Patent Grant
11781752
The present disclosure relates to using diode rectification to determine igniter, inducer relay, and igniter relay faults or failures.
This section provides background information related to the present disclosure which is not necessarily prior art.
Gas powered appliances, such as gas powered furnaces, often include a hot surface igniter that heats up based on a supplied current to ignite a combustible gas. An igniter relay and an inducer relay may be used to selectively connect the hot surface igniter to the power source that supplies the current to the igniter. Failure of the hot surface igniter, the igniter relay, or an inducer relay can cause a failure of the gas powered appliance. And, it may be difficult to determine which of the hot surface igniter, the igniter relay, or the inducer relay has failed.
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Corresponding reference numerals may indicate corresponding (though not necessarily identical) features throughout the several views of the drawings.
Example embodiments will now be described more fully with reference to the accompanying drawings.
As noted above, the failure of a hot surface igniter, an igniter relay, or an inducer relay can cause a failure of a gas powered appliance. And, it may be difficult to determine which of the hot surface igniter, the igniter relay, or the inducer relay has failed.
Conventionally, the inducer must be turned ON to detect an igniter open fault. The analog signal is used as the feedback to detect igniter fault and igniter relay fault. The amplitude of the analog signal changes when switching the inducer relay and then again when switching the igniter relay. The amplitude of the analog signal also changes when the igniter is not present.
As recognized herein, there are several disadvantages associated with this conventional method to detect an igniter open fault in addition to having to turn ON the inducer. For example, the feedback signal varies as line voltage changes (80 Vac to 135 Vac) such that this conventional method is unable to accurately detect relay and igniter fault. Signal overlap could occur when line voltage changes, such that there may be a failure in fault detection and reporting of false faults. Grounding voltage affects fault detection, which may inhibit or prevent precisely detecting relay and igniter faults when grounding voltage is present. When the inducer relay is ON, grounding voltage cannot be checked which inhibits or prevents reliable detection of fault during grounding voltage.
After recognizing the above, exemplary embodiments were developed and/or disclosed herein of methods and controls including circuit assemblies configured for determining igniter, inducer relay, and igniter relay faults were developed and/or are disclosed herein. In exemplary embodiments, diode rectification is used to detect relay status (ON or OFF) and igniter open fault identification. By using diode rectification, the waveform of a signal at the control input (e.g., microcontroller input pin, etc.) will be positive half cycle or negative half cycle depending upon relay status ON or OFF. By analyzing the waveform of the control input signal, a conclusion can be made whether the relay is operating correctly or is faulty. Also, using diode rectification enables the detection of the presence or absence (e.g., damaged, not installed) of an igniter. This helps to diagnose the fault condition correctly so that a technician can take corrective action.
In exemplary embodiments, the following faults can be determined (e.g., detected, identified, distinguished): inducer relay fault, igniter relay fault, igniter open/absent fault and reverse line polarity fault. Grounding voltage is also measurable during standby and heating operation. Exemplary embodiments disclosed herein may provide or include one or more of the following features/advantages. Line voltage fluctuations or change does not affect fault detection, such that the fault detection is very reliable and accurate (e.g., 100% accurate). Grounding voltage can be measured when the inducer relay is ON or OFF. The heat cycle does not need to be started if there is an igniter open/absent fault, thereby eliminating the need to turn on the unnecessary inducer. Separate hardware for grounding voltage measurement is not required.
As shown in
The circuit assembly 104 is configured to be coupled to the inducer relay 108, the igniter relay 112, and the igniter 116. The circuit assembly 104 includes a plurality of diodes D1, D2, and D3 and a plurality of resistors (broadly, resistances) R1 through R11. By way of example only, the diodes D1, D2, and D3 may comprise standard signal diodes, e.g., 1N4148 standard signal diodes, etc. Also by way of example only,
As disclosed herein, the circuit assembly 104 is configured to enable detection of and distinguishing between a failure of the igniter 116, a failure of the inducer relay 108, and a failure of the igniter relay 112 as determined (e.g., by using an oscilloscope, etc.) by a waveform of the control signal at an input 120 of the control 100 for a given one of a plurality of operational states of the control including an idle state, a pre-purge state, and an igniter warm-up state.
In this illustrated embodiment, the first diode D1 is coupled in series with resistor R8. The first diode D1 is coupled in series with the input 120 of the control 100 via a path through the resistors R8, R5, R4, and R1. The first diode D1 is coupled with the ON terminal of the igniter relay 112, an inducer line 124, and the ON terminal of the inducer relay 108.
The second diode D2 is coupled in series with resistors R10 and R9. The second diode D1 is coupled in series with the input 120 of the control 100 via a path through the resistors R10, R9, R5, R4, and R1. The second diode D2 is coupled to the igniter relay 112. The second diode D2 is coupled to neutral 128 via a path through the igniter line 132 and the igniter 116.
The third diode D3 is coupled in parallel with the second diode D2. The third diode D1 is coupled in series with the resistor R6. The third diode D3 is coupled in series with the input 120 of the control 100 via a path through resistors R6, R5, R4, and R1. The third diode D3 is coupled to the igniter relay 112. The third diode D3 is coupled to neutral via a path through the igniter line 132 and the igniter 116. The third diode D3 is coupled with the OFF terminal of the inducer relay 108 via a path through resistor R7.
The input 120 of the control 100 is coupled in series with a voltage source 136 (e.g., Vdd_3_3VDc) via a path through resistor R2. The input 120 of the control 100 is coupled in series with ground 140 via a path through resistor R3.
The inducer relay 108 is coupled to a voltage source 144. The voltage source 144 may include any suitable source for supplying voltage and/or current to the igniter 116, including but not limited to, a power supply, a line voltage input, a utility grid voltage supply, etc. In this exemplary embodiment, the voltage source 144 is illustrated as a line voltage input of about 110 volts alternating current (Vac).
The inducer relay 108 and the igniter relay 112 are configured to be operable for selectively connecting the igniter 116 to the voltage source 144 for supplying power to the igniter 116. The inducer relay 108 and igniter relay 112 may be selectively turned on and off (e.g., opened and closed, etc.) via a control signal, which may be provided by control 100 or by another controller (e.g., furnace controller, thermostat, etc.) which is not shown in
A node 148 is defined between the input 120 of the control 100 and the first, second, and third diodes D1, D2, and D3. A node 152 is defined between the node 148 and the first and second diodes D1 and D2. A node 156 is defined between the igniter relay 112 and the igniter line 132. A node 160 is defined between the node 156 and the second and third diodes D2 and D3. A node 164 is defined between the inducer relay 108, the third diode D3, and the node 148. A node 170 is defined between the input 120 of the control 100, the voltage source 136, ground 140, and the node 148. A node 174 is defined between the first diode D1, the ON terminal of the igniter relay 112 and a node 178. The node 178 is defined between the inducer line 124, the ON terminal of the inducer relay 108, and the node 174.
When the control 100 is in idle state and there is not any fault or failure of the inducer relay 108, igniter relay 112, and igniter 116, then the signal at the control input 120 will have a negative half cycle as shown in
When the control 100 is in idle state, the following three faults are detectable (1) Inducer Relay ON when Inducer Relay should be OFF, (2) Igniter Open, and (3) Reverse Line Polarity. For example,
During control idle state when the igniter 116 is absent, e.g., not installed or burnt (circuit open), a full cycle is at the control input 120. Due to the absence of the igniter 116, there is no path for the positive cycle to pass to neutral 128. In which case, the full cycle is at control input 120 thereby indicating the igniter 116 is absent, e.g., not installed or burnt (circuit open).
This signal for igniter absence is not being affected by the igniter relay 112 whether it is ON or OFF (stuck closed or stuck open). Therefore, it is possible to detect igniter open error when the inducer relay 108 is OFF irrespective of the status of igniter relay 112. Accordingly, this enables accurate differentiation (e.g., 100% reliability) of igniter absent/open fault from igniter relay fault when the inducer relay 108 is OFF.
When the inducer relay is ON, the following two faults are detectable: (1) Inducer Relay OFF when Inducer Relay should be ON, and (2) Igniter Relay ON when Igniter Relay should be OFF.
During warm-up, ‘Igniter Relay OFF when Igniter Relay should be ON’ fault is detectable.
If there is any grounding voltage, the grounding voltage can be measured as it appears in another half cycle in place of the half cycle filtered out. Accordingly, this exemplary embodiment allows for measuring of the grounding voltage whether the inducer relay is OFF or ON.
As shown in
The igniter 116 may comprise any suitable igniter, including a hot surface igniter (e.g., electric resistance igniter, etc.) usable to ignite combustible gas in a furnace of an HVAC system. For example, the igniter 116 may comprise a hot surface igniter adapted to, in response to receiving a current, heat up to ignite a combustible gas of a furnace. In this example, the hot surface igniter may include any suitable resistive igniter, etc., and is adapted to ignite the combustible gas of the furnace via heat when the hot surface igniter is supplied with a current. For example, during normal operation, the hot surface igniter may be turned on, etc., to start, initiate, etc., a combustion process of the furnace (e.g., in response to a thermostat call for heat, etc.).
The control 100 may be configured to perform operations using any suitable combination of hardware and software. For example, the control may include any suitable circuitry, logic gates, microprocessor(s), computer-executable instructions stored in memory, etc., operable to cause the control 100 to perform actions disclosed herein.
Exemplary embodiments disclosed herein should not be limited to any particular igniter, furnace, or HVAC system as exemplary embodiments disclosed herein may be implemented in various controls and systems, e.g., HVAC systems, gas powered appliances, furnaces, other devices/systems that use an AC signal, integrated furnace controls (IF), thermostats, etc. Example embodiments disclosed herein may allow furnace control boards, etc., to detect and determine whether a hot surface igniter is faulty, whether an igniter relay is faulty, or whether an inducer relay is faulty. This may allow a technician to determine whether a control board should be replaced, or whether only the hot surface igniter needs to be replaced. This may allow for reduced repair time, reduced repair cost, etc.
Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms “a”, “an” and “the” may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms “comprises,” “comprising,” “includes,” “including,” “has,” “have,” and “having,” are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.
When an element or layer is referred to as being “on”, “engaged to”, “connected to” or “coupled to” another element or layer, it may be directly on, engaged, connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly engaged to”, “directly connected to” or “directly coupled to” another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
The term “about” when applied to values indicates that the calculation or the measurement allows some slight imprecision in the value (with some approach to exactness in the value; approximately or reasonably close to the value; nearly). If, for some reason, the imprecision provided by “about” is not otherwise understood in the art with this ordinary meaning, then “about” as used herein indicates at least variations that may arise from ordinary methods of measuring or using such parameters. For example, the terms “generally”, “about”, and “substantially” may be used herein to mean within manufacturing tolerances.
Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as “first,” “second,” and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
Spatially relative terms, such as “inner,” “outer,” “beneath”, “below”, “lower”, “above”, “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements, intended or stated uses, or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.
| Number | Name | Date | Kind |
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| 9518763 | Broker et al. | Dec 2016 | B2 |
| 10352588 | Broker | Jul 2019 | B2 |
| 10508831 | Broker et al. | Dec 2019 | B2 |
| 20180306445 | Pawar | Oct 2018 | A1 |
| Number | Date | Country | |
|---|---|---|---|
| 20220412559 A1 | Dec 2022 | US |
