed out from between substrates S1 and S2.



FIG. 3
c shows formed part U as it comes out of the forming apparatus.


Finally, FIG. 3d shows the finished sandwich composite S, which is obtained from shaped part U after heating by means of a heater. Heating activates resin D, which leads to further crosslinking and achievement of the final properties.


LIST OF REFERENCE NUMBERS



  • K adhesive

  • K1 first component

  • K2 second component

  • S1 first substrate

  • S2 second substrate

  • H semifinished product

  • U formed part

  • S sandwich composite


  • 1 application device


  • 2 mixing element


  • 3 roller


  • 4 cooling station


  • 5 cool air


  • 6 die cavity


  • 7 punch

  • Δ punch

  • p pressure



EXAMPLES

A few examples are given below which illustrate the invention further but do not limit the scope of the invention in any way. The raw materials used in the examples are as follows:









TABLE 1







Raw materials used.








Raw materials used
Supplier





Dimerized C18 fatty acid (Pripol ™ 1013)
Uniquema


Adipic acid
BASF


2,2-Bis(4-hydroxyphenyl)propane
Fluka AG


Bis(4-hydroxyphenyl)sulfone
Fluka AG


Bisphenol A diglycidyl ether (= DGEBA)
Vantico


Polypropylene glycol diglycidyl ether (ED-506)
Asahi-Denka Kogyo


Polypropylene ether polyol (Mw = 2000 g/mol)
Bayer


Desmodur ® CD
Bayer


4,4′-Diphenylmethylene diisocyanate (= MDI)
Bayer


Triphenylphosphine
Fluka


CAB-O-SIL ® TS-720
Cabot


Dibutyltin dilaurate (DBTDL)
Fluka


Dicyanodiamide (= Dicy)
SKW Troisdorf


Cardolite ® NC-513
Cardanol


Ceramic hollow spheres/E-Spheres SL-125
Osthoff-Petrasch









General preparation for preparing epoxy adduct B and its mixture with A (=A/B premix):


A/B Premix PM1


Under vacuum and with stirring at 110° C., 123.9 g of a dimeric fatty acid, 1.1 g triphenylphosphine, and 57.3 g adipic acid were reacted for 5 hours with 658 g of liquid DGEBA epoxy resin, with epoxy content of 5.45 eq/kg, until a constant epoxy concentration of 2.85 eq/kg was achieved. After the end of the reaction, an additional 226.3 g of liquid DGEBA epoxy resin was added to the reaction mixture.


Then other mixtures PM2 to PM4 were prepared. For this purpose, the adipic acid was replaced by various aromatic alcohols in such a way that a theoretically identical epoxy content of 2.80-2.95 eq/kg was achieved in the binder:


A/B Premix PM2


Under vacuum and with stirring at 110° C., 123.9 g of a dimeric fatty acid, 1.1 g triphenylphosphine, and 95.0 g of 2,2-bis(4-hydroxyphenyl)propane (=bisphenol A) were reacted for 5 hours with 658 g of liquid DGEBA epoxy resin, with epoxy content of 5.45 eq/kg, until a constant epoxy concentration of 2.95 eq/kg was achieved. After the end of the reaction, an additional 226.3 g of liquid DGEBA epoxy resin was added to the reaction mixture.


A/B Premix PM3


Under vacuum and with stirring at 110° C., 123.9 g of a dimeric fatty acid, 28.3 g adipic acid, 1.1 g triphenylphosphine, and 47.3 g bis(4-hydroxyphenyl)sulfone were reacted for 5 hours with 658 g of liquid DGEBA epoxy resin, with epoxy content of 5.45 eq/kg, until a constant epoxy concentration of 2.85 eq/kg was achieved. After the end of the reaction, an additional 226.3 g of liquid DGEBA epoxy resin was added to the reaction mixture.


A/B Premix PM4


Under vacuum and with stirring at 110° C., 123.9 g of a dimeric fatty acid, 1.1 g triphenylphosphine, and 71.3 g bis(4-hydroxyphenyl)sulfone were reacted for 5 hours with 658 g of liquid DGEBA epoxy resin, with epoxy content of 5.45 eq/kg, until a constant epoxy concentration of 2.82 eq/kg was achieved. After the end of the reaction, an additional 226.3 g of liquid DGEBA epoxy resin was added to the reaction mixture.


Compound C1


A polyurethane prepolymer was prepared from MDI flakes (4,4-diphenylmethylene diisocyanate) and a polypropylene glycol with molecular weight of 2000 g/mol. The prepolymer had an NCO content of 3.7%.


Preparation of Adhesive K


Adhesive Formulations


Various adhesive compositions were prepared as specified in Table 2. In component K1, the A/B premix was uniformly mixed with prepolymer C1, dibutyltin dilaurate, Dicy, and Cabosil in a planetary mixer at a temperature of 95° C. under vacuum. Then ceramic hollow spheres were added and stirred at a stirring speed that was not too fast, in order to avoid breaking the hollow spheres. Then a cartridge was filled with K1 at a temperature between 85° C. and 95° C.


Components K1 and K2 were mixed well, in the ratio specified in Table 2, at a temperature between 85° C. and 95° C. in a Schramoid and added to a cartridge, and applied within 10 minutes after the end of mixing. For Ref. 2, no component K2 was added.


Application


Fabrication of a Semifinished Product


The adhesive, as specified in Table 2, was applied to 0.25 mm thick oiled steel sheet, covered with a second identical oiled steel sheet, and pressed to an adhesive thickness of 1 mm with a press equilibrated at about 100° C. After cooling, for adhesives K-1 to K-5 the adhesion of the sheet metal is good, so the composites can be easily handled.









TABLE 2







Adhesive formulations














Designation
K-1
K-2
K-3
K-4
K-5
Ref. 1
Ref. 2

















1. Component K1









A/B-PM1 [g]
42.4




42.4
42.4


A/B-PM2 [g]

42.4







A/B-PM3 [g]


42.4






A/B-PM4 [g]



42.4
42.4




C1 [g]
26.7
26.7
26.7
26.7
22.2

26.7


ED-506 (G) [g]
2.0
2.0
2.0
2.0
2.0
2.0
2.0


CAB-O-SIL ® [g]
1.3
1.3
1.3
1.3
1.2
1.3
1.3


Dicy (D)
2.2
2.2
2.2
2.2
2.2
2.2
2.2


DBTL [g]
0.02
0.02
0.02
0.02
0.02

0.02


E-Spheres SL-125 [g]
24.9
24.9
24.9
24.9
23.1
24.9
24.9


Total
99.5
99.5
99.5
99.5
93.1
72.8
99.5


2. Component K2


Desmodur CD[g]
100
100
100
100
26.7
100
0


C1 (g]




33.3


CAB-O-SIL ® [g]




1.3


Cardolite ® NC-513 [g]




8.0


E-Spheres SL-125 [g]




30.7


Total
100
100
100
100
100
100
0


K2/K1 [w/w]
0.54%
0.54%
0.54%
0.54%
14.3%
0.54%
n.a.









In addition, when pressure is applied again by means of a press, the adhesive is not squeezed out. For the comparison adhesives Ref. 1 and Ref. 2, however, the adhesive was squeezed out when pressure was applied.


Example K-5Al corresponds to K-5, except that aluminum sheet of thickness 0.25 mm was used as the substrate instead of steel sheet.


As reference example Al/PP, 1 mm polypropylene was prepared as an interlayer between two aluminum sheets of thickness 0.25 mm.


Preparation of a Formed Part


To test the formability of the fabricated semifinished products, the deep-drawing properties were determined with the Erichsen cupping tester. A disk of diameter 64 mm was punched out from the semifinished product. A small cup-shaped indentation, a dome shape with diameter 40 mm and depth 20 mm, was deep-drawn. A ring-shaped lower holder prevented the adhesive compounds from peeling off the edge of the sheet metal.


All adhesives K-1 to K-5 could be easily formed, and there was no or only slight squeezing out of the adhesive. The reference adhesives Ref. 1 and Ref. 2 showed considerable squeezing out of the adhesive, so that at some spots essentially no more adhesive could be found between the pieces of sheet metal.


Comparing adhesives K-4 and K-5, it could be determined that K-5 exhibited better properties in deep drawing.


All adhesives K-1 to K-5 also showed identical behavior after 6 months, according to some stored semifinished stock material.


Preparation of a Sandwich Composite


All formed parts with adhesives K-1 to K-5 were cured in an oven for 25 minutes at 180° C. They all show very good curing, excellent adhesion, and good impact strength.


Since the mechanical properties have to be measured on flat substrates, we could not use the formed parts as the starting point but rather used the respective semifinished products H as follows:


The fabricated semifinished products were cured in an oven for 25 minutes at 180° C. After cooling, the mechanical properties of the sandwich composites were determined for K-5 and K-5Al.


As the reference to be compared with the sandwich composites S, we used 1.5 mm thick aluminum sheet Al-1.5 as well as polypropylene-reinforced composite Al/PP.


Test Methods


T-peel strength (DIN 53282, ISO 11339)


This test method measures the force vertical to the adhesive surface. The dimensions of T-peel strength are N/mm (=average force [N] divided by the width of the test piece [mm]).


3-point bending strength (ISO 178)


The bending strength is the strength under a 3-point bending load with 20 cm span, where a 25 [missing units] wide test piece is used. The strength [N] is measured for bending of 2 mm, 5 mm, and 10 mm.


Results


From the results in Table 3, obviously the sandwich composites according to the invention are considerably stronger than massive aluminum sheet (Al-1.5) or Al-polypropylene composite (Al/PP), despite their much reduced weight.


It has been additionally shown that the sandwich composites have exceptionally good aging resistance and adhesion, as proven by the cataplasma test (70° C./100% relative air humidity).









TABLE 3







Mechanical properties of sandwich composites.











Designation
K-5
K-5Al
Al-1.5(Ref.)
Al/PP(Ref.)














T-peel strength (H) [N/mm]
4.0





T-peel strength (S) [N/mm]
4.4
2.37


3-point bending strength


(S) [N]


 2 mm bend
136
173
43
94


 5 mm bend
175
244
85
157


10 mm bend
200
306
132
177


after 7 days poultice


 2 mm bend

186


 5 mm bend

263


10 mm bend

325








Claims
  • 1. A two-component adhesive K comprising: a component K1 and a component K2, wherein:(a) component K1 comprises: at least one epoxy resin A having more than one epoxy group per molecule on average;at least one epoxy adduct B, wherein each epoxy adduct B has more than one epoxy group and more than one hydroxyl group per molecule on average;at least one product F of a reaction between an epoxy adduct B and a compound C with at least two isocyanate groups; andat least one curing agent D for epoxy resins, which is activated by elevated temperature; and(b) component K2 comprises: at least one compound E with at least two isocyanate groups; wherein: epoxy adduct B is an epoxy adduct B1 obtained from at least one dicarboxylic acid and at least one diglycidyl ether;and is optionally combined with an epoxy adduct B2 obtained from at least one bis(aminophenyl)sulfone isomer or at least one aromatic alcohol and at least one diglycidyl ether.
  • 2. The adhesive according to claim 1, wherein epoxy resin A is a liquid resin.
  • 3. The adhesive according to claim 1, wherein the dicarboxylic acid is a dimeric fatty acid and the diglycidyl ether is selected from the group consisting of bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, and bisphenol A/F diglycidyl ether.
  • 4. The adhesive according to claim 1, wherein: epoxy adduct B2 is prepared from at least one aromatic alcohol and at least one diglycidyl ether,the aromatic alcohol is selected from the group consisting of 2,2-bis(4-hydroxyphenyl)propane, bis(4-hydroxyphenyl)methane, bis(4-hydroxyphenyl)sulfone, hydroquinone, resorcinol, pyrocatechol, naphthohydroquinone, naphthoresorcinol, dihydroxynaphthalene, dihydroxyanthraquinone, dihydroxybiphenyl, 3,3-bis(p-hydroxyphenyl)phthalide, 5,5-bis(4-hydroxyphenyl)hexahydro-4,7-methanoindane, and isomers thereof; andthe diglycidyl ether is selected from the group consisting of bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, and bisphenol A/F diglycidyl ether.
  • 5. The adhesive according to claim 1, wherein epoxy adduct B has a molecular weight of 700-6000 g/mol.
  • 6. The adhesive according to claim 1, wherein compound C is a polyurethane prepolymer C2 having isocyanate groups, which is synthesized from at least one polyisocyanate C1 and from at least one polyol.
  • 7. The adhesive according to claim 1, wherein the reaction product F has the structure
  • 8. The adhesive according to claim 1, wherein curing agent D is a latent curing agent selected from the group consisting of dicyanodiamide, guanamine, guanidine, and aminoguanidine.
  • 9. The adhesive according to claim 1, wherein compound E is a polyisocyanate or a polyurethane prepolymer having isocyanate groups, which is synthesized from at least one polyisocyanate and from at least one polyol.
  • 10. The adhesive according to claim 1, wherein a total proportion of epoxy resin A and epoxy adduct B together is 10-60 wt. % based on a total weight of adhesive K.
  • 11. The adhesive according to claim 1, further comprising at least one filler in a proportion of 5-30 wt. % based on a total weight of adhesive K.
  • 12. The adhesive according to claim 1, further comprising at least one reactive diluent with epoxy groups.
  • 13. A method for fabrication of a semifinished product H using the adhesive according to claim 1, comprising: heating component K1 to a temperature between 130° C. and 60° C.;mixing together components K1 and K2;applying the mixed adhesive K to a flat substrate S1; andcontacting the adhesive K on substrate S1 with a flat substrate S2 so that the mixed adhesive K is placed between substrates S1 and S2.
  • 14. The method according to claim 13, wherein the flat substrate S1 consists of the same material as the flat substrate S2.
  • 15. The method according to claim 13, wherein at least one of substrates S1 or S2 is sheet metal.
  • 16. The method according to claim 15, wherein the sheet metal has a thickness between 0.5 mm and 0.1 mm.
  • 17. The method according to claim 13, wherein components K1 and K2 are mixed in such a ratio that the OH/NCO ratio is ≧2:1.
  • 18. The method according to claim 13, wherein the semifinished product H is subsequently coiled into a roll and stored in the form of a coil; oris cut to length and the semifinished product H, cut to length, is stored in the form of a stack.
  • 19. The semifinished product H fabricated according to the method of claim 13.
  • 20. A method for fabrication of a sandwich composite S, wherein the semifinished product H according to claim 19 undergoes a forming process and is heated to a temperature between 130° C. and 230° C.
  • 21. The sandwich composite S fabricated according to claim 20.
  • 22. An automotive assembly composite, comprising the sandwich composite S according to claim 21.
  • 23. The adhesive according to claim 1, wherein epoxy resin A is a liquid resin selected from the group consisting of bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, and bisphenol A/F diglycidyl ether.
  • 24. The adhesive according to claim 3, wherein the dicarboxylic acid is a dimeric C4-C20 fatty acid.
  • 25. The adhesive according to claim 1, wherein epoxy adduct B has a molecular weight of 900-4000 g/mol.
  • 26. The adhesive according to claim 1, wherein epoxy adduct B has a molecular weight of 1000-3300 g/mol.
  • 27. The adhesive according to claim 6, wherein the polyol is a polyoxyalkylene polyol.
  • 28. The adhesive according to claim 6, wherein the polyol is a polyoxyalkylene diol.
  • 29. The adhesive according to claim 9, wherein the polyol of compound E is a polyoxyalkylene polyol.
  • 30. The adhesive according to claim 9, wherein the polyol of compound E is a polyoxyalkylene diol.
  • 31. The adhesive according to claim 1, wherein a total proportion of epoxy resin A and epoxy adduct B together is 15-55 wt. % based on a total weight of adhesive K.
  • 32. The adhesive according to claim 1, further comprising at least one filler in a proportion of 10-25 wt. % based on a total weight of adhesive K.
  • 33. The method according to claim 13, wherein: the step of contacting the adhesive K on substrate S1 with a flat substrate S2 further comprises applying pressure to at least one of substrates S1 or S2 during or after contact is made with substrate S2.
  • 34. The method according to claim 15, wherein the sheet metal is steel sheet or aluminum sheet.
  • 35. The method according to claim 34, wherein the sheet metal is oiled.
  • 36. The method according to claim 15, wherein the sheet metal has a thickness between 0.4 mm and 0.2 mm.
  • 37. The method according to claim 13, wherein components K1 and K2 are mixed in such a ratio that the OH/NCO ratio is 2:1 to 50:1.
  • 38. A method for fabrication of a sandwich composite S, wherein the semifinished product H according to claim 19 undergoes a forming process and is heated to a temperature between 170° C. and 190° C.
  • 39. The method according to claim 13, wherein component K1 is heated to a temperature between 130° C. and 80° C.
  • 40. The method according to claim 13, wherein component K1 is heated to a temperature between 100° C. and 90° C.
Priority Claims (1)
Number Date Country Kind
04004189.9 Feb 2004 EP regional
PCT Information
Filing Document Filing Date Country Kind 371c Date
PCT/EP05/50801 2/25/2005 WO 00 10/5/2007