The present invention relates to an apparatus for sealing packaging containers. More specifically, the present invention relates to an ultrasonic sealing device for sealing packaging material for such packaging containers and a method of controlling humidity in such ultrasonic sealing device.
In the manufacturing of packaging containers a web of packaging material is typically longitudinally sealed to form a tube around a fill pipe in a filling machine. A transversal seal is made to the tube which is then filled with a desired liquid food product. A second transversal seal is made which also cuts the package from the entirety of the tube of material. The filled package is then folded and shaped to obtain the final packaging container. Different sealing methods are used for such sealing, such as inductive sealing or ultrasonic sealing. The packaging material is usually composed of paperboard base material with both sides coated with a thermoplastic resin material such as polyethylene. Additionally, the paperboard base material may have a gas barrier layer which may also be coated with a thermoplastic resin material. In ultrasonic sealing, ultrasonic energy generates heat in the thermoplastic resin material through transmission of vibrations from an ultrasonic horn to the packaging material. The thermoplastic resin is melted and opposing surfaces of the packaging material, being compressed towards each other, are sealed together. Ultrasonic sealing systems utilizes piezo stack converters to transform electrical energy to mechanical energy. The piezo stack needs to be supplied with a high voltage in the order of magnitude of thousands of volts. Previous ultrasonic sealing systems typically rely on complex solutions in order for the sealing device to operate within required environmental conditions when being supplied with such high voltages. Such previous solutions require more resources and maintenance. Further, implementation is difficult due to compatibility issues with some packaging machine systems in the production line. For example, conveyor systems based on linear motor technology have been proposed for manipulating packaging containers in the production line. These conveyor systems typically comprise a closed loop track, and a plurality of movable objects or carts, which are independently moved along the track by individually controlling a plurality of solenoids along the track. The implementation of an ultrasonic sealing system must thus accommodate such independently movable carts.
It is an object of the invention to at least partly overcome one or more limitations of the prior art. In particular, it is an object to provide an improved ultrasonic sealing device, in particular allowing for facilitating the control of the environmental conditions in high voltage piezoelectric power circuits, and in particular when implemented in conveyor systems comprising a plurality independently movable carts along a track. It is an object to provide a related method of controlling humidity in an ultrasonic sealing device.
In a first aspect of the invention, this is achieved by an ultrasonic sealing device comprising a sonotrode for sealing a packaging material, comprising a piezoelectric transducer to generate ultrasonic acoustic vibrations for said sealing, a housing, a power circuit connected to the piezoelectric transducer, wherein the power circuit is enclosed in the housing, and an absorbent arranged in the housing to absorb moisture in an atmosphere therein to lower humidity.
In a second aspect of the invention, this is achieved by a method of controlling humidity in an ultrasonic sealing device having a piezoelectric transducer to generate ultrasonic acoustic vibrations for sealing a packaging material and a power circuit enclosed in a housing and being connected to the piezoelectric transducer, the method comprising absorbing moisture in an atmosphere in the housing with an absorbent arranged in the housing.
In a third aspect of the invention, this is achieved by use of an absorbent in a housing of an ultrasonic sealing device, the housing enclosing a power circuit connected to a piezoelectric transducer to generate ultrasonic acoustic vibrations for sealing a packaging material with said ultrasonic sealing device.
In a fourth aspect of the invention, this is achieved by a packaging machine comprising a device according to the first aspect, and/or a packaging machine performing the method according to the second aspect.
Further examples of the invention are defined in the dependent claims, wherein features for the first aspect may be implemented for the subsequent aspects, and vice versa.
Having an absorbent arranged in the housing enclosing the piezoelectric power circuit allows for absorbing moisture in the atmosphere inside the housing, which prevents short circuit and component failure of the high voltage circuit.
Still other objectives, features, aspects and advantages of the invention will appear from the following detailed description as well as from the drawings.
Embodiments of the invention will now be described, by way of example, with reference to the accompanying schematic drawings.
Embodiments of the invention will now be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all, embodiments of the invention are shown. The invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
The ultrasonic sealing device 100 may comprise a container 106 to hold the absorbent 105 in a defined position in the housing 103. This provides for facilitated optimization of the position of the absorbent 105 and improved control of the humidity in the housing 103. E.g. some parts of the space inside the housing 105 may be more prone to condensation. Further, holding the absorbent 105 in a defined position provides for a more robust ultrasonic sealing device 100 where the risk of having the absorbent 105 interfering with neighbouring components is reduced, as the ultrasonic sealing device 100 may undergo rapid movements in different sealing operations.
In one example, the container 106 may hold the absorbent 105 in a defined position adjacent the power circuit 104, as schematically illustrated in
The container 106 may comprise a fixation element 107 to removably attach the container 106 to the housing 103. Having the container 106 removably attachable to the housing 103 provides for facilitated installation and replacement of the absorbent 105 when needed. Maintenance is thus facilitated with a minimum of impact on the production line as the time spent on such replacement can be minimized.
The container 106 may be cylinder-shaped and the fixation element 107 may comprise threads being screwable into an opening 108 of the housing 103. This provides for facilitating the fixation of the container 106 to the housing 103, and further subsequent detachment of the container 106 for replacement of the absorbent 105. It should be understood that the container 106 and/or the housing 103 may comprise various other fixation elements 107, such as clasps, hooks clips, locks, flanges, wires, etc. to removably attach the container 106 to the housing 103. Although a cylinder-shaped container 106 comprising threads being screwable into an opening 108 of the housing 103 may provide for a particularly facilitated and robust attachment, it is conceivable that the container 106 may have various shapes, such as rectangular, oblong, or round, in combination any of the above mentioned fixation elements 107.
The container 106 may comprise a wall 109 enclosing the absorbent 105. The wall 109 may comprise a plurality of perforations 110, as schematically illustrated in
The absorbent 105 may comprise a desiccant. A desiccant is a hygroscopic substance that induces or sustains a state of dryness (desiccation) in its vicinity. I.e. a desiccant is the opposite of a humectant. The desiccant may be a solid material that absorbs water. The desiccant may be in other forms than a solid, and may work through other principles to absorb water, such as chemical bonding of water molecules. Having an absorbent 105 that comprises a desiccant provides for an effective and resource efficient control of the humidity in the atmosphere inside the housing 103.
The desiccant may comprise silica. Having a desiccant comprising silica allows for easy handling of the absorbent 105, as well as high efficiency in relation to the resources required. The efficiency of the desiccant may be measured as a ratio of water storable in the desiccant relative to the mass of desiccant. In other examples, the desiccant may comprise activated charcoal, and/or calcium sulfate, and/or calcium chloride, and/or molecular sieves such as zeolites, and/or a moisture absorbing polymer.
The ultrasonic sealing device 100 may comprise a sensor 111 to detect moisture in the atmosphere inside the housing 103. The sensor 111 may be in communication with a control device 301, as schematically illustrated in
The ultrasonic sealing device 100 may comprise a frame 112, as schematically illustrated in the example of
The housing 103 may be formed as an integrated enclosure in the frame 112. This provides for a robust ultrasonic sealing device 100 while the absorbent 105 allows for an effective control of the humidity level in the space inside the integrated enclosure.
A computer program product is provided comprising instructions which, when the program is executed by a computer, cause the computer to carry out the steps of the method 200 of detecting 202 and notifying 203 as described above.
A use of an absorbent 105 in a housing 103 of an ultrasonic sealing device 100 is provided, with the advantageous benefits as described above in relation to
A packaging machine (not shown) is provided comprising an ultrasonic sealing device 100 as described above in relation to
From the description above follows that, although various embodiments of the invention have been described and shown, the invention is not restricted thereto, but may also be embodied in other ways within the scope of the subject-matter defined in the following claims.
Number | Date | Country | Kind |
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18202267 | Oct 2018 | EP | regional |
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/EP2019/076833 | 10/3/2019 | WO |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2020/083625 | 4/30/2020 | WO | A |
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20020124662 | Suzuki et al. | Sep 2002 | A1 |
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20090188966 | Klinstein | Jul 2009 | A1 |
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103419364 | Dec 2013 | CN |
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H0953868 | Feb 1997 | JP |
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Entry |
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International Search Report for corresponding Application No. PCT/EP2019/076833, dated Dec. 10, 2019. |
Cody Hostick: Moisture Protection of Electronics—Efficient Plant, Sep. 18, 2013, pp. 1-11, XP055575294, Retrieved from the Internet: URL:https://www.efficientplantmag.com/2013 /09/moisture-protection-of-electronics/ [retrieved on Apr. 20, 2021]. |
Number | Date | Country | |
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20210347510 A1 | Nov 2021 | US |