The technical field of this disclosure relates to a flat plate heat pipe, and more particularly to a vapor chamber sealing method and its structure.
A vapor chamber, also known as a heat conducting plate or a flat plate heat pipe, has functions and operating principle similar to those of heat pipes, and all of the devices have a working fluid sealed into a pipe or plate type chamber and provided for actuating an evaporation-condensation cycle to achieve the effects of a quick heat transfer and a uniform temperature. The vapor chamber has been widely used in various fields of heat dissipation.
However, the conventional vapor chamber is usually formed on a shell or a plate and mainly comprised of two plates engaged with each other, so that it is necessary to stack the two plates and seal their peripheries by a process such as high temperature sintering or laser welding, but the high temperature of the aforementioned process may cause a deterioration of the metal of the vapor chamber or plates and affect the strength or hardness of the structure of the shell or plate.
Regardless of how we control the temperature or select an appropriate metal, it is still inevitable to affect the appearance of the shell or plate structure of the vapor chamber.
In view of the aforementioned drawbacks of the conventional vapor chamber, the discloser of this disclosure based on years of experience in the related industry to conduct extensive research and experiment, and finally provided an innovative vapor chamber sealing method and its structure to overcome the drawbacks of the prior art.
Therefore, it is a primary objective of this disclosure to overcome the drawbacks of the prior art by providing a vapor chamber sealing method and its structure, and both of the method and structure can achieve the effects of sealing the edges of the vapor chamber while maintaining the strength of the metal of the structure of the plate or shell of the vapor chamber.
To achieve the aforementioned and other objectives, this disclosure provides a vapor chamber sealing method, comprising the steps of:
(S1) preparing an upper plate and a lower plate for forming a vapor chamber plate, and the outer edges of both upper and lower plates are sealed edges attached on each other;
(S2) aligning the sealed edges of the upper and lower plates precisely, and engaging the upper and lower plates to form a chamber between the upper and lower plates; and
(S3) forming a sealing structure combined with the sealed edges of the upper and lower plates by injection molding method.
To achieve the aforementioned and other objectives, this disclosure also provides a vapor chamber sealing structure comprising an upper plate, a lower plate, and a sealing structure, characterized in that the upper plate has a continuous surrounding sealed edge formed at the outer edge of the upper plate, and the lower plate outer edge also has a continuous surrounding sealed edge, and the sealed edge of the lower plate is aligned precisely and engaged with each other to form a chamber between the upper and lower plates, and the sealing structure is formed by injection molding and continuously surrounds and combines with the sealed edges of the upper and lower plates.
The technical contents of this disclosure will become apparent with the detailed description of preferred embodiments accompanied with the illustration of related drawings as follows. It is noteworthy that same numerals are used for representing same respective elements in the drawings.
With reference to
With reference to
With reference to
With reference to
Specifically, the outer surfaces of the upper and lower plates 1, 2 are processed with a surface treatment in this disclosure. For example, a sealing structure 3 is formed at the outer surfaces of the sealed edges 10, 20 of the upper and lower plates 1, 2 separately by the aforementioned injection molding method, so that the sealing structure 3 is capable of improving the binding or combining strength between the upper and lower plates 1, 2.
With the aforementioned structural assembly, the vapor chamber sealing method and its structure in accordance with this disclosure are achieved.
With reference to
With reference to
In the vapor chamber sealing method and its structure in accordance with this disclosure, the sealed edges of the upper and lower plates 1, 2 of the vapor chambers are formed by the injection molding method to provide the sealing structure 3 which surrounds the outer edge of the vapor chamber, so as to achieve the sealing effect of the vapor chamber. With the sealed edges of the vapor chamber, the metal of the vapor chamber can be prevented from being deteriorated by the high temperature of the conventional high-temperature sintering or laser welding or affecting the strength or hardness of the structure.
In summation of the description above, this disclosure is definitely capable of achieving the expected effects and overcoming the drawbacks of the prior art, and the disclosure complies with patent application requirements, and thus is duly filed for patent application. While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.
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Number | Date | Country | |
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20200173732 A1 | Jun 2020 | US |