Certain example embodiments of this invention relate to improved frit materials for glass articles (e.g., for use in vacuum insulated glass or VIG units), and/or methods of making the same, as well as articles including such improved frit materials and/or methods of making the same. More particularly, certain example embodiments relate to vanadium-based frit materials having a reduced melting point, and/or methods of making the same. In certain example embodiments, the improved insulated seals are used in connection with vacuum insulated glass (VIG) units, and/or a method is provided for sealing VIG units with the improved seals.
Vacuum IG units are known in the art. For example, see U.S. Pat. Nos. 5,664,395, 5,657,607, and 5,902,652, the disclosures of which are all hereby incorporated herein by reference.
Pump out tube 8 is hermetically sealed by solder glass 9 to an aperture or hole 10 which passes from an interior surface of glass sheet 2 to the bottom of recess 11 in the exterior face of sheet 2. A vacuum is attached to pump out tube 8 so that the interior cavity between substrates 2 and 3 can be evacuated to create a low pressure area or space 6. After evacuation, tube 8 is melted to seal the vacuum. Recess 11 retains sealed tube 8. Optionally, a chemical getter 12 may be included within recess 13.
Conventional vacuum IG units, with their fused solder glass peripheral seals 4, have been manufactured as follows. Glass frit in a solution (ultimately to form solder glass edge seal 4) is initially deposited around the periphery of substrate 2. The other substrate 3 is brought down over top of substrate 2 so as to sandwich spacers 5 and the glass frit/solution there between. The entire assembly including sheets 2, 3, the spacers, and the seal material is then heated to a temperature of approximately 500° C., at which point the glass frit melts, wets the surfaces of the glass sheets 2, 3, and ultimately forms hermetic peripheral or edge seal 4. This approximately 500° C. temperature is maintained for from about one to eight hours. After formation of the peripheral/edge seal 4 and the seal around tube 8, the assembly is cooled to room temperature. It is noted that column 2 of U.S. Pat. No. 5,664,395 states that a conventional vacuum IG processing temperature is approximately 500° C. for one hour. Inventors Lenzen, Turner and Collins of the '395 patent have stated that “the edge seal process is currently quite slow: typically the temperature of the sample is increased at 200° C. per hour, and held for one hour at a constant value ranging from 430° C. and 530° C. depending on the solder glass composition.” After formation of edge seal 4, a vacuum is drawn via the tube to form low pressure space 6.
The composition of conventional edge seals are known in the art. See, for example, U.S. Pat. Nos. 3,837,866; 4,256,495; 4,743,302; 5,051,381; 5,188,990; 5,336,644; 5,534,469; 7,425,518, and U.S. Publication No. 2005/0233885, the disclosures of which are all hereby incorporated herein by reference.
Unfortunately, the aforesaid high temperatures and long heating times of the entire assembly utilized in the formulation of edge seal 4 are undesirable. This is especially the case when it is desired to use a heat strengthened or tempered glass substrate(s) 2, 3 in the vacuum IG unit. As shown in
Seven different curves are illustrated in
As seen in
As noted above, the creation of VIG units includes the creation of a hermetic seal that can withstand the pressure applied from the vacuum created on inside of the unit. As also discussed above, the creation of the seal may conventionally involve temperatures of at or above 500° C. These temperatures are required in order to obtain a high enough temperature in order for the frit material used for the seal to melt and form the required seal for the VIG units. As shown above, such a temperature can result in a strength reduction for VIG units using tempered glass.
One conventional solution to sealing glass substrates together is to use an epoxy. However, in the case of VIG units, epoxy compositions may be insufficient to hold a seal on a vacuum. Furthermore, epoxies may be susceptible to environmental factors that may further reduce their effectiveness when applied to VIG units.
Another conventional solution is to use a frit solution that contains lead. As is known, lead has a relatively low melting point. Accordingly, temperatures for sealing the VIG units may not need to be as high for other frit materials, and thus the tempering strength of tempered glass substrates may not be reduced by the same amount required for other frit based materials. However, while lead based frits may resolve the above structural issues, the usage of lead in the fit may create new problems. Specifically, the health consequences to the population for products that contain lead. Additionally, certain countries (e.g., in the European Union) may impose strict requirements on the amount of lead that can be contained in a given product. Indeed, some countries (or customers) may require products that are completely lead-free.
Thus, it will be appreciated that techniques for creating improved seals for glass articles are continuously sought after. It also will be appreciated that there exists a need in the art for improved seals and the like that can be integrated with tempered glass units, such as, for example, VIG units. The seals may be designed to allow for reduced temperature sealing such that annealed or tempered glass can be sealed without detrimental impact on the properties of the glass.
In certain example embodiments, a frit material may provide glass to frit bonding sufficient for VIG purposes (e.g., in terms of structural strength). In certain example embodiments, the provided frit may provide proper glass wetting properties. In certain example embodiments, the frit may seal and have structural strength and a homogenous glassy structure to provide an adequate barrier to prevent vacuum degradation in example VIG units over a period of time.
In certain instances, improvements in melt flow may enable improved fit matching to glass expansion and/or increase process tolerances to frit bead variations. Improved wetting and bonding properties of a frit material may increase VIG yield by reducing bonding failures of the frit to the glass. A reduction in crystallization may additionally or alternatively facilitate a selected composition to meeting different heating environments (e.g., an internal seal, an external seal, etc).
In certain example embodiments, a frit material having a composition is provided. The frit material may include vanadium oxide between about 50% and 60% weight, barium oxide between about 27% and 33% weight, and zinc oxide between about 9% and 12% weight. In certain example embodiments, the frit material may also include at least one additive selected from among: Ta2O5, Ti2O3, SrCl2, GeO2, CuO, AgO, Nb2O5, B2O3, MgO, SiO2, TeO2, Tl2O3, Y2O3, SnF2, SnO2, CuCl, SnCl2, CeO2, AgCl, In2O3, SnO, SrO, MgO, MoO3, CsCO3, CuCl2, and Al2O3.
In certain example embodiments, a vacuum insulted glass (VIG) unit is provided. The VIG unit may include first and second substantially parallel, spaced apart glass substrates. An edge seal is provided around a periphery of the first and second substrates to form a hermetic seal there between and at least partially defining a gap between the first and second substrates. The gap defined between the first and second substrates is at a pressure less than atmospheric. The edge seal includes a frit material, e.g., as made from a base composition as described herein.
In certain example embodiments, a method of making a frit material is provided. A base composition is provided to a holder. The base composition includes vanadium oxide between about 50% and 60% weight, barium oxide between about 27% and 33% weight, zinc oxide between about 9% and 12% weight, and at least one additive selected from among: Ta2O5, Ti2O3, SrCl2, GeO2, CuO, AgO, Nb2O5, B2O3, MgO, SiO2, TeO2, Tl2O3, Y2O3, SnF2, SnO2, CuCl, SnCl2, CeO2, AgCl, In2O3, SnO, SrO, MgO, MoO3, CsCO3, CuCl2, and Al2O3. The base composition is melted. The base composition is cooled or allowed to cool, forming an intermediate glass article. The intermediate glass article is ground to make the frit material.
In certain example embodiments, a method of making a vacuum insulated glass (VIG) unit is provided. First and second glass substrates in substantially parallel, spaced apart relation to one another are provided. The first and second glass substrates using a frit material are sealed together, with a gap being defined between the first and second substrates. The sealing being performed by melting the frit material at a temperature of no more than about 400 degrees C. Where the frit material has been formed from a base composition including vanadium oxide between about 50% and 60% weight, barium oxide between about 27% and 33% weight, zinc oxide between about 9% and 12% weight, and at least one oxide or chloride-base additive.
In certain example embodiments, a frit material having a composition is provided. The frit material may include vanadium oxide between about 50% and 60% weight (40-55% molar, more preferably 45-50% molar), barium oxide (e.g., barium carbonate that converts in whole or in part to BaO) between about 23% and 33% weight (15-35% molar, more preferably 20-23% molar), and zinc oxide between about 9% and 12% weight (15-25% molar, more preferably 19-22% molar). The frit material includes at least a first and second additive selected from among SnCl2, CuCl2, MoO3, TeO2, Ta2O5, Nb2O5, Al2O3, SiO2, and CsCO3.
Certain example embodiments may include at least two additives. For example SnCl2 and SiO2. Certain example embodiments may include three or four additives selected from among SiO2, SnCl2, Al2O3, and TeO2. Certain example embodiments may use between 5 and 10 different additives that are selected from among: SnCl2, CuCl2, MoO3, TeO2, Ta2O5, Nb2O5, Al2O3, SiO3, and CsCO3.
The features, aspects, advantages, and example embodiments described herein may be combined in any suitable combination or sub-combination to realize yet further embodiments.
These and other features and advantages may be better and more completely understood by reference to the following detailed description of exemplary illustrative embodiments in conjunction with the drawings, of which:
The following description is provided in relation to several example embodiments which may share common characteristics, features, etc. It is to be understood that one or more features of any one embodiment may be combinable with one or more features of other embodiments. In addition, single features or a combination of features may constitute an additional embodiment(s).
Certain example embodiments may relate to glass units (e.g., VIG units) that include two glass substrates sealed with an improved seal, e.g., of or including a vanadium-based frit material. In certain example embodiments an improved seal may include the following materials: vanadium oxide, barium oxide, and zinc oxide. In addition, certain example embodiments may include one or more of the following compounds: Ta2O5, Ti2O3, SrCl2, GeO2, CuO, AgO, Nb2O5, B2O3, MgO, SiO2, TeO2, Tl2O3, Y2O3, SnF2, SnO2, CuCl, SnCl2, CeO2, AgCl, In2O3, SnO, SrO, MgO, MoO3, CsCO3, CuCl2, and Al2O3.
After the combined compounds are melted, the material may be cooled in step 604, e.g., to form a glass sheet. After cooling, the glass may be crushed or ground into fine particulates in step 606. In certain example embodiments, the size of the particulates may be no larger than about 100 mesh. Once the glass is ground into a powder, it may be disposed between the substrates in step 608. In certain example embodiments, the powder may be dispensed as a paste with a binder. Heat may then be applied in step 610 to the glass substrate and the powder. In certain example embodiments, the heat may be between 300° C. and 400° C., or more preferably between 325° C. and 375° C. It will be appreciated that when heat of the above temperatures is applied to tempered glass that the tempered glass may lose a reduced amount of strength versus when heat of in excess of 350° C. is applied to the tempered glass. Thus, certain example embodiments preferably involve a frit melting temperature of less than 500° C., more preferably less than 425° C., and sometimes less than 350° C.
In certain example embodiments, the combined compounds include the following materials: vanadium oxide, barium oxide, and zinc oxide.
The table below corresponds to the data shown in
The melts shown in
Below, tables 2A-2C show exemplary compositions according to certain example embodiments. Additionally, examples 7-15 in the tables correspond to graphs 8A-8C. For the compositions shown in the below tables, BaCO3 factor of 1.287027979 was used to convert to a BaO resulting compound.
The rating shown in Table 2C is based off of deposing the ground composition on a microscope glass slide and heating the composition at about 375° C. for between 10 and 30 minutes.
In certain example embodiments, a strong DSC response may correspond to a good remelt quality. In certain example embodiments, the addition of bismuth in concentrations of between about 0% and 3% may result in increased remelt flow quality.
In certain example embodiments, a frit that includes V2O5, BaO, and ZnO may further include one or more additives. In certain example embodiments, the additives may be between about 0.5% and 15% weight. According to certain example embodiments, the additives may be added to a base composition that includes between about 50% and 60% weight V2O5, 27% and 33% weight BaO, and 9% and 12% weight ZnO.
Below, Tables 4A-4D show results of including additives to the base composition of V2O5, BaO, and ZnO. Table 4D shows the melt quality on a scale of about 0 to 5 for each of the compositions.
In certain example embodiments, the molar composition of an additive to a base composition higher than is shown in tables 4A-4D. Table 5A shows additives with an increased additive amount (on a % mole basis). The base composition used with the additive amount may be based on, for example, the base composition shown in Row 1 of Tables 4A-4D. The additives shown in Table 5, in the selected quantities displayed, may improve melt quality when compared to the above base composition. A melt type of Glassy indicates that a “button” of the compound melted onto a glass plate, forming a homogenous glassy structure. Sinter indicates that the compound (in a powder form) fused together, but remained in a powder form.
Accordingly, in certain example embodiments, additives of a relatively increased amount (e.g., versus those shown in
In certain example embodiments, two or more additives may be included in a base compound. Table 6 shows the results of adding two additives to an exemplary base composition. Table 6 includes example melts at 375 and 350. Additionally, 13 mm buttons of the exemplary compounds were tested on a glass plate. The structural strength of the resulting exemplary compound are also shown in the far right column.
Accordingly, certain example may include two additives similar to those found in examples 3, 16, and 21 as shown in Table 6 (e.g., TeO2 with SiO2, SnCl2 with Al2O3, and SnCl2 with SiO2). In certain example embodiments, the addition of two or more additives may have beneficial results on an exemplary base composition. For example the addition of SiO2 to another additive may increase the strength of the overall frit. Alternatively, or in addition, TeO2 combined with other additives may increase the melt flow and glass wetting qualities of the frit when compared to a base frit.
In certain example embodiments, the combination of SnCl2 with SiO2 and/or Al2O3 may result in an increase in structural strength for the resulting frit material.
In certain example embodiments, one or more additives may be added to a base composition where the amount is between 1% and 10% by weight or between about 1% and 6% normalized moles for a batch. In certain example embodiments, additives may be added in a smaller amount, for example between about 0.1% and 1% by weight. In certain example embodiments a batch for a base composition (in grams) may include V2O5 at 52.5, BaO at 22.5, ZnO at 10. In certain example embodiments, additives added to the above base composition may include: 1) TeO2 at 3.85 gm and Al2O3 at 1.84 gm; 2) SnCl2 at 4.65 gm and Al2O3 at 3.12 gm; 3) SnCl2 at 4.55 gm and SiO2 at 1.08 gm. Correspondingly, the additives may then have a normalize weight percentage of: 1) TeO2 at 1.00 and Al2O3 at 0.48; 2) SnCl2 at 1.21 and Al2O3 at 0.81; 3) SnCl2 at 1.18 and SiO2 at 0.28. These examples may correspond to examples 3, 16, and 21 in the above table 6.
In certain example embodiments, the application of IR energy to a frit material may be based on a heating profile where the IR energy applied to the frit varies over time. Exemplary heating profiles may be found in co-pending application Ser. No. 12/929,874, the entire contents of which are incorporated herein by reference.
In certain example embodiments, a base composition may be augmented by 3 or 4 additives. For example, a batch for a base composition (in grams) may include V2O5 at 52.5, BaO at 22.5, ZnO at 10. Accordingly, three and/or more additives from among TeO2, SnCl2, Al2O3, and SiO2 may be selected to augment the base composition. The ranges (in grams) for the additives may vary between 0 to 7.5 grams per additive. Thus, on a normalized molar percentage the above additives may be included at between 0% and 6%. Thus, the normalized molar percentage of a base composition may be V2O5 at between about 43% and 50%, BaO between about 22% and 26%, ZnO between about 18% and 22%. In certain example embodiments, additives (on a normalized molar basis) of TeO2 at around 2%, SnCl2 around 2%, Al2O3 around 2%, and SiO2 around 4% may be added to the base composition.
The techniques, compositions, etc. disclosed herein may be used other methods and/or systems for forming a VIG unit. For example, a vanadium based frit may be used to form an edge seal of a VIG unit. Systems, apparatuses, and/or methods used for creating a VIG unit may be described in co-pending application Ser. No. 12/929,876, filed on Feb. 22, 2011, entitled “LOCALIZED HEATING TECHNIQUES INCORPORATING TUNABLE INFRARED ELEMENT(S) FOR VACUUM INSULATING GLASS UNITS, AND/OR APPARATUSES FOR THE SAME”, the entire contents of which are hereby incorporated by reference.
Certain example embodiments may include three or more additives to a base composition that includes vanadium pentaoxide; barium carbonate that coverts in whole or in part to barium oxide; and zinc oxide. The above three “base” frit elements may be included at 35-55% molar for V2O5, 15-35% for BaO, and 15-25% molar for ZnO or, more preferably, 40-50% molar for V2O5, 20-30% for BaO, and 18-22% molar for ZnO.
Along with an example base frit composition, one or more additives may be added. The additives may include, for example:
In certain example embodiments, four or more additives, more preferably six or more additives may be added to the above base composition. It will be appreciated that as the number of the additives increases, the interactions between the various additives may produce different results based on the relative weighting of one or more additives (or the base composition). It also will be appreciated that the increased number of additives may create synergistic effects (e.g., in terms of glass softening temperature, flowability, and/or other adjustments) that otherwise might not be observable.
In certain example embodiments, one or more additives may be introduced through the frit creation process rather than being expressly introduced. For example, additive ingredients may be introduced into a frit material as a result of firing the frit material in a crucible. For instance, some ingredients may be “leached” from the crucible and into the frit material. In certain example embodiments, Al2O3 and SiO2 may be leached by this process.
Tables 7-10 show example frit compositions according to certain example embodiments. The different tables each include one or more additives that are varied while the other ingredients are kept substantially the same between the example compounds of the give table.
In tables 7A-7C, molybdenum oxide is varied between the example compounds; in tables 8A-8C tellurium oxide is varied between the example compounds; in tables 9A-9C cesium carbonate is varied between the example compounds; and in tables 10A-10D tantalum oxide and niobium oxide are varied between the example compounds.
Tables 7A, 8A, 9A, and 10A show the example frit compositions by normalized weight percentage. Tables 7B, 8B, 9B, and 10B show the example frit compositions by normalized mole percent. The values given in tables 7-10 A and B are normalized to approximately 100% for shown compositions. For example, V2O5 from example 1 in table 7A is 54.88% by weight of the frit composition for the frit composition. Similarly, V2O5 for the same example frit composition is shown as 49.76% mole of the resulting frit composition (e.g., from Table 7B). Thus, the normalized weight and mole percentages may add up to about 100% for the example frit compositions shown in the various tables herein. Tables 7C, 8C, 9C, 10C, and 10D show exemplary results for the example frit compositions. As can be seen in the results of the above noted tables (e.g., tables 7-10), performance of one or more of the above examples may be improved over a base frit material, or a frit material with only one additive as discussed above. For example, example frit materials 9 and 11 shown in Table 8 show good flow at 375 degrees C. (5 and 6.5, respectively).
In certain example embodiments, the use of Ta2O5 and/or Nb2O5 may help reduce the crystallization of the frit material. As the percentage of contribution by such additives increases, the softening temperature (e.g., a temperature at which the frit material may flow) may also increase. In certain example embodiments, such properties may be desirable for a tip off seal in a VIG unit (e.g., sealing the vacuum hole in a VIG unit).
Frit materials used for tipping off a vacuum hole may have different desirable properties than frit materials for a perimeter seal for a VIG unit. For example, a frit material used in a tip off seal may be completely or substantially exposed to IR and therefore may reach a higher temperature than that of a perimeter seal. Conversely, the perimeter seal may have the glass absorb some percentage of the SWIR directed at the frit of a perimeter seal (e.g., 10%-30% of the SWIR). Thus, an exemplary frit material (e.g., example 21) may be used for a perimeter seal while example 26 may be used for tip off seal.
As shown in Table 10D, the example frit compositions may provide increased resistance, or greater tolerance, to crystallization. The example compositions shown in Tables 7-10 were done in an alumina crucible. With such a crucible, a certain amount of Al2O3 and SiO2 may be “leached” from the crucible during the frit preparation process. Thus, while Al2O3 and SiO2 may not be shown in the above tables 7-10, these additives (or others depending on the crucible type) may yet be present in the frit composition due to the leaching process from the crucible. The leaching of Al2O3 and SiO2 may be a result of melting or firing the frit compositions at certain temperatures (e.g., 800 C. degrees C., 1000 degrees C., etc). Different firing temperatures and/or different lengths of time of firing may affect the amount of material leached from the crucible. The variation of Al2O3 and SiO2 may change the frit performance for sealing at 375 degrees C. and 400 degrees C.
In certain example embodiments, Al2O3 may be included in a frit material at between 0% and 2% normalized moles by composition, or at a normalized weight percentage between 0% and 1.2%, or more preferably about 0.8%. SiO2 may be included at between 1 and 5% normalized mole by composition and/or between about 0.5 and 2% by weight, and more preferably about 1.2% by normalized weight. The inventor has determined that in certain instances, having SiO2 or Al2O3 in amount greater than about 2-5%, resulted in undesirable flow qualities of the frit composition. In particular, when bonding to an example glass substrate, in certain instances, higher percentages of SiO2 or Al2O3 (e.g., in excess of 2 or 4%) resulted in concrete like qualities for the final frit composition.
Table 11 shows example results in a platinum crucible. Such a crucible may reduce or even prevent the leaching of excess additives during the firing process of the frit material.
It will be appreciated by those skilled in the art that CTE adjustments may be carried out on the overall frit material (e.g., the compound) for the glass wetting and bonding properties of the frit to cooperate with an underlying substrate (e.g., a glass substrate). In certain example embodiments, CTE matching compounds may be added for these and/or other purposes.
It will be appreciated that one or more metal oxide, chloride, and/or fluoride additives may be used as additives in different embodiments of this invention. Furthermore, in certain example implementations, the metal oxide, chloride, and/or fluoride additives may be stoichiometric or sub-stoichiometric.
As used herein, the terms “on,” “supported by,” and the like should not be interpreted to mean that two elements are directly adjacent to one another unless explicitly stated. In other words, a first layer may be said to be “on” or “supported by” a second layer, even if there are one or more layers there between.
While the invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not to be limited to the disclosed embodiment, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
This application is a continuation of application Ser. No. 13/238,358, filed Sep. 21, 2011 (now U.S. Pat. No. 9,290,408), which is a continuation-in-part of application Ser. No. 12/929,875, filed Feb. 22, 2011 (now U.S. Pat. No. 8,802,203), the entire disclosures of which are all hereby incorporated herein by reference in this application.
Number | Name | Date | Kind |
---|---|---|---|
2727301 | Magnus et al. | Dec 1955 | A |
2936923 | Veres | May 1960 | A |
2988852 | Henry | Jun 1961 | A |
3120433 | Van Zee | Feb 1964 | A |
3222153 | Brown | Dec 1965 | A |
3252811 | Beall | May 1966 | A |
3267569 | Eichorn et al. | Aug 1966 | A |
3331659 | Malloy | Jul 1967 | A |
3650778 | Dumesnil et al. | Mar 1972 | A |
3837866 | Malmendier et al. | Sep 1974 | A |
3862830 | Stern | Jan 1975 | A |
3947260 | Salisbury | Mar 1976 | A |
3981753 | Hopper | Sep 1976 | A |
3995941 | Nagahara et al. | Dec 1976 | A |
4045200 | Salisbury | Aug 1977 | A |
4130408 | Crossland et al. | Dec 1978 | A |
4186023 | Dumesnil et al. | Jan 1980 | A |
4221604 | Chirino et al. | Sep 1980 | A |
4252415 | Klein et al. | Feb 1981 | A |
4256495 | Kawamura et al. | Mar 1981 | A |
4269617 | Yoshimichi et al. | May 1981 | A |
4314031 | Sanford et al. | Feb 1982 | A |
4450441 | Person et al. | May 1984 | A |
4482579 | Fujii et al. | Nov 1984 | A |
4683154 | Benson et al. | Jul 1987 | A |
4743302 | Dumesnil et al. | May 1988 | A |
4788471 | Strauss | Nov 1988 | A |
4801488 | Smith | Jan 1989 | A |
4810484 | Uedaira et al. | Mar 1989 | A |
4820365 | Brumm et al. | Apr 1989 | A |
5013360 | Finkelstein et al. | May 1991 | A |
5051381 | Ohji et al. | Sep 1991 | A |
5089446 | Cornelius et al. | Feb 1992 | A |
5188990 | Dumesnil et al. | Feb 1993 | A |
5336644 | Akhtar et al. | Aug 1994 | A |
5355051 | Fondrk | Oct 1994 | A |
5516733 | Morena | May 1996 | A |
5534469 | Hayashi | Jul 1996 | A |
5589731 | Fahlen et al. | Dec 1996 | A |
5599753 | Watzke et al. | Feb 1997 | A |
5643644 | Demars | Jul 1997 | A |
5643840 | Hikata et al. | Jul 1997 | A |
5657607 | Collins et al. | Aug 1997 | A |
5664395 | Collins et al. | Sep 1997 | A |
5766053 | Cathey et al. | Jun 1998 | A |
5891536 | Collins et al. | Apr 1999 | A |
5902652 | Collins et al. | May 1999 | A |
6187700 | Merkel | Feb 2001 | B1 |
6300263 | Merkel | Oct 2001 | B1 |
6326685 | Jin et al. | Dec 2001 | B1 |
6336984 | Aggas | Jan 2002 | B1 |
6365242 | Veerasamy | Apr 2002 | B1 |
6383580 | Aggas | May 2002 | B1 |
6391809 | Young | May 2002 | B1 |
6399169 | Wang et al. | Jun 2002 | B1 |
6444281 | Wang et al. | Sep 2002 | B1 |
6472032 | Asano | Oct 2002 | B1 |
6503583 | Nalepka et al. | Jan 2003 | B2 |
6506472 | Tanaka et al. | Jan 2003 | B1 |
6541083 | Landa et al. | Apr 2003 | B1 |
6566290 | Beall et al. | May 2003 | B2 |
6635321 | Wang et al. | Oct 2003 | B2 |
6641689 | Aggas | Nov 2003 | B1 |
6692600 | Veerasamy et al. | Feb 2004 | B2 |
6701749 | Wang et al. | Mar 2004 | B2 |
6946171 | Aggas | Sep 2005 | B1 |
6998776 | Aitken et al. | Feb 2006 | B2 |
7105235 | Lo et al. | Sep 2006 | B2 |
7244480 | Minaai et al. | Jul 2007 | B2 |
7425518 | Yoshida et al. | Sep 2008 | B2 |
7435695 | Hormadaly | Oct 2008 | B2 |
7452489 | Sawai et al. | Nov 2008 | B2 |
7602121 | Aitken et al. | Oct 2009 | B2 |
7736546 | Prunchak | Jun 2010 | B2 |
8227055 | Wang | Jul 2012 | B2 |
8500933 | Cooper | Aug 2013 | B2 |
8506738 | Wang et al. | Aug 2013 | B2 |
8766524 | Kohara et al. | Jul 2014 | B2 |
8802203 | Dennis | Aug 2014 | B2 |
9290408 | Dennis | Mar 2016 | B2 |
20020035852 | Wang et al. | Mar 2002 | A1 |
20040043887 | Paulson | Mar 2004 | A1 |
20040207314 | Aitken et al. | Oct 2004 | A1 |
20050001545 | Aitken et al. | Jan 2005 | A1 |
20050110168 | Chuang | May 2005 | A1 |
20050191515 | Brese et al. | Sep 2005 | A1 |
20050233885 | Yoshida et al. | Oct 2005 | A1 |
20060003883 | Yoshida et al. | Jan 2006 | A1 |
20060042748 | Hasegawa et al. | Mar 2006 | A1 |
20060128549 | Hormadaly | Jun 2006 | A1 |
20070158021 | Sawai et al. | Jul 2007 | A1 |
20070194304 | Zu et al. | Aug 2007 | A1 |
20080300126 | Goedeke et al. | Dec 2008 | A1 |
20090064717 | Son et al. | Mar 2009 | A1 |
20090136766 | Son et al. | May 2009 | A1 |
20090151854 | Cooper | Jun 2009 | A1 |
20090151855 | Wang et al. | Jun 2009 | A1 |
20090297862 | Boek et al. | Dec 2009 | A1 |
20100180934 | Naito et al. | Jul 2010 | A1 |
20100275654 | Wang | Nov 2010 | A1 |
20100330308 | Cooper et al. | Dec 2010 | A1 |
20110130264 | Beall | Jun 2011 | A1 |
20120128904 | Masuda et al. | May 2012 | A1 |
20120211146 | Dennis | Aug 2012 | A1 |
20120213952 | Dennis | Aug 2012 | A1 |
20120213953 | Dennis | Aug 2012 | A1 |
20120213954 | Dennis | Aug 2012 | A1 |
20120304696 | Miller et al. | Dec 2012 | A1 |
20120308747 | Dennis | Dec 2012 | A1 |
20120321902 | Kohara et al. | Dec 2012 | A1 |
20130074445 | Jones | Mar 2013 | A1 |
20130153550 | Dear | Jun 2013 | A1 |
20130153551 | Dear | Jun 2013 | A1 |
20130292000 | Dennis et al. | Nov 2013 | A1 |
20130302542 | Jones | Nov 2013 | A1 |
20130305785 | Dennis | Nov 2013 | A1 |
20130306222 | Dennis | Nov 2013 | A1 |
20130309425 | Dennis | Nov 2013 | A1 |
20130333748 | Naito et al. | Dec 2013 | A1 |
Number | Date | Country |
---|---|---|
60 657 | Jan 1967 | AU |
1738776 | Feb 2006 | CN |
195 45 422 | Jun 1997 | DE |
0 013 650 | Jul 1980 | EP |
0 061 183 | Sep 1982 | EP |
0 889 010 | Jan 1999 | EP |
1 065 183 | Jan 2001 | EP |
1 281 329 | Mar 2003 | EP |
1 571 134 | Sep 2005 | EP |
2 017 236 | Jan 2009 | EP |
2 187 444 | May 2010 | EP |
2 308 806 | Mar 2011 | EP |
1 595 856 | Nov 2015 | EP |
63-55098 | Apr 1988 | JP |
02-267137 | Oct 1990 | JP |
05-85490 | Apr 1993 | JP |
06-263478 | Sep 1994 | JP |
2002-137939 | May 2002 | JP |
2002-241143 | Aug 2002 | JP |
2005-112715 | Apr 2005 | JP |
2006-524419 | Oct 2006 | JP |
2006-342044 | Dec 2006 | JP |
2007-182347 | Jul 2007 | JP |
2008-127240 | Jun 2008 | JP |
2009-221047 | Oct 2009 | JP |
2009-221048 | Oct 2009 | JP |
2009-221049 | Oct 2009 | JP |
2009-298673 | Dec 2009 | JP |
2010-057893 | Mar 2010 | JP |
2011-84437 | Apr 2011 | JP |
10 2010-0004572 | Jan 2010 | KR |
1791433 | Jan 1993 | RU |
852811 | Aug 1981 | SU |
1276639 | Dec 1986 | SU |
1 578 093 | Jul 1990 | SU |
1590472 | Sep 1990 | SU |
1694561 | Nov 1991 | SU |
WO 9602473 | Feb 1996 | WO |
WO 9622255 | Jul 1996 | WO |
WO 9911580 | Mar 1999 | WO |
WO 0214640 | Feb 2002 | WO |
WO 0227135 | Apr 2002 | WO |
WO 2004074198 | Sep 2004 | WO |
WO 2004095597 | Nov 2004 | WO |
WO 2006044383 | Apr 2006 | WO |
WO 2011108115 | Sep 2011 | WO |
WO 2012035565 | Mar 2012 | WO |
WO 2012073662 | Jun 2012 | WO |
WO 2012115796 | Aug 2012 | WO |
WO 2013101748 | Jul 2013 | WO |
Entry |
---|
U.S. Appl. No. 13/238,358, filed Sep. 21, 2011; Dennis. |
U.S. Appl. No. 12/000,663, filed Dec. 14, 2007; Cooper. |
U.S. Appl. No. 12/000,791, filed Dec. 17, 2007, Wang et al. |
“Laser Sintering of Thick-Film Conductors for Microelectronic Applications”, Kinzel et al. |
“Pb-Free Vanadium-Based Low-Melting Glass Paste: VS-1026”; Hitachi Powered Metals Technical Report No. 7, (2008). |
U.S. Appl. No. 14/332,448, filed Jul. 16, 2014; Dennis. |
U.S. Appl. No. 13/480,987, filed May 25, 2012, Dennis. |
U.S. Appl. No. 13/339,463, filed Dec. 29, 2011; Dennis. |
U.S. Appl. No. 14/172,432, filed Feb. 4, 2014; Hogan et al. |
U.S. Appl. No. 13/354,963, filed Jan. 20, 2012; Dennis. |
U.S. Appl. No. 13/628,653, filed Sep. 27, 2012. |
U.S. Appl. No. 13/562,386, filed Jul. 31, 2012; Petrmichl et al. |
U.S. Appl. No. 13/562,408, filed Jul. 31, 2012; Hogan et al. |
U.S. Appl. No. 12/458,071, filed Jun. 30, 2009; Cooper et al. |
International Search Report dated Apr. 9, 2009. |
International Search Report dated Jul. 8, 2010. |
International Search Report dated Mar. 18, 2009. |
U.S. Appl. No. 12/929,874, filed Feb. 22, 2011; Dennis. |
U.S. Appl. No. 12/929,876, filed Feb. 22, 2011; Cooper et al. |
U.S. Appl. No. 12/929,875, filed Feb. 22, 2011; Dennis. |
Empower Materials: Binders for Glass Powders & Substrate (1 pg). |
Simko, et al., “Temperature-Induced Stresses in Vacuum Glazing Modelling and Experimental Validation,” Solar Energy, vol. 63, No. 1, 1998 (21 pages). |
Lenzen, et al., “Thermal Outgassing of Vacuum Glazing,” School of Physics, The University of Syndey, 1999 (31 pages). |
U.S. Appl. No. 13/562,423, filed Jul. 31, 2012; Petrmichl, et al. |
RU Application No. 2013142948 Official Decision to Grant dated Feb. 1, 2017. |
Number | Date | Country | |
---|---|---|---|
20160138325 A1 | May 2016 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 13238358 | Sep 2011 | US |
Child | 15001382 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 13339463 | Dec 2011 | US |
Child | 13238358 | US | |
Parent | 12929875 | Feb 2011 | US |
Child | 13339463 | US |