BACKGROUND
Technical Field
The disclosure relates to a heat conduction component, particularly to a vapor chamber with a spoiler structure.
Related Art
The related-art vapor chamber is used to attach on a heat source by one surface, and another surface is used as a condenser to offer heat conduction and is designed with various shapes for matching different demands of heat dissipation. For example, by a design similar to a heat pipe, one part of a vapor chamber functions as a heated portion and another part of a vapor chamber functions as a condenser, and the transmission shapes in the middle are provided according to the differences of a heat source and a cooling position to constitute various types of vapor chambers to satisfy different demands of vapor chambers applied to various circumstances.
However, in practice, there may be some problems. For example, because of being subject of the variation required by the shape, the function or performance of a vapor chamber may be affected. In general, a vapor chamber utilizes the gas-liquid phase change of the working fluid stored therein to provide heat conduction. When liquid or gas working fluid is transmitting, the transmitting speed may be affected by the change of shape of a vapor chamber. For example, when a cross-sectional area of a vapor chamber is changed from large to small, the flow speed of the passing working fluid is accelerated. When the evaporated working fluid is being accelerated, the returning working fluid is also affected that may cause dry-out because of no returning of working fluid. As a result, how to avoid such a problem is an important issue in the design of a vapor chamber.
In view of this, the inventors have devoted themselves to the above-mentioned prior art, researched intensively and cooperated with the application of science to try to solve the above-mentioned problems.
SUMMARY
An object of the disclosure is to provide a vapor chamber with a spoiler structure, which utilizes the additional spoiler structure to control the flow speed of working fluid in the vapor chamber to avoid the limitations of functions or performance of heat conduction of the vapor chamber due to the demands of shape design.
To accomplish the above object, the disclosure provides a vapor chamber with a spoiler structure, which includes an upper plate and a lower plate covering each other to form a hollow internal space, an evaporation portion and a condensation portion jointly formed by the upper plate and the lower plate, and a transmission portion communicating with the evaporation portion and the condensation portion. The transmission portion includes multiple spoiler rods disposed therein to support between the lower plate and the upper plate. The spoiler rods at least include multiple first rods adjacent to an end of the evaporation portion and multiple second rods adjacent to an end of the condensation portion. A distance between any two of the first rods is less than a distance between any two of the second rods.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an exploded view of the first embodiment of the disclosure;
FIG. 2 is an assembled view of the first embodiment of the disclosure;
FIG. 3 is a plan schematic view of the first embodiment of the disclosure;
FIG. 4 is a schematic view of the using status of the first embodiment of the disclosure;
FIG. 5 is a cross-sectional view according to line 5-5 in FIG. 4; and
FIG. 6 is a schematic view of the using status of the second embodiment of the disclosure.
DETAILED DESCRIPTION
The technical contents of this disclosure will become apparent with the detailed description of embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and drawings disclosed herein are to be considered illustrative rather than restrictive.
Please refer to FIGS. 1-3, which are an exploded view, an assembled view, and a plan schematic view of the first embodiment of the disclosure. The disclosure provides a vapor chamber with a spoiler structure. The vapor chamber 1 includes an upper plate 11 and a lower plate 10 covering each other to form a hollow internal space. The lower plate 10 is laid with a capillary layer 12. The capillary layer 12 may be woven mesh, sintered metal powder or grooves formed in the lower plate 10.
The upper plate 11 and the lower plate 10 of the vapor chamber 1 jointly form an evaporation portion A and a condensation portion B. The lower plate 10 has a lower evaporation portion 100 corresponding to the evaporation portion A and a lower condensation portion 101 corresponding to the condensation portion B. The upper plate 11 has an upper evaporation portion 110 corresponding to the evaporation portion A and an upper condensation portion 111 corresponding to the condensation portion B. The evaporation portion A may be greater than the condensation portion B in area. A transmission portion C is disposed between the evaporation portion A and the condensation portion B for communicating with the evaporation portion A and the condensation portion B. The lower plate 10 has a lower transmission portion 102 corresponding to the transmission portion C. The upper plate 11 has an upper transmission portion 112 corresponding to the transmission portion C. The transmission portion C is tapered from the evaporation portion A to the condensation portion B to match the evaporation portion A with the area greater than that of the condensation portion B.
As shown in FIG. 3, the disclosure arranges a spoiler structure in the transmission portion C to avoid acceleration of evaporated working fluid passing the transmission portion C, which is tapered from the evaporation portion A to the condensation portion B. That may affect the reflow speed and the reflow amount to prevent dry-out. The inside of the of the transmission portion C is disposed with the spoiler structure. The spoiler structure is composed of multiple spoiler rods 13 supporting between the lower plate 10 and the upper plate 11. The spoiler rods 13 at least include multiple first rods 130 adjacent to an end of the evaporation portion A and multiple second rods 131 adjacent to an end of the condensation portion B. A distance d between any two of the first rods 130 is less than a distance D between any two of the second rods 131. In addition, multiple third rods 132 may be disposed in the transmission portion C and between the first rods 130 and the second rods 131 and the multiple third rods 132 have transversal number change adapted with tapered width (such that the third rods 132 along the width direction have substantially the same separation). The third rods 132 may be arranged from the first rods 130 to the second rods 131 to be regularly distributed in the transmission portion C to maintain the spoiling effect.
Accordingly, as shown in FIG. 4, the evaporation portion A may be used on a heat source 2, and the condensation portion B may be disposed with multiple fins 3 for heat dissipation. When the evaporation portion A is heated by the heat source 2, the evaporated working fluid in the vapor chamber 1 flows toward the condensation B. Because the distance d between the first rods 130 is the smallest in the spoiler structure, a better spoiling effect may be provided to avoid acceleration of the evaporated working fluid. Next, as shown in FIG. 5, the evaporated working fluid passing the transmission portion C is continuously affected by the spoiler structure to gradually decelerate. When the evaporated working fluid finally passes the second rods 131, because the distance D between the second rods 131 is the greatest in the spoiler structure, the passed evaporated working fluid may smoothly enter the condensation portion B for cooling. Meanwhile, because the working fluid returning to liquid state in the condensation B reflows through the capillary layer 12 in the lower plate 10 and the evaporated working fluid in the transmission portion C may not accelerate due to the spoiler structure, the working fluid may rapidly reflow to the evaporation portion A through the capillary layer 12 with the capillary force to avoid dry-out.
Please refer to FIGS. 1 and 2. In the disclosure, the inside of each of the upper evaporation portion 110 and the upper condensation portion 111 of the evaporation portion A and the condensation portion B is disposed with multiple support rods 14. The support rods 14 are also used to support between the lower plate 10 and the upper plate 11, and no distance limitation therebetween because the spoiling issue may not need to be considered. The number of the support rods 14 may be adjusted depending on the actual area sizes of the evaporation portion A and the condensation portion B. Generally speaking, the support rods 14 are less than the spoiler rods 13 in the distribution density.
Thus, by the above structure, the vapor chamber with the spoiler structure is obtained.
In addition, as shown in FIG. 6, in the second embodiment of the disclosure, the vapor chamber 1 may use the evaporation portion A with different shapes to correspond to different or multiple heat sources 2. Meanwhile, the condensation portion B may be added depending on the condensing positions. Also, one transmission portion C is disposed between each condensation portion B and the evaporation portion A. The shape of the transmission portion C may be arranged depending on the actual positions of the heat source 2 and heat dissipation element. In the transmission portion C, the spoiler structure of the disclosure may be implemented to reduce or avoid acceleration of evaporated working fluid during transmitting and affect the reflow effect. That may prevent dry-out, and the shape of the vapor chamber 1 may be changed depending on actual demands of circumstances to match diverse demands of changes of circumstances.
While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.
Patent Application
20230123190
