Claims
- 1. A method for coating wood comprising electrostatically spraying a coating powder selected from the group consisting of
- (A) a blend comprising (i) a powdered, extruded mixture of a self-curing epoxy resin and a catalyst therefore, and (ii) a powdered, low temperature curing agent; and
- (B) a blend comprising (i) a powdered, extruded mixture of a self-curing epoxy resin and an amount of a low temperature curing agent insufficient to cause substantial curing of the resin during extrusion, and (ii) a sufficient amount of the same or different low temperature curing agent in powder form to complete the curing of the resin onto a surface of the wood to a thickness of from about 3 to about 6 mils, and curing the powder at a temperature of from about 180.degree. F. up to but not including the decomposition temperature of the blend.
- 2. The method of claim 1 wherein the low temperature curing agent is an epoxy resin adduct of an aliphatic polyamine having a primary amino group.
- 3. The method of claim 1 wherein the catalyst is an epoxy adduct of an imidazole having the general formula: ##STR2## wherein R.sup.1, R.sup.2, R.sup.3, and R.sup.4 are independently hydrogen or any substituent which is not reactive with the epoxy resin.
- 4. The method of claim 1 wherein the electrostatic spraying is triboelectric. .Iadd.
- 5. A method for coating a heat sensitive substrate comprising applying a coating powder selected from the group consisting of
- (A) a blend comprising
- (i) a powdered, extruded mixture of an epoxy resin and a catalyst therefore, and (ii) a powdered, low temperature curing agent; and
- (B) a blend comprising
- (i) a powdered, extruded mixture of an epoxy resin and an amount of a low temperature curing agent insufficient to cause substantial curing of the resin during extrusion, and (ii) a sufficient amount of the same or different low temperature curing agent in powder form to complete the curing of the resin
- onto a surface of the substrate to a thickness of at least about 1 mil, and curing the powder at a temperature of from about 180.degree. F. up to but not including the decomposition temperature of the blend..Iaddend..Iadd.
- 6. The method of claim 5 wherein the low temperature curing agent is an epoxy resin adduct of an alipbatic polyamine having a primary or secondary amino group..Iaddend..Iadd.7. The method of claim 5 wherein the powder is electrostatically sprayed onto the surface..Iaddend..Iadd.8. The method of claim 5 wherein the catalyst is an imidazole having the general formula: ##STR3## wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4 are independently hydrogen or any substituent which is not reactive with the epoxy resin..Iaddend..Iadd.9. The method of claim 2 wherein the catalyst is an epoxy adduct of an imidazole having the general formula: ##STR4## wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4 are independently hydrogen or any substituent which is not reactive with the epoxy resin..Iaddend..Iadd.10. The method of claim 2 wherein the catalyst is an imidazole having the general formula: ##STR5## wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4 are independently hydrogen or any substituent which is not reactive with the epoxy resin..Iaddend.
Parent Case Info
This is a continuation in part of application Ser. No. 08/729,608 filed Oct. 11, 1996; which is a C-I-P of Ser. No. 08/643,694 filed on May 6, 1996 both now abandoned
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
3384610 |
Lee |
May 1968 |
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5212263 |
Schreffler |
May 1993 |
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Foreign Referenced Citations (1)
Number |
Date |
Country |
2418754 |
Nov 1974 |
DEX |
Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
729608 |
Oct 1996 |
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Parent |
643694 |
May 1996 |
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Reissues (1)
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Number |
Date |
Country |
Parent |
810745 |
Mar 1997 |
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