Among other things, the present application relates to pumping fluid with heat.
In many cooling systems, a cooling fluid (which can be a liquid, a gas, and/or a vapor) receives heat from a heat source (e.g., a vehicle engine, warm air, a computer server). To preserve cooling fluid, the cooling systems are often closed, meaning that the cooling fluid circles the cooling system in a closed loop (i.e., the cooling fluid is sealed within the cooling system). The cooling fluid will often cycle between an evaporator (a heat exchanger where the cooling fluid accepts heat from the heat source) and a condenser (a heat exchanger where the cooling fluid rejects heat into another fluid, such as ambient air or ambient water).
Closed systems often incorporate a fluid pump (e.g., a gas compressor, a liquid pump, a wick) to cycle the cooling fluid within the system. Fluid pumps consume energy, can be expensive to maintain, and can be unreliable. Furthermore, closed systems refrain from consuming the cooling fluid (e.g., as fuel) since doing so would deplete the cooling power of the system.
Open (also called expendable) cooling systems can omit a fluid pump. In some open cooling systems, a tank of liquid nitrogen (often maintained at −196° C. on sea level) is connected to an evaporator. The cold nitrogen flows from the tank and into the evaporator, where the nitrogen accepts heat from a hot target.
Liquid nitrogen has a relatively small amount of latent heat, meaning that liquid nitrogen stored in the tank tends to vaporize into a gas. As a result, the tank often includes a relief valve, which releases vaporized liquid nitrogen into ambient. Although the relief valve can maintain saturation conditions within the tank (i.e., retain the majority of nitrogen in a liquid state), releasing vaporized nitrogen is wasteful. Furthermore, pure nitrogen cannot be combusted as fuel.
A thermal system according to a first aspect of the present disclosure can include a fluid storage tank configured to store a cooling fluid in a liquid state and a gas state. The thermal system can include a first heat exchanger configured to release heat into the fluid storage tank. The thermal system can include a second heat exchanger disposed fluidly downstream of the fluid storage tank and configured to exchange heat between the cooling fluid and a heat load. The thermal system can include a pressure control device disposed fluidly downstream of the second heat exchanger. One of the first cooling fluid that has been heated by the second heat exchanger or a second cooling fluid different than the first cooling fluid can pass through the first heat exchanger and thereby heats upstream first cooling fluid resident in the fluid storage tank.
A method according to a further aspect of the present disclosure can include providing a fluid storage tank configured to store a first cooling fluid in a liquid state and a gas state, providing a first heat exchanger configured to release heat into the fluid storage tank, arranging a second heat exchanger fluidly downstream of the fluid storage tank and configured to exchange heat between the first cooling fluid and a heat load, arranging a pressure control device fluidly downstream of the second heat exchanger, and directing one of the first cooling fluid that has been heated by the second heat exchanger or a second cooling fluid different than the first cooling fluid through the first heat exchanger so as to heat upstream first cooling fluid resident in the fluid storage tank.
A thermal system is disclosed. The thermal system can include means for heating cooling fluid stored in a fluid vessel with combusted cooling fluid. A rate of the combustion can be controlled based on a temperature and/or pressure of the stored cooling fluid.
A thermal system is disclosed. The thermal system can include a fluid vessel. The fluid vessel can include a fluid storage tank configured to store a cooling fluid in a liquid state and a gas state. The fluid vessel can include a first heat exchanger configured to release heat into the fluid storage tank. The thermal system can include a second heat exchanger disposed fluidly downstream of the fluid storage tank and configured to exchange heat between the cooling fluid and a heat load via a secondary refrigerant.
The first heat exchanger can be fluidly downstream of the second heat exchanger such that cooling fluid, after being heated in the second heat exchanger, passes through the first heat exchanger and thereby heat upstream cooling fluid resident in the fluid storage tank. Alternatively, or in addition, the first heat exchanger can be in fluid communication with the secondary refrigerant such that the secondary refrigerant heats the cooling fluid resident in the fluid storage tank.
The above summary and the below detailed description of illustrative embodiments may be read in conjunction with the appended Figures. The Figures show some of the illustrative embodiments discussed herein. As further explained below, the claims are not limited to the illustrative embodiments. For clarity and ease of reading, some Figures omit views of certain features. Features are shown schematically.
Illustrative (i.e., example) embodiments are disclosed. The claims are not limited to the illustrative embodiments. Therefore, some implementations of the claims will have different features than in the illustrative embodiments. Changes to the claimed inventions can be made without departing from their spirit. The claims are intended to cover implementations with such changes.
At times, the present application uses directional terms (e.g., front, back, top, bottom, left, right, etc.) to give the reader context when viewing the Figures. Directional terms do not limit the claims. Any directional term can be replaced with a numbered term (e.g., left can be replaced with first, right can be replaced with second, and so on). Furthermore, any absolute term (e.g., high, low, etc.) can be replaced with a corresponding relative term (e.g., higher, lower, etc.).
Cooling fluid 102 can be a cryogenic cooling fluid, such as cryogenic oxygen, cryogenic nitrogen, cryogenic natural gas, and the like. Thus, the liquid phase 104 of cooling fluid 102 resident in fluid storage tank 120 can be liquid oxygen, liquid nitrogen, liquid natural gas (LNG), and the like. The gas phase 106 of cooling fluid 102 resident in fluid storage tank 120 can be maintained at the boiling temperature of the liquid phase cooling fluid 104. Gas phase cooling fluid 106 resident in fluid storage tank 120 can be in a saturated state and thus maintained at the saturation temperature of liquid phase cooling fluid 104 in storage tank 120. At least a portion of liquid phase cooling fluid 104 in fluid storage tank 120 can be at a sub-cooled temperature. Cooling fluid 102 does not need to be at a cryogenic temperature. According to some embodiments, cooling fluid 102 is water or another refrigerant (e.g., R-407A, R-22) at a non-cryogenic temperature.
First heat exchanger 130 can be configured to heat (e.g., boil) cooling fluid 102 resident in fluid storage tank 120 to build a desired pressure level therein. More specifically, first heat exchanger 130 can boil liquid cooling fluid 104 into gaseous cooling fluid 106 to build pressure within fluid storage tank 120. The pressure build within fluid storage tank 120 (i.e., within fluid vessel 100) can motivate fluid toward the other components of thermal system 100 (discussed below). As used herein, the term “heat” can include a heat transfer, but not necessarily a change in temperature, since the heat transfer can produce a change in phase (e.g., liquid to gas) without any change in temperature.
First heat exchanger 130 can be disposed within fluid storage tank 120. First heat exchanger 130 can be in thermal communication with fluid storage tank 120. First heat exchanger 130 can include a series of fluid lines and/or heat exchanger plates running through the liquid phase cooling fluid 104 within tank 120.
Alternatively, or in addition, first heat exchanger 130 can wrap about an outer surface of fluid storage tank 120. Referring to
As further discussed below, first heat exchanger 130 can use cooling fluid 102 heated by second heat exchanger 170 to heat cooling fluid 102 resident in vessel 110. Alternatively, or in addition, first heat exchanger 130 can use electrical energy to heat cooling fluid 102 resident in vessel 102. For example, and according to some embodiments, instead of carrying warm cooling fluid 102, tubes 132 can be resistive electrical elements configured to convert electrical current into heat.
Flow control valve 150 can modulate the rate of cooling fluid 102 departing fluid vessel 110. As shown in
Thus, and as shown in
As used herein, a three-way valve can be a single-piece three-way valve or a collection of two-way valves arranged to emulate a unitary three-way valve. As used herein, each opening of each three-way valve can be independently controllable. Alternatively, at least some (e.g., all) openings of three-way valves can be fixed. Therefore, as used herein, a three-way valve can be a T-junction. According to some embodiments, three-way valve 200 (e.g., three-way valves 200a, 200b, as further discussed below, are T-junctions).
With reference to
Cooling fluid 102 can directly exchange heat with the heat-producing element 182 in heat source 180 (e.g., cooling fluid 102 can flow through tubes in contact with a computer processor, cooling fluid 102 can flow through a vehicle engine). Alternatively, or in addition, and as shown in
Second heat exchanger 170 can therefore be a single-fluid heat exchanger (as in the case where cooling fluid 102 flows through tubes contacting a heat-producing element 182) or second heat exchanger 170 can be a dual-fluid (e.g., a counter-flow shell and tube) heat exchanger (as in the case where cooling fluid 102 directly exchanges heat with the secondary refrigerant flowing in closed loop 184). Via second heat exchanger 170, heat source 180 can reject heat into cooling fluid 102. Thus, cooling fluid 102 can depart heat source 180 as heated (e.g., warmed). Additional exemplary features of second heat exchanger 170 are discussed below with reference to
According to some embodiments, cooling fluid 102 departs second heat exchanger 170 at a temperature in excess of its saturated vapor temperature. Cooling fluid 102 can depart second heat exchanger 170 in a gaseous state. Cooling fluid 102 can depart second heat exchanger 170 in a saturated state. Cooling fluid 102 can depart second heat exchanger 170 as a super-heated and/or saturated gas. Cooling fluid 102 can depart second heat exchanger 170 at a temperature closer to the temperature of heat source 182 than the temperature of liquid phase fluid 104 in fluid storage tank 120.
Referring to
By flowing through fluid line 210 into first heat exchanger 130, cooling fluid 102 warmed (i.e., heated) by heat source 180 can heat cooling fluid 102 resident in fluid storage tank 120. Through this heating, the resident cooling fluid 102 can boil from a liquid phase 104 into a gas phase 106 (e.g., a saturated vapor gas phase) and thereby increase pressure within fluid storage tank 120 (i.e., within fluid vessel 110). The increased pressure within fluid storage tank 120 can push cooling fluid 102 (e.g., liquid cooling fluid flowing through line 140) out of fluid storage tank 120 and toward second heat exchanger 170). Thus, the heat imparted by warmed cooling fluid 102 via first heat exchanger 130 can serve as a pumping force for cold cooling fluid 102 resident in fluid vessel 110.
According to some embodiments, no mechanical pumping force is exerted on cooling fluid 102 resident in thermal system 100 (or at least cooling fluid 102 resident in thermal system upstream of three-way valve 200 and/or at least cooling fluid 102 resident in thermal system 100 upstream of second heat exchanger 170). Instead, the pumping force can be exclusively provided by (a) thermal heat transfer from heat source 180 into cooling fluid 102 and (b) thermal transfer from warm (i.e., heated) cooling fluid 102 flowing through first heat exchanger 130 by way of line 210 to cold (i.e., unheated) cooling fluid 102 resident in fluid storage tank 120 (i.e., fluid vessel 110). Thus, according to some embodiments, no mechanical pump (i.e., no mechanical compressor and no mechanical liquid pump) exists in system 100 that directly interacts with cooling fluid 102 (a mechanical liquid pump and/or gas compressor may interact with the refrigerant resident in closed cooling loop 184).
According to other embodiments, a mechanical liquid pump and/or a mechanical gas compressor can be provided to, for example, supplement the thermal pumping force with mechanical pumping force. According to some embodiments, first heat exchanger 130 is not present and pumping force is primarily provided by a mechanical liquid pump and/or a mechanical gas compressor.
Although three-way valve 200 is shown as being disposed directly between fluid lines 190 and 220, three-way valve 200 can be provided at other locations. For example, three-way valve 200 can be disposed at any location downstream of second heat exchanger 170. According to some examples, three-way valve 200 is disposed in line 240 or in line 260.
According to some embodiments, and as shown in
Referring now to
According to some embodiments, all three positions of three-way valve 290 are provided (i.e., one three-way valve is positioned as shown in
Referring to
Fluid line 240 can carry cooling fluid 102 from pressure control device 230 to turbine 250. As discussed below with reference to
Referring to
Referring now to
More specifically, and referring to
Referring to
According to some embodiments (not shown), heat producing element 182 is a component of turbine 250 (e.g., a bearing, a gearbox) and thus second heat exchanger 170 is used to cool turbine 250. According to some embodiments (not shown), turbine 250 is absent and power generation device 310 uses alternate means to extract energy from cooling fluid 102. Power generation device 310 can be a fuel-cell.
Fluid storage tank 120 (i.e., fluid vessel no) can be heated with refrigerant other than cooling fluid 102. Referring to
According to some embodiments, and as shown in
Referring to
Referring to
Processors 801 can include one or more distinct processors, each having one or more cores. Each of the distinct processors can have the same or different structure. Processors 801 can include one or more central processing units (CPUs), one or more graphics processing units (GPUs), circuitry (e.g., application specific integrated circuits (ASICs)), digital signal processors (DSPs), and the like. Processors 801 can be mounted on a common substrate or to different substrates.
Processors 801 are configured to perform a certain function, method, or operation at least when one of the one or more of the distinct processors is capable of executing code, stored on memory 802 embodying the function, method, or operation. Processors 801 can be configured to perform any and all functions, methods, and operations disclosed herein.
For example, when the present disclosure states that processing 800 performs/can perform task “X” (e.g., task “X is performed”), such a statement should be understood to disclose that processing system 800 can be configured to perform task “X”. Thermal system 100 and processing system 800 are configured to perform a function, method, or operation at least when processors 801 are configured to do the same. As used herein the term “determine”, when used in conjunction with processing 800 can mean detecting, receiving, looking-up, computing, and the like.
Memory 802 can include volatile memory, non-volatile memory, and any other medium capable of storing data. Each of the volatile memory, non-volatile memory, and any other type of memory can include multiple different memory devices, located at multiple distinct locations and each having a different structure.
Examples of memory 802 include a non-transitory computer-readable media such as RAM, ROM, flash memory, EEPROM, any kind of optical storage disk such as a DVD, a Blu-Ray® disc, magnetic storage, holographic storage, an HDD, an SSD, any medium that can be used to store program code in the form of instructions or data structures, and the like. Any and all of the methods, functions, and operations described in the present application can be fully embodied in the form of tangible and/or non-transitory machine-readable code saved in memory 802.
Input-output devices 803 can include any component for trafficking data such as ports, antennas (i.e., transceivers), printed conductive paths, and the like. Input-output devices 803 can enable wired communication via USB®, DisplayPort®, HDMI®, Ethernet, and the like. Input-output devices 803 can enable electronic, optical, magnetic, and holographic, communication with suitable memory 803. Input-output devices can enable wireless communication via WiFi®, Bluetooth®, cellular (e.g., LTE®, CDMA®, GSM®, WiMax®, NFC®), GPS, and the like. Input-output devices 803 can include wired and/or wireless communication pathways.
Sensors 804 can capture physical measurements of environment and report the same to processors 801. Examples of sensors 804 include temperature sensors, pressure sensors, rotational speed sensors, voltage sensors, current sensors, etc. According to some embodiments, a temperature and/or pressure sensor is disposed at any (e.g., every) point in thermal system 100. According to some embodiments, a voltage sensor and current sensor are disposed on line 640.
User interface 805 can include a display (e.g., LED touchscreens (e.g., OLED touchscreens), physical buttons, speakers, microphones, keyboards, and the like. Actuators 806 can enable processors 801 to control mechanical forces. Every valve disclosed herein can be an independently controllable actuator 806.
Processing system 800 can be distributed (e.g., primary non-volatile memory can be disposed in a first remote server and the other modules can be disposed in a second remote server). Processing system 800 can have a modular design where certain modules have a plurality of the features shown in
Referring to
At block 906, PS 800 can adjust a flow rate of cooling fluid 102 (which can be un-combusted cooling fluid 102a or combusted cooling fluid 102b), into heat exchanger 130. PS 800 can perform the adjustment based on the first metric and/or the second metric. For example, PS 800 can increase a flow rate of cooling fluid 102 toward first heat exchanger 130 based on the temperature of heat load 180 exceeding a predetermined temperature.
PS 800 can modulate the follow rate of cooling fluid 102 toward first heat exchanger 130 by modulating the opening degree of first exit 202 of three way valve 200 (e.g., three-way valve 200a and/or three-way valve 200b). Put differently, PS 800 can increase and decrease a flow rate of cooling fluid 102 into first heat exchanger 130 (cooling fluid 102 can be combusted cooling fluid) to maintain a desired metric (e.g., temperature, pressure, liquid to gas ratio) of cooling fluid 102 resident in fluid storage tank 120 (i.e., vessel 110). PS 800 can achieve the same effect (i.e., controlling the flow rate of cooling fluid 102 into first heat exchanger 130) by modulating the opening degree of second exit 204 of three-way valve 200.
Referring to
Referring to
Referring to
At block 1206, PS 800 can increase and/or decrease a flow rate of cooling fluid 102 into first heat exchanger 130 based on the first metric and/or the second metric. PS 800 can do so by modulating an opening degree of first exit 202 (e.g., first exit 202a and/or first exit 202b). At block 1208, PS 800 can increase and/or decrease a flow rate of cooling fluid 102 (e.g., un-combusted 102a or combusted 102b) into turbine 250 (i.e., into electrical power generator 310) based on the first metric and/or the second metric. PS 800 can do so by modulating an opening degree of second exit 204 and/or by modulating pressure control valve 230.
Referring to
PS 800 can control the flow rate of cooling fluid 102 into second heat exchanger 170 (e.g., by modulating flow control valve 150) to ensure that cooling fluid in lines 190 and/or 210 (e.g., cooling fluid 102 entering first heat exchanger 130) is in a super-heated state. PS 800 can modulate pressure control valve 230 to maintain a predetermined saturation pressure and/or temperature of cooling fluid 102 within second heat exchanger 170 and/or first heat exchanger 130.
Example 1. A thermal system can include a fluid storage tank configured to store a first cooling fluid in a liquid state and a gas state; a first heat exchanger configured to release heat into the fluid storage tank; a second heat exchanger arranged fluidly downstream of the fluid storage tank and configured to exchange heat between the first cooling fluid and a heat load; and a pressure control device arranged fluidly downstream of the second heat exchanger, one of the first cooling fluid that has been heated by the second heat exchanger or a second cooling fluid different than the first cooling fluid passes through the first heat exchanger and thereby heats upstream first cooling fluid resident in the fluid storage tank.
Example 2. In the thermal system of Example 1, the first heat exchanger is arranged fluidly downstream of the second heat exchanger and is configured to receive the first cooling fluid from the second heat exchanger, the first cooling fluid having been heated by the second heat exchanger, and the first heat exchanger is configured to expel the first cooling fluid to a location downstream of the pressure control device.
Example 3. In the thermal system of Example 2, the pressure control device is fluidly connected to the second heat exchanger via a first line, and a second line is fluidly connected to the first line between the pressure control device and the second heat exchanger and extending from the first line to the first heat exchanger so as to fluidly transport the first cooling fluid from the second heat exchanger to the first heat exchanger.
Example 4. In the thermal system of Example 3, a third line fluidly extends away from the pressure regulator, and a fourth line fluidly extends from the first heat exchanger and fluidly connects to the third line downstream of the pressure control device so as to enable the first heat exchanger to expel the first cooling fluid to a location downstream of the pressure control device.
Example 5. The thermal system of Example 4 can include a turbine arranged fluidly downstream of the pressure control device, the third line includes a first portion that fluidly extends from the pressure control device to the turbine, and the turbine is configured to extract mechanical energy from the first cooling fluid flowing therein.
Example 6. The thermal system of Example 5 can include a three-way valve arranged fluidly downstream of the turbine, the third line includes a second portion that fluidly extends from the turbine to the three-way valve, and the fourth line is fluidly connected to the three-way valve.
Example 7. In the thermal system of Example 6, the three-way valve expels the first cooling fluid received from the turbine and the first cooling fluid received from fourth line to an exhaust.
Example 8. In the thermal system of any of Examples 1-7, the first heat exchanger is configured to receive the second cooling fluid from a heat producing element, the second cooling fluid having been heated by the heat producing element, and a closed loop line is fluidly connected to the first heat exchanger and the heat producing element and is configured to continuously fluidly transport the second cooling fluid from the heat producing element, to the first heat exchanger, away from the first heat exchanger, and back to the heat producing element such that the second cooling fluid is repeatedly heated by the heat producing element and subsequently transported to the first heat exchanger so as to heat upstream first cooling fluid resident in the fluid storage tank.
Example 9. In the thermal system of Example 8, a fifth line of the closed loop line fluidly connects the heat producing element to an inlet of the first heat exchanger, and a sixth line of the closed loop line fluidly connects an outlet of the first heat exchanger to the heat producing element.
Example 10. In the thermal system of Example 9, a pump is arranged along the fifth line and is configured to pump the second cooling fluid through the closed loop line.
Example 11. In the thermal system of Example 9, the first heat exchanger includes a coiled tube that wraps about an outer circumference of the fluid storage tank.
Example 12. The thermal system of Examples 1-11 can include a processing system configured to increase and decrease a flow rate of the first cooling fluid into the first heat exchanger based on (a) a temperature and/or a pressure of the first cooling fluid at a point fluidly downstream of the fluid storage tank and fluidly upstream of the second heat exchanger and (b) a flow rate of the first cooling fluid at a point fluidly downstream of the fluid storage tank and fluidly upstream of the second heat exchanger.
Example 13. A method can include providing a fluid storage tank configured to store a first cooling fluid in a liquid state and a gas state; providing a first heat exchanger configured to release heat into the fluid storage tank; arranging a second heat exchanger fluidly downstream of the fluid storage tank and configured to exchange heat between the first cooling fluid and a heat load; arranging a pressure control device fluidly downstream of the second heat exchanger; and directing one of the first cooling fluid that has been heated by the second heat exchanger or a second cooling fluid different than the first cooling fluid through the first heat exchanger so as to heat upstream first cooling fluid resident in the fluid storage tank.
Example 14. The thermal system of Example 13 can include heating the first cooling fluid via the second heat exchanger, the first heat exchanger is arranged fluidly downstream of the second heat exchanger and is configured to receive the first cooling fluid from the second heat exchanger, the first cooling fluid having been heated by the second heat exchanger; and expelling the first cooling fluid from the first heat exchanger to a location downstream of the pressure control device.
Example 15. In the thermal system of Example 14, the pressure control device is fluidly connected to the second heat exchanger via a first line, and a second line is fluidly connected to the first line between the pressure control device and the second heat exchanger and extending from the first line to the first heat exchanger so as to fluidly transport the first cooling fluid from the second heat exchanger to the first heat exchanger.
Example 16. In the thermal system of Example 15, a third line fluidly extends away from the pressure regulator, and a fourth line fluidly extends from the first heat exchanger and fluidly connects to the third line downstream of the pressure control device so as to enable the first heat exchanger to expel the first cooling fluid to a location downstream of the pressure control device.
Example 17. The thermal system of Example 16 can include heating the second cooling fluid via a heat producing element, the first heat exchanger is configured to receive the second cooling fluid from the heat producing element, the second cooling fluid having been heated by the heat producing element, and a closed loop line is fluidly connected to the first heat exchanger and the heat producing element; and continuously fluidly transporting, via the closed loop line, the second cooling fluid from the heat producing element, to the first heat exchanger, away from the first heat exchanger, and back to the heat producing element such that the second cooling fluid is repeatedly heated by the heat producing element and subsequently transported to the first heat exchanger so as to heat upstream first cooling fluid resident in the fluid storage tank.
Example 18. A thermal system can include a fluid storage tank configured to store a first cooling fluid in a liquid state and a gas state; a first heat exchanger configured to release heat into the fluid storage tank; a second heat exchanger arranged fluidly downstream of the fluid storage tank and configured to exchange heat between the first cooling fluid and a heat load; and a pressure control device arranged fluidly downstream of the second heat exchanger, a fluid line extends away from the pressure control device toward an exhaust, one of the first cooling fluid that has been heated by the second heat exchanger or a second cooling fluid different than the first cooling fluid passes through the first heat exchanger and thereby heats upstream first cooling fluid resident in the fluid storage tank, and the first heat exchanger includes an inlet configured to receive one of the first cooling fluid or the second cooling fluid and an outlet configured to expel the one of the first cooling fluid or the second cooling fluid after the one of the first cooling fluid or the second cooling fluid has heated the upstream first cooling fluid resident in the fluid storage tank.
Example 19. In the thermal system of Example 18, the first heat exchanger is arranged fluidly downstream of the second heat exchanger and is configured to receive the first cooling fluid from the second heat exchanger via the inlet, the first cooling fluid having been heated by the second heat exchanger, and the first heat exchanger is configured to expel the first cooling fluid via the outlet to a location downstream of the pressure control device along the fluid line.
Example 20. In the thermal system of Example 18, the first heat exchanger is configured to receive the second cooling fluid from a heat producing element via the inlet, the second cooling fluid having been heated by the heat producing element, and a closed loop line is fluidly connected to the first heat exchanger and the heat producing element and is configured to continuously fluidly transport the second cooling fluid from the heat producing element, to the inlet of the first heat exchanger, away from the first heat exchanger via the outlet, and back to the heat producing element such that the second cooling fluid is repeatedly heated by the heat producing element and subsequently transported to the first heat exchanger so as to heat upstream first cooling fluid resident in the fluid storage tank.
This application is a continuation application of co-pending U.S. patent application Ser. No. 16/611,932, which was filed on Nov. 8, 2019, which was a U.S. national stage filing from International Application Number PCT/US2018/033543, which was filed on May 18, 2018, which was based upon and claims the benefit of priority from U.S. provisional patent application Ser. No. 62/508,074, which was filed on May 18, 2017. The disclosures of each of the above-identified patent applications are incorporated herein by reference in their entirety.
Number | Date | Country | |
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62508074 | May 2017 | US |
Number | Date | Country | |
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Parent | 16611932 | Nov 2019 | US |
Child | 18112915 | US |