A thin film device e.g. an electrochromic device, is deposited on a glass substrate which is incorporated into an insulating glass unit (IGU). This patent application addresses the process, equipment, and materials for soldering electrical interconnections to bus bars on the device.
Electrochromic glazings include electrochromic materials that are known to change their optical properties, such as coloration, in response to the application of an electrical potential, thereby making the device more or less transparent or more or less reflective. Typical prior art electrochromic devices include a counter electrode layer, an electrochromic material layer which is deposited substantially parallel to the counter electrode layer, and an ionically conductive layer separating the counter electrode layer from the electrochromic layer respectively. In addition, two transparent conductive layers are substantially parallel to and in contact with the counter electrode layer and the electrochromic layer.
Materials for making the counter electrode layer, the electrochromic material layer, the ionically conductive layer and the conductive layers are known and described, for example, in United States Patent Publication No. 2008/0169185, incorporated by reference herein, and desirably are substantially transparent oxides or nitrides. When an electrical potential is applied across the layered structure of the electrochromic device, such as by connecting the respective conductive layers to a low voltage electrical source, ions, such as Li+ ions stored in the counter electrode layer, flow from the counter electrode layer, through the ion conductor layer and to the electrochromic layer.
In addition, electrons flow from the counter electrode layer, around an external circuit including a low voltage electrical source, to the electrochromic layer so as to maintain charge neutrality in the counter electrode layer and the electrochromic layer. The transfer of ions and electrons to the electrochromic layer causes the optical characteristics of the electrochromic layer, and optionally the counter electrode layer in a complementary EC device, to change, thereby changing the coloration and, thus, the transparency of the electrochromic device.
As used herein, the term “insulated glass unit” (IGU) means two or more layers of glass separated by a spacer (metal, plastic, foam, resin based) along the edge and sealed to create a dead air space, “insulated space” (or other gas, e.g. argon, nitrogen, krypton) between the layers. The IGU comprises an interior glass panel and an EC device, described further herein.
Electrical connection to the electronic device is achieved by thick film silver (Ag) solder tabs external to the adhesively bonded spacer. The solder tabs are electrically connected to thick film Ag bus bars which contact conductive device layers inside the IGU. Wires delivering electrical power are soldered to the bus bars which terminate in solder tabs exterior to the spacer. The space between the two glass substrates where the attachment to the solder tab is made is narrow and may be less than about 6 mm high.
The invention relates to an ultrasonic soldering tool and method of soldering. The soldering tool according to one aspect of the disclosure has a handle with an ultrasonic soldering element secured to it by at least one rib. The ultrasonic soldering element can be adapted to receive a soldering tip that may operate between parallel substrates of an insulated glass unit, preferably through incorporation of a trough in the soldering tip head.
The rib of the soldering tool according to one aspect of the disclosure can be adapted to incorporate additional interconnected elements. One of the additional interconnected elements may be a bubble level which can be mounted substantially parallel to the soldering tip head to accurately reflect the angular pitch of the head during operation of the soldering tool.
The soldering tool according to one aspect of the disclosure may use a trigger to directly activate power to the tool. The trigger could also send a signal to digital timer circuitry to activate power to the tool. The digital timer circuitry desirably includes a switch to activate power to the ultrasonic soldering element, an indicator LED on the soldering tool, and an audible signal generator which may indicate when the soldering cycle is complete.
The soldering tool according to one aspect of the disclosure is an automatic feed soldering tool that can supply solder to the desired solder joint location. The automatic tool can have interconnected elements mounted to the at least one rib including a solder roll, drive rollers, a gear motor, and a solder feed tube.
The automatic soldering tool according to one aspect of the disclosure may have the solder roll mounted to the at least one rib, the drive rollers mounted to the solder roll, and the solder feed tube mounted to the drive rollers. The gear motor may be mounted to and adapted to rotate the drive rollers. The drive rollers may then transfer solder from the solder roll through the solder feed tube. The solder may emerge from the feed tube at the soldering tip head.
The gear motor according to one aspect of the disclosure may supply a fixed volume of solder to the soldering head. In other embodiments, the gear motor may be adjustable to modify the volume of solder supplied.
The soldering tool according to one aspect of the disclosure may have a soldering tip head with a trough. A solder feed port may extend from an exterior surface of the tip into the trough. The feed port may be adapted to transport solder from the feed tube into the trough. Another aspect of the disclosure may use a solder well adapted to receive and melt the solder from the feed tube before it enters the solder feed port.
Another aspect of the disclosure is a soldering tip, which can be an elongated member having a head with a trough. The trough may be adapted to surround a wire during soldering and can be oriented substantially horizontally to the soldering element. A solder feed port may extend from an exterior surface of the soldering tip into the trough and is preferably sized to transport solder via capillary action. According to one aspect of the disclosure, the trough can have a parabolic profile. The soldering tip may also have a solder well to melt solder before it enters the solder feed port.
The method of creating a solder joint according to one aspect of the disclosure desirably uses a clamp. The clamp may have a housing, an upper jaw, a lower jaw, a sled, and a spring. The housing may have a chamber to receive the sled which may be free to move in at least one dimension within the chamber. The spring can also be located within the chamber. The upper jaw can be connected to the housing, and the lower jaw can be connected to the sled. The spring may exert a force against the sled and housing to maintain the upper jaw and lower jaw in close proximity to each other.
According to one aspect of the clamp, there can be a stub extending from the housing and a beam extending from the sled. The beam may be free to move along a path defined by a slot in the housing. The beam and stub may extend in similar directions so an operator can adjust the position of the beam relative to the stub with one hand, thereby changing the proximity of the upper jaw and lower jaw. Another aspect of the disclosure is the lower jaw may have a protective material attached to it.
The method of ultrasonically soldering a wire to a solder tab according to one aspect of the disclosure desirably includes the steps of preparing a wire to be soldered, cleaning the solder tab, positioning the wire on the solder tab; fixing the wire in position with a clamp; positioning a soldering tool to solder the wire; ultrasonically soldering the wire to the solder tab which can result in a solder joint formed in a space between the layers of an insulated glazing unit.
The method of ultrasonically soldering a wire in another aspect may include forming an ideal solder joint by delivering a precise volume of solder to the solder joint, thereby creating a solder joint having a desired pull strength using minimal solder. In some embodiments, solder may be pre-applied to the wire before soldering to help ensure that a precise volume of solder is used. In other embodiments, solder may be delivered during the soldering process through use of an automatic feed soldering tool.
The quality of the solder joint can be controlled according to one aspect of the disclosure by monitoring the volume of solder supplied to the joint and the duration of contact between the soldering tool and the wire.
A more complete appreciation of the subject matter of the present invention and the various adavantages thereof can be realized by reference to the following detailed description, in which reference is made to the accompanying drawings:
Although the invention disclosed in this application has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended exemplary claims.
Overall Process Flow
Thin films and other structures are deposited on the glass device substrate by methods known to those skilled in the art as described in, for example, U.S. Pat. Nos. 5,321,544; 5,404,244; 7,327,610; 7,593,154; and 8,482,837.
Thick film silver (Ag) paste is applied to create bus bars which traverse at least a portion of the device and terminate in solder tabs. The paste is dried and fired forming solderable bus bars. In some embodiments, the bus bars are fired at 380 to 420 deg. C.
In some embodiments, the bus bars can be on a single glass sheet, on a multilayer (2 or more) laminated structure, or part of an IGU. In some embodiments, a multiwire cable is attached to the IGU spacer, and individual wires are routed to the appropriate solder tabs. In some embodiments, a controlled amount of solder is affixed directly to each wire that will subsequently be soldered to a thick film Ag solder tab. In some embodiments, the wire is positioned on the solder tab and held in place by a clamp or other mechanism so that glass edges cannot be damaged and the extent of solder flow is controlled. In some embodiments, the soldered area is coated followed by application of secondary IGU seal. Finally, the thin film IGU is tested.
Referring now to
The handle 11 has a trigger 12 for activating the power to the soldering element 30 in the front of the handle 11. In some embodiments the trigger 12 faces the same direction as the soldering tip 40 to provide comfortable operation of the soldering tool 10. The trigger 12 can be located at the top of the handle 11, adjacent to the platform 13, where a user's index finger is positioned when gripping the handle 11.
A platform 13 is connected to the top of the handle above the trigger 12 in the embodiment shown. In some embodiments the platform 13 can be a rectangular plank that is molded as part of the handle 11 to reduce manufacturing costs. In other embodiments, the platform 13 may be manufactured separately, then attached to the handle 11 by screwing, gluing, welding, or a similar method of securing two objects together, and depending, of course, on the materials used. The platform 13 can extend beyond the perimeter of the top of the handle 11 as necessary to provide an adequate base for the soldering element 30 to be secured to. The size of the platform 13 is therefore determined by the soldering element 30 to be used in the soldering tool 10. In some embodiments, the platform 13 is wider than the diameter of the outer casing 15 of the soldering element 30 to allow the ribs 14 to extend from the platform 13 and around the outer casing 15. In some embodiments, the platform 13 is at least as long as the segment of the outer casing 15 of the soldering element 30 that has a uniform thickness.
The soldering element 30 in the embodiment shown in [
In some embodiments, the ribs 14 can serve as a mounting apparatus for alternative features of the soldering tool 10. For example, a bracket 57 may be incorporated to support or act as a platform 13 to mount any additional interconnected elements in the design of the soldering tool 10 and molded as part of a rib. In one embodiment, additional interconnected elements can include a solder roll 54, precision roller drive gear motor 56, and solder feed tube 53 as shown in [
A cross sectional view of the soldering tool 10 can be seen in
In some embodiments the front 35 and back wall 37 have notches to allow power wires 17, 18 to enter and exit the cavity of the handle 11 for connecting the power supply (not shown) to the switch 32 and then to the soldering element 30.
In some embodiments the front wall 33 is shaped to allow the trigger 12 to move when pressed by an operator, thereby activating a momentary contact switch 32 to power the soldering element 30. In the embodiment shown in
In other embodiments, the switch 32 is a low-amperage low-voltage contact switch that serves as an input to digital timer circuitry located in the power supply. In some embodiments, the digital timer circuitry activates power to the soldering element 30, turns on an LED (not shown) located on the under the bubble level 70 (see
In other embodiments, different types of switches can be used with the same effect such as a pushbutton, toggle, rocker, slide, rotary switch, etc. The switch 32 must be sized to withstand the power requirements of the soldering element 30. Therefore, the soldering element selected will determine the switch that may be used. A soldering element that requires more power will require a switch that is able to withstand a higher power draw.
In the embodiment shown in
In some embodiments, the handle 11 can have grip pads attached to the sides to increase the comfort of the operator during use.
In some embodiments, the platform 13 is adjacent to the front 33 and back 37 walls and is oriented substantially from the front to the back of the soldering tool 10. The platform 13 may provide a base to which the soldering element 30 is secured. The platform 13 can have a thickness from top to bottom ranging from about 0.25 to 2 inches. In the embodiment shown, the platform 13 has a thickness of about 0.3 to 0.75 inches. The platform 13 must be of sufficient thickness to withstand the weight of the soldering element 30 and the vibration generated during operation of the ultrasonic soldering tool 10.
In some embodiments, the outer casing 15 of the soldering element 30 is secured to the platform 13 by the ribs as shown in
In some embodiments, the ultrasonic vibration element, e.g. a sonotrode, is integrated in the outer casing 15. In some embodiments the sonotrode can align with the tip shaft 38, which may be co-axial with the sleeve 16. The tip shaft 38 can have a range of diameters from about 0.3 to 0.6 inches. In some embodiments, the sleeve 16 extends from the front of the outer casing 15 and may contain the heating apparatus, e.g. a ceramic heater (not shown). The tip can be inserted through the sleeve 16 and into the shaft 38 to use the soldering tool 10.
The soldering tip 40 has a tail 42 at its distal end which is sized to fit within the tip shaft 38 of the soldering element 30 (see
In some embodiments, the tail 42 is adjacent to the shoulder 43. The shoulder 43 may fit within the tip shaft 38 but may be wider than the tail shaft 39 (see
In some embodiments of the soldering tip 40, the spacer 45 is proximal to the shoulder 43. The spacer 45 can have a diameter ranging from approximately 0.2 to 0.6 inches and a length of approximately 4 to 5.5 inches. The spacer 45 may be of sufficient length to ensure that the heat transferred to the soldering tip body 46 is not conducted from the body 46, through the spacer 45 and shoulder 43, and to the tail 42, thereby causing thermal expansion of the tail 42 and preventing its free movement.
In some embodiments, the tip body 46 is proximal to the spacer 45. The diameter of the body 46 can range from about 0.6 to 1 inches and the length can range from about 2 to 4 inches. The body 46 may be positioned substantially within the sleeve 16 of the soldering element 30 during operation of the soldering tool 10; with the front end of the body 46 protruding past the front of the sleeve 16 (see
In some embodiments, the neck 47 is proximal to the body 46 and may have a smaller diameter than the body 46 such that the head 48 and neck 47 can fit in the narrow space between the layers of the IGU. In some embodiments, the height of the neck 47 can range from about 0.2 to 0.6 inches. The bottom of the neck 47 may remain parallel to the bottom of the body 46 to allow the operator to smoothly maneuver the tool back and forth while the bottom of the soldering tip 40 is in contact with the clamp 80 during operation. (see
In some embodiments, the head 48 is proximal to the neck 47 and is created by cutting off about 0.2 to 0.5 inches of the blank soldering tip, then undergoing connecting and machining operations as described below. In other embodiments, the head 48 may be manufactured distinctly from the rest of the tip and then attached to the neck 47 via a screw, welding, or other appropriate means depending on the material used to create the soldering tip 40. When a cut off portion 400 is used to create the head 48, it may be tooled to create a flat surface on one side to mate with the proximal end of the soldering tip 40 and secured into place via welding, screwing, gluing, or other appropriate means depending on the material used to create the soldering tip 40. In some embodiments, the cut off portion 400 may extend below the bottom of the neck 47 as shown in
In some embodiments, the cutoff portion 400 is then tooled to create a head 48 having a rectangular shape with dimensions ranging in size from about 0.01 to 0.3 inch wide by 0.2 to 0.5 inches long by 0.35 to 1.5 inches deep. In some embodiments, the neck 47 and head 48 are created during the same tooling process. In other embodiments, the head 48 and neck 47 are created by separate manufacturing processes and the head 48 is later secured to the soldering tip 40 by material appropriate methods.
In some embodiments, the face is located on the bottom of the head 48. In other embodiments, the face can be oriented at any angle on the soldering head 48.
In some embodiments, a trough 49 is located on the face. The trough 49 can extend from one side of the face to the other, thereby creating a horizontal trough 49. The horizontal orientation of the trough 49 can improve the ergonomic feel of the soldering tool 10. The downward orientation of the trough 49 allows the tip to be maneuvered at a low height above the solder joint such that the tip can fit in the narrow space between the layers of the IGU. The trough 49 allows the head 48 of the soldering tip 40 to surround the wire to be soldered, thereby creating a high quality solder joint as explained below. It is believed that the size of the trough 49 is influenced by the size of the wire to be soldered.
In some embodiments, the trough 49 can have a range of dimensions from about 0.1 to 1 inch long and 0.1 to 1 inch deep. In the embodiment shown in
The trough 49 in the embodiment shown in
In other embodiments, an ideal solder joint is one with consistent fillets on the sides of the wire and also meets or exceeds the required pull strength testing of the joint. The application for which the IGU may be used can used to determine the pull strength needed. Some applications may require higher pull strength than others, e.g. high wind load environments. In some embodiments, a parallel pull test shows strengths of approximately 25N to 90N.
In some embodiments, it is desirable to create an ideal solder joint while using minimal solder which may be about 0.0001 to 0.0005 cubic inches of solder.
A larger trough will create a solder joint with higher pull strength but will require a greater volume of solder than is used in a smaller trough. A larger trough will also increase substrate heating during the soldering process because the soldering tip will need to remain in close proximity with the IGU for a longer period of time to melt the solder which could lead to damage as a result of thermal stress near the edge of the glass substrate. A smaller trough will reduce the necessary amount of solder but will reduce the pull strength of the solder joint. Reducing the amount of solder used can have significant economic benefits when an expensive solder (e.g. 97/3 Indium Silver) is used. An ideal solder joint allows the solder to completely surround the wire as shown in
In one alternate embodiment, the neck 47 and head 48 have a solder feed port 51 extending from inside the trough 49, through the head 48, and emerging on the upper side of the neck 47 as shown in
One embodiment of the soldering tool 10 may include a bubble level 70 as shown in
Returning now to
In the embodiment shown in
In some embodiments, the gear motor 56 may continuously supply solder to the soldering head 48 for the entire duration the trigger 12 is pressed. In other embodiments, the gear motor 56 may supply solder for a fixed period of time during each trigger 12 press, then refrain from providing solder while the soldering tip continues to form the solder joint and completes the soldering process.
In some embodiments, the bubble level is combined with the automatic feed soldering tool to allow the operator to observe the pitch of the soldering element while utilizing the benefits of the automatic feed soldering tool.
Turning now to
The anchor 83 can have a concave depression 100 on its upper surface to ensure proper clearance while operating the soldering tool. In some embodiments, the depression 100 may also be used to support and guide the sleeve 16 of the soldering tool 10 while in use. The radius of the concave depression 100 may be larger than the sleeve 16 radius of the soldering tool 10. In some embodiments the radius of the depression 100 can be about 0.25-0.5 inches. It is believed that in some embodiments, having a larger radius influences the soldering tool 10 to remain in the center of the anchor 83 during operation, but does not unnecessarily restrict it to a fixed spot. In some embodiments, the arms 85 remain connected by a membrane as they begin to extend away from the anchor 83 (see
The arms 85 of the upper jaw 81 extend away from the anchor 83 with the bottom surface of the arms 85 able to contact the glass substrate 72 of the IGU 71. In some embodiments, the arms 85 can have a width of about 0.2 to 0.5 inches and a length of about 0.4 to 0.75 inches while the height of the arms 85 may be less than the size of the space between the layers of the IGU 71. In some embodiments, the height of the arms 85 may range from about 0.02 to about 0.075 inches. The arms 85 define a void between them where a wire may be located to be soldered. The underside 806 of the arms 85 may also have an aperture 86 for the wire that allows the bottom surface of the arms 85 to contact the IGU 71 while securing the wire to be soldered in place during operation. The depth and width of the aperture 86 are determined by the size of the wire to be soldered. In some embodiments, the depth and the width of the aperture 86 are equal and can range from about 0.02 to about 0.05 inches. The aperture 86 can be oriented horizontally to match the positioning of the wire on the IGU 71.
In some embodiments, the anchor 83 of the upper jaw 81 may be secured to the clamp housing 88 using screws, glue, welding, or other appropriate method based on the composition of the housing 88 and jaw 81. In some embodiments, the upper jaw 81 may be manufactured from a material that is temperature resistant, non-stick, and non-scratching, e.g. Rulon LR, a PTFE plastic produced by Saint-Gobain Performance Plastics. In other embodiments, the upper jaw 81 can be created as part of the clamp housing 88 and consist of the same material.
In some embodiments, the clamp housing 88 can have a substantially rectangular shape with dimensions ranging from about 0.3-0.6 inches deep by about 0.5-1 inch wide by about 2-4 inches high as shown in
In some embodiments, the chamber 89 may include one or more guide rods 801 that extend the length of the chamber 89 for the spring 802 and jaw sled 800. The guide rods 801 may be composed of steel, aluminum, or other similar rigid material. In some embodiments, at least one guide rod 801 is positioned toward the outside of the chamber 89 and at least one rod 801 is positioned toward the center of the chamber 89. The outer guide rod 801 can keep the sled 800 properly aligned as it moves up and down the chamber 89 during operation. The center guide rod 801 can keep the spring 802, as well as the sled 800, properly aligned. The spring 802 can exert a force on the bottom of the chamber 89 and the sled 800 to provide the compressive force necessary for the upper 81 and lower jaw 82 to press against the IGU 71 during operation and remain in place. In some embodiments the spring 802 can be compressed with a small enough force that an operator can attach and remove the clamp 80 from the IGU 71 with one hand e.g. about 3-5 lbs. of compressive force.
In some embodiments, the back of the clamp housing 88 can have a stub 103 extending away from the housing 88 as shown in
In some embodiments, the housing 88 can be manufactured substantially by a 3D printing process and require only minor secondary operations at assembly. One of the components that may need to be attached to the housing 88 during the secondary operations is the cover 804. The cover 804 can be attached to the front of the housing 88 and can secure the sled 800 and flange 803 inside the chamber 89. In some embodiments, the cover 804 can be press fit into place. In other embodiments, the cover 804 can be attached via screws, glue, welding, or other appropriate means depending on the material selected.
In some embodiments, the lower jaw 82 can have a top surface 805 that opposes the underside 806 of the arms 85. The top surface 805 may be substantially flat to maintain uniform contact with the IGU 71, thereby avoiding uneven pressure on the glass substrate 72. In some embodiments, the top surface 805 can have a rectangular shape with dimensions ranging from about 0.2 to about 0.5 inches wide by about 0.3 to about 0.75 inches deep.
The top surface 805 can be supported by the lower jaw base 807 which connects the top surface 805 with the jaw flange 803. In some embodiments, the lower jaw 82 can be manufactured using the same 3D printing process and material used to create the clamp housing 88. In other embodiments, the lower jaw 82 and flange 803 can be created from polymers, metals, or other solid materials. In the embodiment shown in
In some embodiments, the sled 800 is placed within the chamber 89 but remains free to move up and down the chamber 89. However, the spring 802 may exert a force to keep the sled 800 at the top of the chamber 89 when at rest. The shape of the sled 800 can follow the inner contours of the chamber 89 which in some embodiments is rectangular. The sled 800 can be shorter in length than the chamber 89 to allow the sled 800 to travel up and down during operation of the clamp 80. A shorter sled 800 in comparison to the chamber 89 can allow greater travel distance but may require a longer spring 802 to fill the void created by having a shorter sled 800. In some embodiments, the sled 800 may have cut outs to fit around the spring rod 801 and outer guide rods 801.
In some embodiments a beam 104 extends from the back of the sled 800 and through the slot 105 in the back of the housing 88 as shown in
The front of the sled 800 is substantially flat with a tongue 808 extending forward that runs the length of the sled 800 from top to bottom which may assist in properly aligning the groove of the flange 803 on the sled 800. In some embodiments, the front of the sled 800 can have various screw holes 809 for connecting the flange 803 to the sled 800 in more than one position, thus making the clamp 80 adjustable.
As discussed previously, the ideal solder joint is one that achieves or surpasses the required pull strength while using minimal solder. In some embodiments, it is desirable to have a solder joint 63 where the solder 60 completely surrounds the wire 62 (see
In some embodiments, to maintain the spacing 121 between the wire 62 and the solder tab 61, the wire insulation 110 functions as a spacer as shown in
In other embodiments, solder 60 may be pre-applied to the exposed wire 62 to prevent the wire from contacting the solder tab 61 during soldering, as shown in
In some embodiments, a solder ribbon 131, ranging from about 0.1 to 0.25 inches wide, is swaged or crimped around the exposed wire. In other embodiments, the solder is cast around the wire. In some embodiments, the radius of the outside of the solder ribbon 131 is equal to the outside radius of the wire insulation 110 such that the solder 131 is tangential to the solder tab 61 when the wire 62 is placed on the glass substrate 72 of the IGU 71.
In some embodiments, a wire with solder ribbon 131 can be soldered to the solder tab 61 by utilizing the soldering tip 40 with a trough 49 of the current invention. The trough 49 can surround the solder ribbon 131, thereby melting the solder and forming the solder joint 63 in a parabola shape, which may be desirable in some embodiments.
In some embodiments, step two 142 is commenced by cleaning the solder tab 61 with a fiber glass pen which may remove the oxidized top layer off the silver solder tab 61 by a controlled abrasive action. In other embodiments, a fine-wire stainless steel brush may be used.
In some embodiments, the step three 143 is positioning the prepared wire on the solder tab 61. In some embodiments, the operator may manually hold the wire in place until step four 144 is completed.
In some embodiments, step four 144 entails fixing the wire in position on the solder tab 61 using the clamp 80 of the current invention. In some embodiments, the operator may hold the wire 62 in place with one hand while operating the clamp 80 with the other hand. The jaws 81, 82 of the clamp 80 may be opened by the operator and the bumper 84 may be placed in contact with the outer edge of the glass substrate 72 of the IGU 71. The operator may then adjust the clamp 80 such that the arms 85 of the clamp 80 surround the exposed wire 62 to be soldered, ensuring that the wire 62 is aligned with the aperture 86 of the arms 85, then release the beam 104 and stub 103, thereby allowing the jaws 81, 82 of the clamp 80 to close, fixing the wire 62 in place.
In some embodiments, step five 145 is the positioning the soldering tool 10 so the neck 47 of the soldering tip 40 contacts the valley 87 of the clamp 80 to maintain the lateral positioning of the soldering tool 10 during soldering. In some embodiments, the operator may visually confirm that the trough 49 of the soldering tip 40 is aligned with the wire 62, then place the tip 40 in position such that the trough 49 is surrounding the wire 62 to be soldered.
In some embodiments, step six 146 may be when the operator activates power to the soldering tool 10, thereby ultrasonically soldering the wire 62 to the solder tab 61. In some embodiments, the operator may visually inspect the solder joint 63 as it is being formed. The operator may then deactivate the power to the soldering tool 10 after the joint is formed. In some embodiments, the power is supplied to the soldering tip for 4-6 seconds to create the solder joint.
In some embodiments, the operator may need to manually apply solder at the solder joint location to create the solder joint. In other embodiments, such as when the automatic soldering tool is used, the solder may be supplied by the soldering tool, thus relieving the operator of the duty to manually supply solder at the solder joint location.
In some embodiments, step seven 147 may be when the operator removes the soldering tool 10 from the soldering location by raising the soldering tip 40 until the trough 49 no longer surrounds the solder joint 63. The operator may then move the soldering tool 10 away from the IGU 71.
In some embodiments, the solder joint may freeze during step eight 148 which occurs when the operator removes the soldering tool 10 and puts the tool aside. In some embodiments, the joint may freeze in about 2-3 seconds.
Step nine 149, in some embodiments, may be when the operator removes the clamp 80 from the IGU 71. The operator may grip the beam 104 and the stub 103 and squeeze them together, thereby opening the jaws 81, 82 so the clamp 80 may be removed.
In some embodiments, the process described in
The present application claims the benefit of the filing date of U.S. Provisional Application No. 61/736,801, filed Dec. 13, 2012, and U.S. Provisional Application No. 61/764,780, filed Feb. 14, 2013, the disclosures of which are hereby incorporated herein by reference.
Number | Date | Country | |
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61736801 | Dec 2012 | US | |
61764780 | Feb 2013 | US |