Patent Application
20230064787
The present disclosure relates to a heat dissipation structure, and more particularly to a two-phase immersion type heat dissipation fin composite structure.
An immersion cooling technology is to directly immerse heat producing elements (such as servers and disk arrays) into a coolant that is non-conductive, and heat generated from operation of the heat producing elements is removed through an endothermic gasification process of the coolant. Therefore, how to dissipate heat more effectively through the immersion cooling technology has long been an issue to be addressed in the industry.
In response to the above-referenced technical inadequacy, the present disclosure provides a two-phase immersion type heat dissipation fin composite structure.
In one aspect, the present disclosure provides a two-phase immersion type heat dissipation fin composite structure. The two-phase immersion type heat dissipation fin composite structure includes a heat dissipation base layer, a bubble activation layer, and a fin structure. The bubble activation layer is immersed in a two-phase coolant for increasing an amount of bubbles that is generated. The fin structure and the bubble activation layer are formed on the heat dissipation base layer.
In an exemplary embodiment, the bubble activation layer is a porous metal sintered layer formed on the heat dissipation base layer by sintering of metal powder, and the bubble activation layer is in contact with the fin structure.
In an exemplary embodiment, the bubble activation layer is a porous metal sprayed layer formed by spraying solid phase metal powder onto the heat dissipation base layer, and the bubble activation layer is in contact with the fin structure.
In an exemplary embodiment, the bubble activation layer is a porous metal sintered layer formed on the heat dissipation base layer by sintering of metal powder, and the bubble activation layer is not in contact with the fin structure.
In an exemplary embodiment, the bubble activation layer is a porous metal sprayed layer formed by spraying solid phase metal powder onto the heat dissipation base layer, and the bubble activation layer is not in contact with the fin structure.
In another aspect, the present disclosure provides a two-phase immersion type heat dissipation fin composite structure. The two-phase immersion type heat dissipation fin composite structure includes a heat dissipation base layer, a bubble activation layer, and a fin structure. The bubble activation layer is immersed in a two-phase coolant for increasing an amount of bubbles that is generated. The bubble activation layer is formed on the heat dissipation base layer, and the fin structure is formed on the bubble activation layer.
In an exemplary embodiment, the bubble activation layer is a porous metal sintered layer formed on the heat dissipation base layer by sintering of metal powder.
In an exemplary embodiment, the bubble activation layer is a porous metal sprayed layer formed by spraying solid phase metal powder onto the heat dissipation base layer.
In an exemplary embodiment, the bubble activation layer is a porous metal sintered layer formed on the heat dissipation base layer by sintering of metal powder, and the bubble activation layer covers the fin structure.
In an exemplary embodiment, the bubble activation layer is a porous metal sprayed layer formed by spraying solid phase metal powder onto the heat dissipation base layer, and the bubble activation layer covers the fin structure.
Therefore, one of the beneficial effects of the present disclosure is that, in the two-phase immersion type heat dissipation fin composite structure provided by the present disclosure, by virtue of “the heat dissipation base layer”, “the bubble activation layer”, and “the fin structure”, not only can thermal conductivity be increased, but a quantity of bubbles formed through an endothermic gasification process of the two-phase coolant can also be significantly increased, thereby further enhancing a heat dissipation effect.
These and other aspects of the present disclosure will become apparent from the following description of the embodiment taken in conjunction with the following drawings and their captions, although variations and modifications therein may be affected without departing from the spirit and scope of the novel concepts of the disclosure.
The described embodiments may be better understood by reference to the following description and the accompanying drawings, in which:
The present disclosure is more particularly described in the following examples that are intended as illustrative only since numerous modifications and variations therein will be apparent to those skilled in the art. Like numbers in the drawings indicate like components throughout the views. As used in the description herein and throughout the claims that follow, unless the context clearly dictates otherwise, the meaning of “a”, “an”, and “the” includes plural reference, and the meaning of “in” includes “in” and “on”. Titles or subtitles can be used herein for the convenience of a reader, which shall have no influence on the scope of the present disclosure.
The terms used herein generally have their ordinary meanings in the art. In the case of conflict, the present document, including any definitions given herein, will prevail. The same thing can be expressed in more than one way. Alternative language and synonyms can be used for any term(s) discussed herein, and no special significance is to be placed upon whether a term is elaborated or discussed herein. A recital of one or more synonyms does not exclude the use of other synonyms. The use of examples anywhere in this specification including examples of any terms is illustrative only, and in no way limits the scope and meaning of the present disclosure or of any exemplified term. Likewise, the present disclosure is not limited to various embodiments given herein. Numbering terms such as “first”, “second” or “third” can be used to describe various components, signals or the like, which are for distinguishing one component/signal from another one only, and are not intended to, nor should be construed to impose any substantive limitations on the components, signals or the like.
Reference is made to
In the present embodiment, the heat dissipation base layer 1 can be used to contact heat producing elements, and the heat dissipation base layer 1 can be made of a material with high thermal conductivity, such as aluminum, copper, silver, or an alloy thereof.
In the present embodiment, the fin structure 3 is formed on the heat dissipation base layer 1. Furthermore, the fin structure 3 can include a plurality of fins 31 that are arranged at intervals and are connected to a surface of the heat dissipation base layer 1. The fins 31 and the heat dissipation base layer 1 can be integrally formed or formed by welding. Moreover, the fins 31 can be made of a material with high thermal conductivity, such as aluminum, copper, silver, or an alloy thereof.
It is worth mentioning that, the two-phase immersion type heat dissipation fin composite structure provided in the present embodiment includes the bubble activation layer 2 that is immersed in a two-phase coolant 4 (such as FLUORINERT) for increasing an amount of bubbles that is generated, so as to enhance a heat dissipation effect.
More specifically, the bubble activation layer 2 provided in the present embodiment is a porous metal sintered layer formed on the heat dissipation base layer 1 by sintering of metal powder, and the bubble activation layer 2 is in contact with the fin structure 3.
In addition, since porous structures are formed on an inside and on a surface of the porous metal sintered layer, a quantity of bubbles formed through an endothermic gasification process of the two-phase coolant 4 can be significantly increased, thereby greatly enhancing the heat dissipation effect.
Moreover, the bubble activation layer 2 provided in the present embodiment can also be a porous metal sprayed layer formed by spraying solid phase metal powder onto the heat dissipation base layer 1, and the bubble activation layer 2 is in contact with the fin structure 3.
Furthermore, the bubble activation layer 2 provided in the present embodiment can also be a porous metal coating or a porous metal mesh.
Reference is made to
More specifically, in the present embodiment, the bubble activation layer 2 is a porous metal sintered layer formed on the heat dissipation base layer 1 by sintering of metal powder, and the bubble activation layer 2 is not in contact with the fin structure 3. Moreover, the bubble activation layer 2 can also be a porous metal sprayed layer formed by spraying solid phase metal powder onto the heat dissipation base layer 1, and the bubble activation layer 2 is not in contact with the fin structure 3. Since the bubble activation layer 2 formed on the heat dissipation base layer 1 is not in contact with the fin structure 3, a plurality of microchannels are formed between the bubble activation layer 2 and the fin structure 3, which allows for circulation of gas and liquid.
Reference is made to
More specifically, in the present embodiment, the bubble activation layer 2 is a porous metal sintered layer formed on the heat dissipation base layer 1 by sintering of metal powder. Moreover, the bubble activation layer 2 can also be a porous metal sprayed layer formed by spraying solid phase metal powder onto the heat dissipation base layer 1. Through the bubble activation layer 2 being formed between the heat dissipation base layer 1 and the fin structure 3, the amount of bubbles that is generated between the heat dissipation base layer 1 and the fin structure 3 is increased to enhance the heat dissipation effect.
Reference is made to
More specifically, in the present embodiment, the bubble activation layer 2 is a porous metal sintered layer formed on the heat dissipation base layer 1 by sintering of metal powder, and the fin structure 3 is covered by the bubble activation layer 2. Moreover, the bubble activation layer 2 can also be a porous metal sprayed layer formed by spraying solid phase metal powder onto the heat dissipation base layer 1, and the fin structure 3 is covered by the bubble activation layer 2. Through the bubble activation layer 2 being formed on the heat dissipation base layer 1 and covering the fin structure 3, the amount of bubbles that is generated in a fin area is further increased to enhance the heat dissipation effect.
In conclusion, one of the beneficial effects of the present disclosure is that, in the two-phase immersion type heat dissipation fin composite structure provided by the present disclosure, by virtue of “the heat dissipation base layer 1”, “the bubble activation layer 2”, and “the fin structure 3”, not only can thermal conductivity be increased, but the quantity of bubbles formed through the endothermic gasification process of the two-phase coolant can also be significantly increased, thereby further enhancing the heat dissipation effect.
The foregoing description of the exemplary embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching.
The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others skilled in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present disclosure pertains without departing from its spirit and scope.
