Patent Application
20130143421
1. Field of the Invention The present invention relates to a USB connector, especially to a USB connector supporting both protocols of USB2.0 and USB3.0.
2. Description of Related Art
A peripheral device having USB interfaces provides a plug-and-play function, so after relevant products are launched, the products really catch consumers attention.
The USB2.0 protocol is capable of providing a transmission speed up to 480M bits/sec. With the development of multimedia technology, if a multimedia file having a volume of 25 GB is desired to be downloaded through the USB2.0 protocol, it may take quite a while and may not satisfy consumer's needs. As a result, the USB3.0 protocol is launched, the USB3.0 protocol is capable of providing a transmission speed up to 4.8 G bits/sec, if the same 25 GB multimedia file is desired to be downloaded through the USB 3.0 protocol, the required time is only one tenth of the original time that the USB2.0 protocol may take.
However, the USB2.0 protocol is still the main stream in the market, and most peripheral devices having USB interfaces can only support the USB2.0 protocol, so how to design an electric connector capable of supporting both of the USB2.0 and USB3.0 protocols is an issue to be concerned.
Referring to
With respect to the mentioned disadvantages of conventional connectors, the present invention provides a novel USB connector for improving said disadvantages.
One primary objective of the present invention is to provide a USB connector in which the front of a substrate is formed with a lead angle, so when being inserted with a USB plug, the lead angle allows the front edge of the substrate to be in forward contact with terminals of the USB plug without squeezing the front edges of the terminals of the USB plug.
Another objective of the present invention is to provide a USB connector in which plural first contact pads and plural second contact pads are installed, and the plural first contact pads and the plural second contact pads can staggeringly arranged at the same side or oppositely arranged.
One another objective of the present invention is to provide a USB connector having a USB2.0 connector and a USB3.0 connector having different transmission speed, for meeting the needs of transmitting with different transmission speeds.
Still one another objective of the present invention is to provide a USB connector having advantages of thinner thickness, lower production cost and not limiting to be applied in certain models when being used.
For achieving said objectives, the present invention provides a USB connector, which comprises: a connector main body having plural open slots, plural first terminals and plural second terminals, every two open slots are spaced by a slot column, wherein one end of the plural first terminals are respectively disposed in front of the plural slot columns, the lateral sides thereof are respectively and downwardly bent then further bent towards right or left thereby forming a first solder end, one end of the plural second terminals are respectively provided in the plural open slots and exposed outside the open slots, the other ends are respectively and downwardly bent then horizontally extended thereby forming a second solder end, the front of the connector main body is downwardly extended thereby forming a stop part having a first lead angle; and a substrate having plural first contact pads and plural second contact pads, wherein the plural first contact pads are disposed at the front portion of the substrate and at the locations corresponding to the first solder ends thereby allowing the plural first terminals to be coupled with, the plural second contact pads are disposed at the rear portion of the substrate and at the locations corresponding to the second solder ends thereby allowing the plural second terminals to be coupled with, so as to form a USB connector.
For achieving said objectives, the present invention provides a USB connector, which comprises: a connector main body having plural open slots, plural first terminals and plural second terminals, wherein every two open slots are spaced by a slot column, one end of the plural first terminals are respectively disposed below the plural slot columns and exposed outside the plural slot columns then forwardly extended, the other ends are respectively and downwardly bent then horizontally extended thereby forming a first solder end, one end of the plural second terminals are respectively provided in the plural open slots and exposed outside the open slots, the other ends are respectively and downwardly bent then horizontally extended thereby forming a second solder end, the front of the connector main body is downwardly extended thereby forming a stop part having a first lead angle; and a substrate having plural first contact pads and plural second contact pads, and the plural first contact pads and the plural second contact pads are staggeringly arranged for being respectively coupled to the plural first terminals and the plural second terminals, thereby forming a USB connector.
For achieving said objectives, the present invention provides a USB connector, which comprises: a connector main body having plural open slots, plural first terminals and plural second terminals, every two open slots are spaced by a slot column, wherein one end of the plural first terminals are respectively disposed in front of the plural slot columns, the lateral sides thereof are respectively and downwardly bent then further bent towards right or left thereby forming a first solder end, one end of the plural second terminals are respectively provided in the plural open slots and exposed outside the open slots, the other ends are respectively and downwardly bent then horizontally extended, thereby forming a second solder end, the front of the connector main body is formed with a first lead angle; and a substrate having plural first contact pads and plural second contact pads, wherein the plural first contact pads are disposed at the front portion of the substrate and at the locations corresponding to the first solder ends thereby allowing the plural first terminals to be coupled with, the plural second contact pads are disposed at the rear portion of the substrate and at the locations corresponding to the second solder ends thereby allowing the plural second terminals to be coupled with, so as to form a USB connector.
For achieving said objectives, the present invention provides a USB connector, which comprises: a connector main body having plural open slots, plural first terminals and plural second terminals, wherein every two open slots are spaced by a slot column, one end of the plural first terminals are respectively disposed below the plural slot columns and exposed outside the plural slot columns then forwardly extended, the other ends are respectively and downwardly bent then horizontally extended thereby forming a first solder end, one end of the plural second terminals are respectively provided in the plural open slots and exposed outside the open slots, the other ends are respectively and downwardly bent then horizontally extended thereby forming a second solder end, the front of the connector main body is formed with a first lead angle; and a substrate having plural first contact pads and plural second contact pads, and the plural first contact pads and the plural second contact pads are staggeringly arranged for being respectively coupled to the plural first terminals and the plural second terminals, thereby forming a USB connector.
The present invention will be apparent to those skilled in the art by reading the following detailed description of a preferred embodiment thereof, with reference to the attached drawings, in which:
a is a schematic view illustrating the front of a substrate of a conventional USB connector not being formed with a lead angle structure;
b is a schematic view illustrating the substrate of a conventional USB connector being inserted with the terminal of a USB plug;
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention, wherein
As shown in figures, the USB connector provided by the present invention comprises a connector main body 100 and a substrate 200.
The connector main body 100 is made of an insulation material, e.g. but not limited to plastic, and is formed with plural open slots 101, plural first terminals 110 and plural second terminals 120, wherein every two open slots 101 are spaced by a slot column 102, one end of the plural first terminals 110, e.g. but not limited to the right end, are respectively disposed in front of the plural slot columns 102, the lateral sides thereof are respectively and downwardly bent then further bent towards right or left thereby forming a surface, wherein the two first terminals 110 at the right side are bent towards right, the two first terminals 110 at the left side are bent towards left, thereby respectively forming a first solder end 111. Wherein, the quantity of the plural first terminals 110 is the same as that of the plural slot columns 102, and the quantity is e.g. but not limited to four.
One end of the plural second terminals 120, e.g. but not limited to the right end, are respectively provided in the plural open slots 101 and exposed outside the open slots 101, the other ends, e.g. but not limited to the left end, are respectively and downwardly bent then horizontally extended, thereby forming a second solder end 121. The front of the connector main body 100 is downwardly extended for forming a stop part 130 having a first lead angle 131, e.g. but not limited to 30 degree. Wherein, the stop part 130 is served to stop and position the substrate 200, such that plural first contact pads 210 and plural second contact pads 220 are able to be aligned with the first solder ends 111 of the plural first terminals 110 and the second solder ends 121 of the plural second terminals 120. The quantity of the plural second terminals 120 is the same as that of the plural open slots 101, and the quantity is e.g. but not limited to five.
In addition, one end of each second terminal 120 is exposed outside the open slot 101 then further upwardly bent then downwardly bent.
The substrate 200 has the plural first contact pads 210 and the plural second contact pads 220 respectively exposed outside the substrate 200, wherein the plural first contact pads 210 are disposed at the front portion of the substrate 200 and at the locations corresponding to the first solder ends 111 thereby allowing the plural first terminals 110 to be coupled with, the plural second contact pads 220 are disposed at the rear portion of the substrate 200 and at the locations corresponding to the second solder ends 121 thereby allowing the plural second terminals 120 to be coupled with, so as to form a USB connector.
In addition, the front of each first terminal 110 is further formed with a second lead angle 140, e.g. but not limited to 30 degree.
Moreover, the substrate 200 is, e.g. but not limited to, a Chip-On-Board (COB) substrate or a printed circuit board substrate; in this embodiment, the COB substrate is adopted for illustration and not served as a limitation. The COB technology has properties of thin thickness, compact wiring and small area, so it is widely used in the package of LCD driving chips or NAND flash memories.
The quantity of the plural first contact pads 210 is e.g. but not limited to four, thereby forming a USB2.0 connector, wherein the plural first contact pads 210 are able to respectively transmit VBUS, D−, D+ and GND signals of USB2.0 specification. The quantity of the plural second contact pads 220 is e.g. but not limited to five, wherein the plural second contact pads 220 are able to respectively transmit StdA_SSRX−, StdA_SSRX+, GND_DRAIN, StdA_SSTX− and StdA_SSTX+ signals of USB3.0 specification.
According to the USB connector provided by the present invention, the substrate 200 further includes a USB controller 230 and at least a flash memory 240 respectively coupled to the plural first contact pads 210 and the plural second contact pads 220. The USB controller 230 and the flash memory 240 are installed on the substrate 200 with the Chip-On-Board (COB) means, wherein the Chip-On-Board technique is a conventional art therefore no further illustration is provided.
Referring to
As shown in
Referring from
As shown in figures, the USB connector provided by the present invention comprises a connector main body 400 and a substrate 500.
The connector main body 400 is made of an insulation material, e.g. but not limited to plastic, and is formed with plural open slots 401, plural first terminals 410 and plural second terminals 420, wherein every two open slots 401 are spaced by a slot column 402, one end of the plural first terminals 410, e.g. but not limited to the right end, are respectively disposed below the plural slot columns 402, exposed outside the plural slot columns 402 then forwardly extended, the other ends, e.g. but not limited to the left end, are respectively and downwardly bent then horizontally extended, thereby forming a first solder end 411. Wherein, the quantity of the plural first terminals 410 is the same as that of the plural slot columns 402, and the quantity is e.g. but not limited to four. In addition, the front of the connector main body 400 is downwardly extended for forming a stop part 430 having a first lead angle 431, wherein the stop part 430 is served to stop and position the substrate 500, the first lead angle 431 is e.g. but not limited to 30 degree.
One end of the plural second terminals 420, e.g. but not limited to the right end, are respectively provided in the plural open slots 401 and exposed outside the open slots 401, the other ends, e.g. but not limited to the left end, are respectively and downwardly bent then horizontally extended, thereby forming a second solder end 421. Wherein, the quantity of the plural second terminals 420 is the same as that of the plural open slots 401, and the quantity is e.g. but not limited to five.
In addition, one end of each second terminal 420 is exposed outside the open slot 401 then further upwardly bent then downwardly bent.
The substrate 500 has plural first contact pads 510 and plural second contact pads 520 respectively exposed outside the substrate 500, and the plural first contact pads 510 and the plural second contact pads 520 are, for example, staggeringly arranged.
The plural first contact pads 510 and the plural second contact pads 520 are respectively served to allow the first solder ends 411 of the plural first terminals 410 and the second solder ends 421 of the plural second terminals 420 to be soldered thereon.
In addition, the front of each first terminal 410 is further formed with a second lead angle 440, e.g. but not limited to 30 degree. The function of the first lead angle 431 and the second lead angle 440 is the same as that of the first lead angle 131 and the second lead angle 140, therefore no further illustration is provided.
Moreover, the substrate 500 is, e.g. but not limited to, a Chip-On-Board (COB) substrate or a printed circuit board substrate; in this embodiment, the COB substrate is adopted for illustration and not served as a limitation. The COB technology has properties of thin thickness, compact wiring and small area, so it is widely used in the package of LCD driving chips or NAND flash memories.
The quantity of the plural first contact pads 510 is e.g. but not limited to four, thereby forming a USB2.0 connector, wherein the plural first contact pads 510 are able to respectively transmit VBUS, D−, D+ and GND signals of USB2.0 specification.
The plural second contact pads 520 are, for example, staggeringly arranged with the plural first contact pads 510, the quantity thereof is e.g. but not limited to five, wherein the plural second contact pads 520 are able to respectively transmit StdA_SSRX−, StdA_SSRX+, GND_DRAIN, StdA_SSTX− and StdA_SSTX+ signals of USB3.0 specification.
According to the USB connector provided by the present invention, the substrate 500 further includes a USB controller 530 and at least a flash memory 540 respectively coupled to the plural first contact pads 510 and the plural second contact pads 520. The USB controller 530 and the flash memory 540 are installed on the substrate 500 with the Chip-On-Board (COB) means, wherein the Chip-On-Board technique is a conventional art therefore no further illustration is provided.
Referring to
Referring from
As shown in figures, the USB connector provided by the present invention comprises a connector main body 600 and a substrate 700.
The connector main body 600 is made of an insulation material, e.g. but not limited to plastic, and is formed with plural open slots 601, plural first terminals 610 and plural second terminals 620, wherein every two open slots 601 are spaced by a slot column 602, one end of the plural first terminals 610, e.g. but not limited to the right end, are respectively disposed in front of the plural slot columns 602, the lateral sides thereof are respectively and downwardly bent then further bent towards right or left thereby forming a surface, wherein the two first terminals 610 at the right side are bent towards right, the two first terminals 610 at the left side are bent towards left thereby respectively forming a first solder end 611. Wherein, the quantity of the plural first terminals 610 is the same as that of the plural slot columns 602, and the quantity is e.g. but not limited to four.
One end of the plural second terminals 620, e.g. but not limited to the right end, are respectively provided in the plural open slots 601 and exposed outside the open slots 601, the other ends, e.g. but not limited to the left end, are respectively and downwardly bent then horizontally extended, thereby forming a second solder end 621. The front of the connector main body 600 is formed with a first lead angle 631, e.g. but not limited to 30 degree. Wherein, the quantity of the plural second terminals 620 is the same as that of the plural open slots 601, and the quantity is e.g. but not limited to five.
In addition, one end of each second terminal 620 is exposed outside the open slot 601 then further upwardly bent then downwardly bent.
The substrate 700 has plural first contact pads 710 and plural second contact pads 720 respectively exposed outside the substrate 700, wherein the plural first contact pads 710 are disposed at the front portion of the substrate 700 and at the locations corresponding to the first solder ends 611 thereby allowing the plural first terminals 610 to be coupled with, the plural second contact pads 720 are disposed at the rear portion of the substrate 700 and at the locations corresponding to the second solder ends 621 thereby allowing the plural second terminals 620 to be coupled with, so as to form a USB connector.
Moreover, the substrate 700 is, e.g. but not limited to, a Chip-On-Board (COB) substrate or a printed circuit board substrate; in this embodiment, the COB substrate is adopted for illustration and not served as a limitation. The COB technology has properties of thin thickness, compact wiring and small area, so it is widely used in the package of LCD driving chips or NAND flash memories.
The quantity of the plural first contact pads 710 is e.g. but not limited to four, thereby forming a USB2.0 connector, wherein the plural first contact pads 710 are able to respectively transmit VBUS, D−, D+ and GND signals of USB2.0 specification.
The quantity of the plural second contact pads 720 is e.g. but not limited to five, wherein the plural second contact pads 720 are able to respectively transmit StdA_SSRX−, StdA_SSRX+, GND_DRAIN, StdA_SSTX− and StdA_SSTX+ signals of USB3.0 specification.
In addition, the front of each first terminal 610 is further formed with a second lead angle 640, e.g. but not limited to 30 degree. The function of the first lead angle 631 and the second lead angle 640 is the same as that of the first lead angle 131 and the second lead angle 140, therefore no further illustration is provided.
According to the USB connector provided by the present invention, the substrate 700 further includes a USB controller 730 and at least a flash memory 740 respectively coupled to the plural first contact pads 710 and the plural second contact pads 720. The USB controller 730 and the flash memory 740 are installed on the substrate 700 with the Chip-On-Board (COB) means, wherein the Chip-On-Board technique is a conventional art therefore no further illustration is provided.
Referring to
Referring from
As shown in figures, the USB connector provided by the present invention comprises a connector main body 800 and a substrate 900.
The connector main body 800 is made of an insulation material, e.g. but not limited to plastic, and is formed with plural open slots 801, plural first terminals 810 and plural second terminals 820, wherein every two open slots 801 are spaced by a slot column 802, one end of the plural first terminals 810, e.g. but not limited to the right end, are respectively disposed below the plural slot columns 802, exposed outside the plural slot columns 802 then forwardly extended, the other ends, e.g. but not limited to the left end, are respectively and downwardly bent then horizontally extended, thereby forming a first solder end 811. Wherein, the quantity of the plural first terminals 810 is the same as that of the plural slot columns 802, and the quantity is e.g. but not limited to four. Moreover, the front of the connector main body 800 is formed with a first lead angle 831, e.g. but not limited to 30 degree.
One end of the plural second terminals 820, e.g. but not limited to the right end, are respectively provided in the plural open slots 801 and exposed outside the open slots 801, the other ends, e.g. but not limited to the left end, are respectively and downwardly bent then horizontally extended, thereby forming a second solder end 821. Wherein, the quantity of the plural second terminals 820 is the same as that of the plural open slots 801, and the quantity is e.g. but not limited to five.
In addition, one end of each second terminal 820 is exposed outside the open slot 801 then further upwardly bent then downwardly bent.
The substrate 900 has plural first contact pads 910 and plural second contact pads 920 respectively exposed outside the substrate 900, and the plural first contact pads 910 and the plural second contact pads 920 are, for example, staggeringly arranged. The plural first contact pads 910 and the plural second contact pads 920 are respectively served to allow the first solder ends 811 of the plural first terminals 810 and the second solder ends 821 of the plural second terminals 820 to be soldered thereon.
Moreover, the substrate 900 is, e.g. but not limited to, a Chip-On-Board (COB) substrate or a printed circuit board substrate; in this embodiment, the COB substrate is adopted for illustration and not served as a limitation. The COB technology has properties of thin thickness, compact wiring and small area, so it is widely used in the package of LCD driving chips or NAND flash memories.
The quantity of the plural first contact pads 910 is e.g. but not limited to four, thereby forming a USB2.0 connector, wherein the plural first contact pads 910 are able to respectively transmit VBUS, D−, D+ and GND signals of USB2.0 specification. The plural second contact pads 920 are, for example, staggeringly arranged with the plural first contact pads 910, the quantity thereof is e.g. but not limited to five, wherein the plural second contact pads 920 are able to respectively transmit StdA_SSRX−, StdA_SSRX+, GND_DRAIN, StdA_SSTX− and StdA_SSTX+ signals of USB3.0 specification.
In addition, the front of each first terminal 810 is further formed with a second lead angle 840, e.g. but not limited to 30 degree. The function of the first lead angle 831 and the second lead angle 840 is the same as that of the first lead angle 131 and the second lead angle 140, therefore no further illustration is provided.
According to the USB connector provided by the present invention, the substrate 900 further includes a USB controller 930 and at least a flash memory 940 respectively coupled to the plural first contact pads 910 and the plural second contact pads 920. The USB controller 930 and the flash memory 940 are installed on the substrate 900 with the Chip-On-Board (COB) means, wherein the Chip-On-Board technique is a conventional art therefore no further illustration is provided.
Referring to
As what is disclosed above, the USB connector of the present invention has following advantages: 1. having a USB2.0 connector and a USB3.0 connector having different transmission speed, for meeting the needs of USB connector having different transmission speed; 2. the front of the substrate being formed with a lead angle, so when being inserted with a USB plug, the lead angle allows the front edge of the substrate being in forward contact with terminals of the USB plug without squeezing the front edges of the terminals of the USB plug; 3. having plural first contact pads and plural second contact pads which can be arranged at the same side or oppositely arranged; and 4. Having thinner thickness, lower production cost and not limiting to be applied in certain models when being used. Therefore the USB connector provided by the present invention is novel compared to conventional USB connectors.
Many modifications and other embodiments of the inventions set forth herein will come to mind to one skilled in the art to which these inventions pertain having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is to be understood that the inventions are not to be limited to the specific examples of the embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
| Number | Date | Country | Kind |
|---|---|---|---|
| 100222804 | Dec 2011 | TW | national |
