The present disclosure generally relates to multi-service platform system and computer modules.
The background description provided herein is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.
Printed circuit boards are frequently built as modules which are inserted to a multi-service platform system. The modules are predominately circuit boards, which are fitted with a large number of electronic components. On their inboard ends, the modules have connectors which are mated with corresponding counter-connectors when inserted into a holding fixture. These connectors may be, for example, coaxial connectors or circuit boards with a large number of blade contacts.
A computer module typically includes a faceplate. Various connectors (e.g. USB receptacles, mini D-Sub connectors), switches, and indicator lights are provided in the faceplate. The computer modules are typically designed to conform to one or more industrial standards (such as VPX/VITA 46). Considering the limited physical surface area of the faceplate and other design requirements commanded by various industry standards, arrangement of the connectors, switches, and indicator lights on the faceplate can present various design challenges.
A USB receptacle assembly including a USB receptacle having a first end, a second end opposite the first end, and a USB interface located at the first end. A riser is coupled to the second end of the USB receptacle and is generally perpendicular to a long axis of the USB receptacle. A board connector is coupled to the riser and in electrical communication with the USB receptacle.
A computer board assembly including a circuit board having connectors located at an inboard end of the circuit board and configured to be coupled to a slot of a backplane. A USB receptacle has a first end, a second end opposite the first end, and a USB interface includes a first flange disposed at the first end. A riser is coupled to the second end of the USB receptacle at a first end of the riser. A board connector is coupled to an outboard end of the circuit board and a second end of the riser. The board connector electrically communicates with the USB receptacle and the circuit board. An electrically conductive element is coupled to the circuit board and positioned between the USB receptacle and the circuit board. A retention bracket engages the USB receptacle and is positioned inboard of and adjacent to the flange.
A computer module includes a circuit board and a faceplate coupled to the circuit board. The faceplate has first and second adjacent apertures positioned along a width of the faceplate. A USB receptacle has a first end and a second end, with a USB interface and a first flange are disposed in proximity to the first end. A riser is coupled to the second end of the USB receptacle at the first end. A board connector is coupled to the circuit board and a second end of the riser. The board connector is in electrical communication with the USB receptacle and the circuit board. An I/O connector is coupled to the circuit board and positioned between the USB receptacle and the circuit board, and a portion of the I/O connector is placed in the second aperture. The computer module also includes a retention bracket and a fastener. A portion of the flange is placed generally within the first aperture, and the retention bracket engages the USB receptacle and is arranged adjacent to an inboard face of the faceplate and covers a portion of the first aperture. The retention bracket and the first aperture restrict movement of the flange, and the fastener secures the retention bracket to the faceplate.
Further areas of applicability of the present disclosure will become apparent from the detailed description provided hereinafter. It should be understood that the detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure.
The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:
The foregoing description is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure can be implemented in a variety of forms. Therefore, while this disclosure includes particular examples, the true scope of the disclosure should not be so limited since other modifications will become apparent upon a study of the drawings, the specification, and the following claims. For purposes of clarity, the same reference numbers will be used in the drawings to identify similar elements. As used herein, the phrase at least one of A, B, and C should be construed to mean a logical (A or B or C), using a non-exclusive logical OR. It should be understood that one or more steps within a method may be executed in different order (or concurrently) without altering the principles of the present disclosure.
As used herein, the term module may refer to, be part of, or include an Application Specific Integrated Circuit (ASIC); an electronic circuit; a combinational logic circuit; a field programmable gate array (FPGA); a processor (shared, dedicated, or group) that executes code; other suitable hardware components that provide the described functionality; or a combination of some or all of the above, such as in a system-on-chip. The term module may include memory (shared, dedicated, or group) that stores code executed by the processor.
The term code, as used above, may include software, firmware, and/or microcode, and may refer to programs, routines, functions, classes, and/or objects. The term shared, as used above, means that some or all code from multiple modules may be executed using a single (shared) processor. In addition, some or all code from multiple modules may be stored by a single (shared) memory. The term group, as used above, means that some or all code from a single module may be executed using a group of processors. In addition, some or all code from a single module may be stored using a group of memories.
Terms for describing spatial arrangement, such as over, above, under, below, laterally, right, left, obliquely, back, and front, are often used for briefly showing, with reference to a diagram, a relation between an element and another element or between some characteristics and other characteristics. Note that embodiments of the present disclosure are not limited thereto, and such terms for describing spatial arrangement can indicate not only the direction illustrated in a diagram but also another direction. For example, when it is explicitly described that B is over A, it does not necessarily mean that B is placed over A, and can include the case where B is placed under A because a device in a diagram can be inverted or rotated by 180 degree. Accordingly, over can refer to the direction described by under in addition to the direction described by over. Note that embodiments of the present disclosure are not limited thereto, and over can refer to other directions described by laterally, right, left, obliquely, back, and front in addition to the directions described by over and under because a device in a diagram can be rotated in a variety of directions.
In certain embodiments, 3U module 103 can refer to a module or expansion card that has a 3U form factor, which includes physical dimensions, electrical connections, and the like. As is known in the art, “U” and multiples of “U” refer to the height (assuming a vertical mounting orientation) of a module or expansion card. In certain embodiments, “U” can measure approximately 1.75 inches. Therefore, 3U module 103 can measure approximately 3U in height. 3U module 103 can have its own specific set of electrical connections to interface with a backplane 104 of the computer chassis 112. As an example of an embodiment, multi-service platform system 100 can include the computer chassis 112 and one or more 3U modules conforming to the VPX/VITA 46 standard as set forth by VMEbus International Trade Association (VITA), P.O. Box 19658, Fountain Hills, Ariz., 85269. In certain embodiments, multi-service platform system 100 may include a packet switched network, known as a switched fabric 106 and a VMEbus network 108, both located on backplane 104.
In certain embodiments, multi-service platform system 100 can be controlled by a platform controller (not shown for clarity), which can include a processor for processing algorithms stored in memory. Memory comprises control algorithms, and can include, but is not limited to, random access memory (RAM), read only memory (ROM), flash memory, electrically erasable programmable ROM (EEPROM), and the like. Memory can contain stored instructions, tables, data, and the like, to be utilized by processor. Platform controller can be contained in one, or distributed among two or more payload modules with communication among the various modules of multi-service platform system 100.
In certain embodiments, the VMEbus network 108 is a parallel multi-drop bus network that is known in the art. The VMEbus network 108 is defined in the ANSI/VITA 1-1994 and ANSI/VITA 1.1-1997 standards, promulgated by the VMEbus International Trade Association (VITA), P.O. Box 19658, Fountain Hills, Ariz., 85269 (where ANSI stands for American National Standards Institute). In certain embodiments of the disclosure, the VMEbus network 108 can include VMEbus based protocols such as Single Cycle Transfer protocol (SCT), Block Transfer protocol (BLT), Multiplexed Block Transfer protocol (MBLT), Two Edge VMEbus protocol (2eVME) and Two Edge Source Synchronous Transfer protocol (2eSST). VMEbus network 108 is not limited to the use of these VMEbus based protocols and other VMEbus based protocols are within the scope of the disclosure.
In certain embodiments, switched fabric 106 can use switch module 110 as a central switching hub with any number of payload modules 102 coupled to switch module 110. Switched fabric 106 can be based on a point-to-point, switched input/output (I/O) fabric, whereby cascaded switch devices interconnect end node devices. Although
Multi-service platform system 100 can include any number of payload modules 102 and switch modules 110 coupled to the backplane 104. The backplane 104 can include hardware and software necessary to implement a VMEbus network 108 and a switched fabric 106.
In certain embodiments of the disclosure, computer module 101 can be an Advanced Telecommunications Computer Architecture (AdvancedTCA®) module having an AdvancedTCA form factor. AdvancedTCA form factor, including mechanical dimensions, electrical specifications, and the like, are known in the art and set forth in the AdvancedTCA Specification, by PCI Industrial Computer Manufacturers Group (PCIMG), 301 Edgewater Place, Suite 220, Wakefield, Mass.
In certain embodiments, computer module 101 can be a VMEbus computer module having a VMEbus form factor. VMEbus form factor, including mechanical dimensions, electrical specifications, and the like are known in the art and set forth in the ANSI/VITA 1-1994 and ANSI/VITA 1.1-1997 standards promulgated by the VMEbus International Trade Association (VITA), P.O. Box 19658, Fountain Hills, Ariz., 85269 (where ANSI stands for American National Standards Institute).
In certain embodiments, computer module 102 can be a CompactPCI board having a CompactPCI form factor. CompactPCI form factor, including mechanical dimensions, electrical specifications, and the like, are known in the art and set forth in the CompactPCI Specification, by PCI Industrial Computer Manufacturers Group (PCIMG™), 301 Edgewater Place, Suite 220, Wakefield, Mass. In still yet another embodiment, computer module 102 can be an Advanced Packaging System (APS) board having an APS form factor. APS form factor, including mechanical dimensions, electrical specifications, and the like, are known in the art and set forth in the ANSI/VITA Specification 34.
Depending on the specification to which computer module 101 is designed, computer module 101, and accordingly faceplate 116, will have specific physical dimensions. For example, to conform to the VPX/VITA 46 standard, computer module 101 may have a 3U, 6U, or 9U form factor. Accordingly, faceplate 116 of computer module 101 has a width of approximately 1.0 inch (referred to herein as a VPX width) and a height of approximately 3U, 6U or 9U. Various connectors, switches, indicator lights 120 can be arranged along a longitudinal direction of the faceplate and form a single row.
As technologies advance, specifications may require a greater number of components be included on circuit board 114. Accordingly, more connectors, switches, and indicator lights 120 may require arrangement on faceplate 116 to interface with the components on circuit board 114. In order to conform to a predetermined specification, the physical dimensions of computer module 101 and its faceplate typically cannot be changed. In addition, many of the connectors and switches 120 are also manufactured in accordance with industry standards, and thus their physical dimensions typically also cannot be changed. The shown single row arrangement of elements 120 on faceplate 116 limits the number of elements 120. After reaching that limitation, no more connectors or switches can be added to faceplate 116 under that arrangement.
In certain embodiments, USB receptacle assembly 138 has a board connector 210 that connects riser 200 with circuit board 114. Board connector 210 is in electrical communication with USB receptacle 132 and circuit board 114. Board connector 210 can, for example, include a straight type header connector 212 and a right angle type socket connector 214. Header connector 212 has a header housing 216 and header pins 218 (male contacts) for signal transmission. Header pins 218 are arranged in a plurality of rows on header housing 216. Socket connector 214 is placed on top of the header connector 212 and connected to header connector 212. Contacts of the sockets connector 214 are arranged to correspond to header pins 218 of header connector 212. Header connector 212 is connected to or mounted on circuit board 114, and header pins 218 are coupled to circuit board 114 for signal transmission. Socket connector 214 is connected to or mounted on riser 200 at lower end 223 of riser 200. Socket connector 214 is coupled to riser 200 and/or the USB receptacle 132 in a conventional manner.
Board connector 210 transmits signals between USB receptacle 132 and circuit board 114. Signals received by the USB receptacle 132 can be transmitted to board connector 210, and signals received by board connector 210 are transmitted to USB receptacle 132. Board connector 210 is generally perpendicular to both riser 200 and circuit board 114. Riser 200 is generally perpendicular to circuit board 114 and forms a generally L shape with circuit board 114. As shown in
Riser 200 is designed to have a height h that varies in accordance with the width w of the faceplate and the position of circuit board 114 relative to faceplate 116. Riser 200 elevates USB receptacle 132 to a position on top of a second connector such as a mini D-Sub connector 134 shown
Planar retention bracket 230 is formed in a U-shape in certain embodiments. Retention bracket 230 has two side portions 234, 236 and a top portion 232. Top portion 232 is approximately the width of USB receptacle 132 and connects the two side portions 234, 236. Lower edge 238 of top portion 232 and inner edges 240, 242 of respective side portions 234, 236 define an area that approximately has the dimensions corresponding to USB receptacle 132. Retention bracket 230 can be arranged to accommodate USB receptacle 132 at outboard end 142 of USB receptacle 132 and adjacent to flanges 160, 162, 164, 166 of USB receptacle 132. Outboard faces 244 of top portion 232 and side portions 234, 236 of the retention bracket engage with inboard faces 182 of top flange 160 and lateral flanges 164, 166, respectively. Each of side portions 234, 236 of retention bracket 230 has a bore 246, 248. As will be described in more detail later, fasteners can be inserted through the bores 246 in order to secure the USB receptacle assembly 138 with faceplate 116. Retention bracket 230 can be made of sheet metal and have a thickness less than 1 mm.
USB receptacle assembly 138 is arranged to accommodate mini D-Sub connector 134. Although mini D-Sub connector 134 is shown in the Figures, one skilled in the art will recognize that I/O connectors, or other elements, can be similarly arranged in space 224 beneath USB receptacle 132. As shown in
Faceplate 116 of computer module 101 has two adjacent apertures 256, 258 aligned along the width direction x of faceplate 116. In the particular example shown in
As shown in
A top wall, a bottom wall, and two side walls in faceplate 116 define respective top, bottom, and two side surfaces of the open area 268 of the inboard portion 264. The open area 268 of the inboard portion 264 can be slightly larger than the face area of the outboard end 142, including flanges 160, 162, 164, 166, of the USB receptacle 132. When the USB receptacle 132 is inserted into inboard portion 264, the top wall, bottom wall, and two side walls may engage with the edge portions of the flanges 160, 162, 164, 166 and generally restrict the planar movement of USB receptacle 132 in the inboard portion 264. Bores 288, 290 are formed in faceplate 116 to each side of top aperture 256. Bores 288, 290 on retention bracket 230 and respective bores 246, 248 are coaxially aligned.
Flanges 160, 162, 164, 166 of outboard end 142 of USB receptacle 132 are inserted into inboard portion 264 of top aperture 256. Flanges 160, 162, 164, 166 of USB receptacle 132 are placed in proximity to retention wall 274 in top aperture 256. Flanges 160, 162, 164, 166 recess into inboard portion 264, and the outer edge portions of flanges 160, 162, 164, 166 engage with the corresponding adjacent top wall 281, bottom wall 282, or side walls 283, in top aperture 256. Retention bracket 230 is placed in proximity to outboard end 142 of USB receptacle 132. Edge portions of top 232 and side portions 234, 236 of the retention bracket engage with at least portions of respective top wall 148, and two lateral walls 152, 153 of the USB receptacle 132. Outboard face 244 of the retention bracket 230 is placed against the inboard face of faceplate 116. Retention bracket 230 engages at least portions of flanges 160, 162, 164, 166. Each bore 246, 248 on retention bracket 230 is aligned to respective bores 288, 290 on the faceplate. A pair of fasteners 294 are inserted into each pair of aligned bores to securely fasten retention bracket 230 to faceplate 116. Examples of fasteners include threaded fasteners and rivets. Movement of flanges 160, 162, 164, 166, and consequently USB receptacle 132, is restricted in a direction z perpendicular to faceplate 116 by retention bracket 230 and retention wall 274. Movement of flanges 160, 162, 164, 166, and consequently USB receptacle 132, is restricted in a planar direction of faceplate 116 by the top, bottom, or side walls 280 in top aperture 256. Retention wall 274, side walls 280, and retention bracket 230 sufficiently constrain the movement of flanges 160, 162, 164, 166 and consequently movement of the USB receptacle 132.
USB receptacle 132 is attached to riser 200 in the manner described above. Riser 200 is attached to circuit board 114 through board connector 210 in the manner described above. A second connector 134 is coupled to circuit board 114 and placed in space 224 defined by USB receptacle 132, riser 200, circuit board 114, and faceplate 116. Referring to
The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.