Claims
- 1. A method of vacuum packaging comprising the steps of:
- (a) cup-shape-forming in a metal mold at a temperature of 50.degree. to 180.degree. C. under vacuum, a laminate film which is composed of (1) a plastically deformable layer of a synthetic resin having a yield stress larger than 50 kg/cm.sup.2 at a temperature of 23.degree. C. and an elongation of less than 30% at the elastic limit at the shaping temperature and (2) an elastic layer of a synthetic resin having an elongation of more than 40% at the elastic limit at said shaping temperature;
- (b) placing a base film provided with a plurality of small holes for passage of air adjacent to the metal mold;
- (c) placing articles or materials to be packed at positions on said base film corresponding to the cup-shaped hollows in said laminate film;
- (d) bringing the flat edge part of said cup-shape formed laminate film into contact with the edge part of said base film;
- (e) evacuating the interior of the spaces formed by the cup-shape hollows of said laminate film and said base film through said holes provided in said base film; and
- (f) releasing the vacuum which had been established in step (a) between said metal mold and said cup-shape formed laminate film thereby producing a tight package of said articles or materials having closely adhered laminate film, with tightly closed holes in said base film with said laminate film.
- 2. The method according to claim 1 in which the plastically deformable layer and/or the elastic layer of said laminated film are composed of a plurality of resinous layers.
- 3. The method according to claim 1, in which the total thickness of the plastically deformable layer of said laminate film is in the range of 3 to 100.mu..
- 4. The method according to claim 1, in which the total thickness of the elastic layer of said laminated film is in the range of 10 to 100.mu..
- 5. The method according to claim 1, in which the total thickness of the laminated film is in the range of 40 to 150.mu..
- 6. The method according to claim 1, in which the plastically deformable layer of said laminated film comprises a first resinous layer highly impermeable to gases and a second resinous layer having a yield stress less than that of said first resinous layer at the shaping temperature.
- 7. The method according to claim 6, in which the second resinous layer serving as a plastically deformable layer of said laminated film has a yield stress less than 5 kg/cm.sup.2 at said shaping temperature.
- 8. The method according to claim 1, in which the plastically deformable layer of said laminated film is formed of a resin which is readily plastically deformable at the shaping temperature by a stress which is less than 1/3 of the yield stress of the film at a temperature of 23.degree. C.
- 9. The method according to claim 8, in which the plastically deformable layer of said laminated film is formed of a resinous material which is easily deformable plastically by a stress below 10 kg/cm.sup.2 at said shaping temperature.
- 10. The method according to claim 1, in which the laminated film has an elastic recovery rate of above 80% at said shaping temperature.
- 11. The method according to claim 1, in which the plastically deformable layer of said laminated film is composed of at least one resinous material selected from the group consisting of vinylidene chloride copolymer saponified ethylenevinyl acetate copolymers, and acrylonitrile resins.
- 12. The method according to claim 1, in which the elastic layer of said laminated film is composed of at least one resinous material selected from the group consisting of plasticized polyvinyl chloride, 1,2-polybutadiene and stretched and oriented vinylidene chloride-vinyl chloride copolymers.
- 13. The method according to claim 1 or 2, in which said shaping temperature is in the range of 70.degree. to 150.degree. C.
- 14. The method according to claim 1 or 2, in which said laminated film is shape-formed under a stress between the elastic limits of the plastically deformable layer and the elastic layer.
Priority Claims (8)
Number |
Date |
Country |
Kind |
52-105787 |
Sep 1977 |
JPX |
|
7808910 |
Aug 1978 |
NLX |
|
310483 |
Sep 1978 |
CAX |
|
2838226 |
Sep 1978 |
DEX |
|
190251 |
Sep 1978 |
BEX |
|
78 25556 |
Sep 1978 |
FRX |
|
27316 A/78 |
Sep 1978 |
ITX |
|
35664/78 |
Sep 1978 |
GBX |
|
CROSS-REFERENCE TO RELATED APPLICATION
The present application is a continuation-in-part of application Ser. No. 936,696, filed Aug. 25, 1978, and entitled "VACUUM PACKAGING METHOD".
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
RE30009 |
Perdue et al. |
May 1979 |
|
3663240 |
Seiferth et al. |
May 1972 |
|
4164109 |
DuBois |
Aug 1979 |
|
Foreign Referenced Citations (5)
Number |
Date |
Country |
2079331 |
Nov 1971 |
FRX |
2141043 |
Jan 1973 |
FRX |
2183932 |
Dec 1973 |
FRX |
2282371 |
Mar 1976 |
FRX |
2310935 |
Dec 1976 |
FRX |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
936696 |
Aug 1978 |
|