Number | Name | Date | Kind |
---|---|---|---|
4536949 | Takayama et al. | Aug 1985 | |
5235335 | Hester et al. | Aug 1993 | |
5353028 | de Wit et al. | Oct 1994 | |
5552338 | Nang | Sep 1996 |
Entry |
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Gene Vance, Post-Package Trim Increases IC Reliability, Electronic Engineering Times Sep. 8, 1997, p. 70. |
Gail Robinson, PROM Fuse Design Scales to Sub-0.25 Micron, Electronic Engineering Times, Sep. 29, 1997, p. 44. |