Claims
- 1. An underwater cutting granulating device for cutting and granulating a fused resin extruded from a die into a water chamber by a cutter rotated in the state where a knife is opposed to the die,the knife of the cutter having a convex guide surface for guiding a water flow in the direction of drawing it toward the die, which is formed on a surface opposite to a surface facing the die, wherein a guide surface of the knife facing the die has a front part inclined away from the die and a rear part inclined toward the die, as viewed in a direction from the front part toward the rear part.
- 2. An underwater cutting granulating device according to claim 1 wherein the knife is formed so that a height dimension (h) thereof becomes thinner along the rotating direction in order to reduce the velocity of the circling directional water flow generated along a front surface of the die.
- 3. An underwater cutting granulating device according to claim 1 whereby a sectional form of the knife has a streamline shape in a rotating direction.
- 4. An underwater cutting granulating device for cutting and granulating a fused resin extruded from a die into a water chamber by a cutter rotated in the state where a knife is opposed to the die,the knife of the cutter having a convex guide surface for guiding a water flow in the direction of drawing it toward the die, which is formed on a surface opposite to a surface facing the die and has a front part inclined away from the die, a middle part merging with the front part and a rear part inclined toward the die and merging with the middle part, wherein the middle part is formed into a curved surface so that no ridge line appears on the convex guide surface, and the knife of the cutter having a surface of the knife facing the die, which has a front part inclined away from the die, and a rear part substantially parallel to the surface of the die, wherein the rear part of the convex guide surface meets the rear part of the surface of the knife facing the die.
Parent Case Info
This application is a division of application Ser. No. 09/179,894, filed on Oct. 28, 1998, now U.S. Pat. No. 6,174,475, which is a continuation of PCT Application PCT/JP98/00856, filed on Mar. 4, 1998.
US Referenced Citations (10)
Foreign Referenced Citations (2)
Number |
Date |
Country |
2 659 250 |
Sep 1991 |
FR |
WO 9633853 |
Oct 1996 |
WO |
Non-Patent Literature Citations (1)
Entry |
Patent Abstracts of Japan, vol. 1997, No. 07, Jul. 31, 1997, JP 09 057745, Mar. 4, 1997. |
Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/JP98/00856 |
Mar 1998 |
US |
Child |
09/179894 |
|
US |