Ultra-fine grain materials have attracted the attention of many researchers due to their unique mechanical properties. Control of grain size and texture are known as one of the most effective ways to achieve desired material properties. Severe plastic deformation (SPD) processes are commonly used methods for grain refinement of metallic materials, although they have not been well received by industry. The most important limitations of introduced methods are the small size of the product and the large number of steps needed to reach the desired texture. In recent years, various SPD methods for improving texture and grain size of bars with small diameters are provided. However, imposing large plastic strain to small diameter wires is a complex process and technically challenging. Traditionally, wires are made by drawing; imposing sever plastic deformation to wires with small diameter is a complex process.
Enhancing mechanical properties of wires during fabrication is highly desirable for the production of high strength, durable, and ductile wires. Several methods have been proposed over the years for the improvement of the mechanical properties of wires. For example, severe plastic deformation (SPD) methods for fabricating nano-structured materials have been used with positive results. However, metal wires fabricated from such methods suffer from low ductility due to lack of work hardening.
It has been shown that one of the possible solutions to tackle this problem is to introduce non-uniform grain structure, i.e., mixture of both fine grains (to improve strength) and coarse grains to keep reasonable ductility level. An apparatus, which produces a non-uniform grain structure in the fabricated wire, is required. Furthermore, in other existing SPD methods for fabricating wires with small cross section, each method has some disadvantages such as the limited length of the final product, low speed, low production rate, etc. An apparatus or a method, which has the ability to impose continuous plastic deformation to wires with acceptable speed and high production rate is required.
Conventionally, most of the severe plastic deformation (SPD) methods use a die with an intersection angle to impose a plastic shear strain to the raw materials. In these processes, the amount of achievable plastic strain is limited with respect to the die angle. In order to attain a higher level of plastic strain the intersection angle of a die should be decreased. However, in practice, the use of intersection angles less than 90° is difficult. An apparatus or method, which is capable of achieving the highest level of plastic strain, is required. Moreover, an apparatus which produces a continuous torsion deformation to a wire with diameter below 4 mm, is required.
There is a long felt but unresolved need for an apparatus, which produces a non-uniform grain structure in the fabricated wire. Moreover, there is a need for an apparatus or a method, which has the ability to impose continuous plastic deformation to wires with acceptable speed and high production rate. Furthermore, there is a need for an apparatus or method, which is capable of achieving the highest level of plastic strain. Additionally, there is a need for an apparatus, which produces a continuous torsion deformation to a wire with diameter below 4 mm.
This summary is provided to introduce a selection of concepts in a simplified form that are further disclosed in the detailed description of the invention. This summary is not intended to identify key or essential inventive concepts of the claimed subject matter, nor is it intended for determining the scope of the claimed subject matter.
The ultra-fine wire fabricating apparatus, disclosed herein, addresses the above-mentioned need for an apparatus, which produces a non-uniform grain structure in the fabricated wire. Moreover, the invention addresses the need for an apparatus or a method, which has the ability to impose continuous plastic deformation to wires with acceptable speed and high production rate. Furthermore, the invention addresses the need for an apparatus or method, which is capable of achieving the highest level of plastic strain.
Additionally, the invention addresses the need for an apparatus, which produces a continuous torsion deformation to a wire with diameter below 4 mm. The ultra-fine wire fabricating apparatus, disclosed herein, comprises a feeder assembly, a stationary die, and a rotary die holder. The feeder assembly supplies a wire. The stationary die comprises a hollow inclined channel configured on an inner surface of the stationary die. The hollow inclined channel is configured to receive the wire from the feeder assembly. The rotary die holder configured to receive the wire from the stationary die and simultaneously torsionally deform the wire, wherein the rotary die holder rotates relative to the stationary die to produce the ultra-fine wire with improved mechanical properties.
One aspect of the present disclosure is directed to an ultra-fine wire fabricating apparatus for producing an ultra-fine wire with improved mechanical properties, the ultra-fine wire fabricating apparatus comprising: (a) a feeder assembly for supplying a wire; (b) a stationary die comprising a hollow inclined channel configured on an inner surface of the stationary die, the hollow inclined channel configured to receive the wire from the feeder assembly; and (c) a rotary die holder configured to receive the wire from the stationary die and simultaneously torsionally deform the wire, wherein the rotary die holder rotates relative to the stationary die to produce the ultra-fine wire with improved mechanical properties.
In one embodiment, the ultra-fine wire fabricating apparatus further comprises a pick-up spool assembly operably engaged to the rotary die holder for collecting the fabricated ultra-fine wire. In one embodiment, the ultra-fine wire fabricating apparatus further comprises a control unit for controlling one or more parameters of the ultra-fine wire fabricating apparatus. In a related embodiment, the one or more parameters comprise a rotational speed of the rotary die holder, a drawing speed of a drawing block, and a rate of fabrication of the ultra-fine wire. In another related embodiment, the one or more parameters comprise a diameter of the ultra-fine wire, a length of the ultra-fine wire, and a quantity of the ultra-fine wire.
Another aspect of the present disclosure is directed to a method for producing an ultra-fine wire with improved mechanical properties, the method comprising: (a) providing an ultra-fine wire fabricating apparatus comprising: (i) a feeder assembly; (ii) a stationary die; and (iii) a rotary die holder; (b) supplying a wire via the feeder assembly; (c) bending the wire in a hollow inclined channel of the stationary die; and (d) applying a torsion deformation on the wire by rotating the rotary die holder to produce the ultra-fine wire with improved mechanical properties.
The ultra-fine wire fabrication method, also referred to as the “Equal channel angular torsion drawing (ECATD) method” is introduced as a method for continuous grain refinement of wires. During the ECATD process, the initial wires are severe plastic deformed using the combined effects of an equal channel angular die and torsional deformation. The mechanical properties of the raw materials are improved due to a grain refinement and microstructure evolution caused by the severe plastic deformation.
By this method, the wires with enhanced mechanical properties can be produced continuously. So, this new hybrid process can be used as an industrial method for continuous grain refinement of wires. In the method, the advantage is the ability to impose continuous severe plastic deformation to wires with acceptable speed and high production rate. In addition, this new technique is simple and cheap. There is no need for expensive equipment and facilities.
In the equal channel angular torsion deformation (ECATD) method, the wires are continuously drawn and torsion deformed during each pass of the process. Therefore, there are no limits for the length of the final product. In addition, with the aid of the intersection angle of the die channel and torsion deformation, large plastic deformation near 1˜1.5 could be achieved in one pass of the process. By repeating the ECATD process, an equivalent plastic strain up to 4-5 can be imposed to the initial wire. In addition, by controlling the process parameters a higher level of plastic strain can be achieved in each pass. Wires with different materials and diameters can be severe plastic deformed by this method.
Other objects, features and advantages of the present invention will become apparent from the following detailed description. It should be understood, however, that the detailed description and the specific examples, while indicating specific embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.
The foregoing summary, as well as the following detailed description of the invention, is better understood when read in conjunction with the appended drawings. For the purpose of illustrating the invention, exemplary constructions of the invention are shown in the drawings. However, the invention is not limited to the specific methods and structures disclosed herein. The description of a method step or a structure referenced by a numeral in a drawing is applicable to the description of that method step or structure shown by that same numeral in any subsequent drawing herein.
A description of embodiments of the present invention will now be given with reference to the Figures. It is expected that the present invention may be embodied in other specific forms without departing from its spirit or essential characteristics. The described embodiments are to be considered in all respects only as illustrative and not restrictive. The scope of the invention is, therefore, indicated by the appended claims rather than by the foregoing description. All changes that come within the meaning and range of equivalency of the claims are to be embraced within their scope.
The present invention generally relates to wire fabrication apparatuses. More particularly, the invention disclosed herein relates to an ultra-fine wire fabricating apparatus and method for producing ultra-fine wire with improved mechanical properties.
Conventionally, most of the severe plastic deformation (SPD) methods use a die with an intersection angle to impose a plastic shear strain to the raw materials. In these processes, the amount of achievable plastic strain is limited with respect to the die angle. In order to attain a higher level of plastic strain the intersection angle of a die should be decreased. However, in practice, the use of intersection angles less than 90° is difficult.
The amount of achievable plastic strain in each pass of the process is limited and there are some obvious obstacles for industrial application of it. However, two main advantages of the existing methods, for example, the Equal channel angular deformation (ECAD) method are unlimited length of processed specimen and ability of using it as an intermediate step in a continuous industrial process.
A shear drawing (SD) process is presented to overcome flow instability of the ECAD. In this process, the geometry of die channels changed to cone shape and corner radius at the intersection angle. The initial diameter of raw specimen decreases at each step of the SD process. From existing studies, researchers have proposed a continuous hybrid process for manufacturing high strength low carbon steel wires. In this process, a hybrid of wire drawing, ECAP, and rolling process are used as a new severe plastic deformation (SPD) technique.
The ECAP-Conform process is introduced as a continuous severe plastic deformation (SPD) method to produce ultra-fine grain (UFG) materials. In order to increase frictional forces during the conform process, the round cross-section of initial samples change to square. The outlet channel has an intersection angle ranging between 90°-110°. Low production rate and changing of the shape of the sample cross-section are some limitations of the ECAP-conform process. Moreover, existing torsion deformation methods efficiently impose a shear strain to the samples.
In one study, researchers have used locally heated zone and torsion strain for continuous grain refinement of Al rods. Some SPD methods have been introduced based on torsion deformation like high-pressure torsion (HPT), high pressure shearing, and cone-cone method (CCM). The evolution of microstructures in commercial pure Al and Cu deformed by torsion has been investigated. The results have shown that the grain size decreased and fraction of high angle grain boundaries increased with increasing plastic strain in torsion deformation. Therefore, torsion deformation could be a kind of SPD method. Another study suggested a new continuous SPD method for wires with small diameter based on conventional high-pressure torsion (HPT) technique. However, the processed wires after (HPT) had a poor surface quality and the cross section of the wires decreased about 30 percent.
Applicants have here addressed the great need for an apparatus, which produces a non-uniform grain structure in the fabricated wire. Moreover, Applicants have here addressed the unresolved need for an apparatus or a method, which has the ability to impose continuous plastic deformation to wires with acceptable speed and high production rate. Applicants have also discovered an apparatus and method, which is capable of achieving the highest level of plastic strain and which produces a continuous torsion deformation to a wire with diameter below 4 mm.
The ultra-fine wire fabricating apparatus 100 for producing an ultra-fine wire with improved mechanical properties also comprises a feeder assembly 105 for supplying the wire 101 as exemplarily illustrated in
SPD processes lead to microstructure evolution and decrease the grain size of the raw materials. The mechanical properties of the initial material significantly improve by increasing the fraction of high angle grain boundaries due to severe plastic deformation. With the aid of intersection angle of the stationary die 103, exemplarily illustrated in
One aspect of the present disclosure is directed to an ultra-fine wire fabricating apparatus for producing an ultra-fine wire with improved mechanical properties. The ultra-fine wire fabricating apparatus comprises a feeder assembly for supplying a wire; and a stationary die comprising a hollow inclined channel configured on an inner surface of the stationary die, the hollow inclined channel configured to receive the wire from the feeder assembly. The apparatus further comprises a rotary die holder configured to receive the wire from the stationary die and simultaneously torsionally deform the wire, wherein the rotary die holder rotates relative to the stationary die to produce the ultra-fine wire with improved mechanical properties.
The ultra-fine wire fabricating apparatus may further comprise a pick-up spool assembly operably engaged to the rotary die holder for collecting the fabricated ultra-fine wire. The ultra-fine wire fabricating apparatus may further comprise a control unit for controlling one or more parameters of the ultra-fine wire fabricating apparatus. The one or more parameters may comprise a rotational speed of the rotary die holder, a drawing speed of a drawing block, and a rate of fabrication of the ultra-fine wire. The one or more parameters may comprise a diameter of the ultra-fine wire, a length of the ultra-fine wire, and a quantity of the ultra-fine wire.
The whole process can be repeated to reach the desirable level of equivalent plastic strain. Drawing and rotational speed of the process should be determined based on the intersection angle of the stationary die 103, the diameter of the initial wire 101, and the material of the initial wire 101 as exemplarily illustrated in
The Equal Channel Angular Torsion Deformation (ECATD) method has the ability to impose continuous severe plastic deformation to wires 101 with acceptable speed and high production rate. Additionally, the ECATD method is simple and cheap. There is no need for expensive equipment and facilities. In the proposed method here (ECATD), the final structure would be a mix of fine and coarse grains mainly due to the effects of torsion deformation. Therefore, the processed wires will have high strength plus acceptable toughness. Fine grained structure wires can be extensively used in many industries such as springs manufacturing companies, tire manufacturing companies, electric and electronic industries, power supply and power transmission companies, elevators and cranes manufacturing companies, automobiles, etc.
Another aspect of the present disclosure is directed to a method for producing an ultra-fine wire with improved mechanical properties. The method comprises providing an ultra-fine wire fabricating apparatus comprising: a feeder assembly; a stationary die; and a rotary die holder. The method further comprises supplying a wire via the feeder assembly; bending the wire in a hollow inclined channel of the stationary die; and applying a torsion deformation on the wire by rotating the rotary die holder to produce the ultra-fine wire with improved mechanical properties.
The foregoing description comprise illustrative embodiments of the present invention. Having thus described exemplary embodiments of the present invention, it should be noted by those skilled in the art that the within disclosures are exemplary only, and that various other alternatives, adaptations, and modifications may be made within the scope of the present invention. Merely listing or numbering the steps of a method in a certain order does not constitute any limitation on the order of the steps of that method.
Many modifications and other embodiments of the invention will come to mind to one skilled in the art to which this invention pertains having the benefit of the teachings presented in the foregoing descriptions. Although specific terms may be employed herein, they are used only in generic and descriptive sense and not for purposes of limitation. Accordingly, the present invention is not limited to the specific embodiments illustrated herein.
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Number | Date | Country |
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06134516 | May 1994 | JP |
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Machine translation of JP 06134516 A. |
Number | Date | Country | |
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20170252788 A1 | Sep 2017 | US |