Claims
- 1. A process of curing a polymer, other than a blend of poly(ethylene terephthalate) and a monovinylarene/cojugated diene block copolymer, wherein an organic peroxide is used as a source of free radicals, characterized in that at least one organic peroxide is selected from the group consisting of peroxides according to formula and mixtures thereof, whereinn=0 or 1, R1, R2, and R3 are independently selected from a first group consisting of hydrogen, C1-C20 alkyl, C2-C20 alkenyl, C2-C20 alkynyl, C3-C20 cycloalkyl, C3-C20 cycloalkenyl, C6-C20 aryl, C7-C20 aralkyl, and C7-C20 alkaryl, wherein the first group may include linear or branched alkyl moieties and which optionally are substituted with one or more groups selected from hydroxy, alkoxy, linear or branched polyalkyloxy aryloxy, halogen, ester, ketone, carboxy, nitrile, and amido, where any pair of R1-R2, R1-R3, and R2-R3may be linked to form a cyclic structure and R1, R2, and R3 may also be linked to form a polycyclic structure, and R4is selected from a second group of radicals consisting of C1-C20 alkyl, C1-C20 alkenyl, C2-C20 alkynyl, C3-C20 cycloalkyl, C3-C20 cycloalkenyl C6-C20 aryl, C7-C20 aralkyl, and C7-C20 alkaryl, wherein the second group may include linear or branched alkyl moieties and which optionally are substituted with one or more groups selected from hydroxy, alkoxy, linear or branched polyalkyloxy, aryloxy, halogen, ester, ketone, carboxy, nitrile, and amido, and radicals of formulae II and III, whereinm=0 or 1, R5 is selected from C1-20 alkylene, C1-20 alkenylene, C2-C20 alkynylene, C3-C20 cycloalkylene, C3-C20 cycloalkenylene, C6-C20 arylene, C7-20aralkylene, and C7-20aralkenylene groups, which groups may include linear or branched alkyl moieties and all of which may optionally contain one or more hetero atoms, and wherein R6, R7, R8, and R1′, R2′, R3′are independently selected from the group consisting of compounds according to the definition of R1, R2, and R3, respectively.
- 2. A process according to claim 1 wherein R1, R2, R3 and/or R1′, R2′, R3′ and/or R6, R7, and R8 are selected such that one or more of the following moieties is formed: H3C—CH═CH—CH═CH— (any isomer), and alkyl—O—CO—CH═CH— (any isomer).
- 3. A process according to claim 1 wherein R1, R2, R3, R1′, R2′, R3′, R6, R7, and R8 are independently selected from the group consisting of hydrogen, methyl, ethyl, propyl, isopropyl, butyl, tert-butyl, pentyl, hexyl, heptyl, nonyl, and phenyl.
- 4. A process according to any one of claims 1-3 wherein R5is —C═C—C═C— when n and m are 0, or C2-12 alkylene when both m and n are 1.
- 5. A process according to any one of claims 1-3 wherein the curing temperature is from 50 to 250° C.
- 6. A process according to any one of claims 1-3 wherein a silicone rubber is cured.
- 7. A process according to claim 6 wherein di(2-butenoyl) peroxide of formula (any isomer, or mixture of isomers) and/or di(2-butenoylperoxy) hexylenedicarbonate of formula (any isomer, or mixture of isomers) are used.
- 8. A process according to claim 6 wherein the peroxide is combined with other conventional peroxides.
- 9. Cured silicone rubber obtainable by the process of claim 6.
- 10. A process according to any one of claims 1-3 wherein a conventional unsaturated polyester and/or vinyl ester resin is cured.
- 11. A process according to claim 10 wherein di-2-butenoyl peroxide (any isomer, or mixture of isomers) or di-3-methyl-2-butenoyl peroxide (any isomer, or mixture of isomers) is used.
- 12. A process according to claim 10 wherein only a peroxide of formula I is used as a source of free radicals.
- 13. Cured unsaturated polyester resin attainable by the process of claim 10.
Priority Claims (1)
Number |
Date |
Country |
Kind |
99204463 |
Dec 1999 |
EP |
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Parent Case Info
This application claims priority of European Patent Application No. 99204463.6, filed Dec. 22, 1999 and benefit of U.S. patent application Ser. No. 60/176,593, filed Jan. 18, 2000.
US Referenced Citations (6)
Foreign Referenced Citations (12)
Number |
Date |
Country |
1 932 475 |
Jul 1970 |
DE |
0 208 353 |
Jan 1987 |
EP |
0 219 900 |
Apr 1987 |
EP |
0 235 537 |
Sep 1987 |
EP |
0 282 130 |
Sep 1988 |
EP |
0 667 339 |
Aug 1995 |
EP |
0 801 111 |
Oct 1997 |
EP |
0 896 982 |
Feb 1999 |
EP |
0 939 103 |
Sep 1999 |
EP |
1018364 |
Jan 1966 |
GB |
1 270 942 |
Apr 1972 |
GB |
11-246613 |
Sep 1999 |
JP |
Non-Patent Literature Citations (2)
Entry |
Sako Takahiro, Heat-Curable Silicone Rubber Composition And Molding Of Silicone Rubber, Patent Abstracts of Japan, 10046030, dated Feb. 17, 1998. |
International Search Report for PCT/EP00/12452. |
Provisional Applications (1)
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Number |
Date |
Country |
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60/176593 |
Jan 2000 |
US |