Claims
- 1. An apparatus for use in electrochemical devices comprising:
a porous metal flow field having a first face; and a porous metal gas diffusion layer metallurgically bonded to the first face of the expanded metal flow field.
- 2. The apparatus of claim 1, wherein the porous metal gas diffusion layer is treated with a wet proofing agent.
- 3. The apparatus of claim 1, further comprising a metal gas barrier having a first face metallurgically bonded to a second face of the porous metal flow field.
- 4. The apparatus of claim 3, further comprising:
a second porous metal flow field having a first face metallurgically bonded to a second face of the metal gas barrier; and a second porous metal gas diffusion layer having a face metallurgically bonded to a second face of the second porous metal flow field.
- 5. The apparatus of claim 3, wherein the metal gas barrier is a metal sheet.
- 6. The apparatus of claim 3, wherein the metal gas barrier is a fluid cooled plate.
- 7. The apparatus of claim 1, wherein the porous metal flow field is selected from metal foam, expanded metal sheet, sintered metal particles or sintered metal fibers.
- 8. The apparatus of claim 1, wherein the porous metal gas diffusion layer is selected from sintered metal particles or sintered metal fibers.
- 9. The apparatus of claim 1, wherein the metallurgical bonds are formed by a process selected from welding, brazing, soldering, sintering, fusion bonding, vacuum bonding, or combinations thereof.
- 10. An apparatus for use in electrochemical devices comprising:
a porous metal flow field having a first face; and a gas diffusion layer in contact with the porous metal flow field, the gas diffusion layer comprising a gas diffusion matrix and a metal current collector disposed within the gas diffusion matrix, wherein the gas diffusion matrix comprises conductive carbon fiber, conductive carbon powder and a hydrophobic bonding material.
- 10. The apparatus of claim 10, wherein the hydrophobic bonding material is polytetrafluoroethylene.
- 11. The apparatus of claim 10, wherein the porous metal flow field is selected from metal foam, expanded metal sheet, sintered metal particles or sintered metal fibers.
- 12. The apparatus of claim 10, wherein the metal current collector is a metal grid.
- 13. The apparatus of claim 10, further comprising a metal gas barrier having a first face metallurgically bonded to a second face of the porous metal flow field.
- 15. The apparatus of claim 14, further comprising:
a second porous metal flow field having a first face metallurgically bonded to a second face of the metal gas barrier; and a second gas diffusion layer having a face in contact with a second face of the second porous metal flow field.
- 16. The apparatus of claim 14, wherein the metal gas barrier is a metal sheet.
- 17. The apparatus of claim 14, wherein the metal gas barrier is a fluid cooled plate.
Parent Case Info
[0001] This is a division of application Ser. No. 09/680,377, filed Oct. 5, 2000, which was 5 a continuation of application Ser. No. 09/307,410, filed May 8, 1999, now U.S. Pat. No. 6,232,010.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09680377 |
Oct 2000 |
US |
Child |
10274494 |
Oct 2002 |
US |
Continuations (1)
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Number |
Date |
Country |
Parent |
09307410 |
May 1999 |
US |
Child |
09680377 |
Oct 2000 |
US |