VAPOR DEPOSITION SOURCE AND VAPOR DEPOSITION APPARATUS

Abstract

An object of the present invention is to reduce splash generated in a vapor deposition source and carry out vapor deposition at a stable, high vapor deposition speed. The vapor deposition according to the present invention is carried out by vertically stacking a plurality of doughnut-shaped flat plates in a crucible, mounting thin vapor deposition material on the doughnut-shaped flat plates, using heaters that surround the crucible to heat the vapor deposition material on the doughnut-shaped flat plates, allowing the vapor generated from the vapor deposition material to flow through a flow space A at each layer into a vertical flow path B, and discharging the vapor from an opening at the top of the flow path B toward a substrate to be deposited. The conductance of the flow space A is smaller than the conductance of the flow path B.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagrammatic cross-sectional view illustrating the vapor deposition source according to the first embodiment.

FIG. 2 is a diagrammatic cross-sectional view illustrating a vapor deposition apparatus using the vapor deposition source according to the first embodiment.

FIG. 3 is an exploded cross-sectional view illustrating the vapor deposition source according to the second embodiment.

FIG. 4 is a cross-sectional assembly view illustrating the vapor deposition source according to the second embodiment.

FIG. 5 is a diagrammatic cross-sectional view illustrating a vapor deposition apparatus according to a conventional embodiment.

Claims

1. A vapor deposition source that houses vapor deposition material, the vapor deposition source comprising: an enclosure that houses the vapor deposition material therein and has an opening at the top the enclosure for discharging the vapor deposition material after heated; anda plurality of mounting units for mounting vapor deposition material, the plurality of mounting units vertically disposed in the enclosure in a multilayer manner with a gap between each pair of mounting units, each of the mounting units being a planar member and having a hole therein,wherein the gap forms a flow space in the in-plane direction of the mounting unit for guiding the vapor generated from the mounted vapor deposition material to the opening of the enclosure,the holes of the mounting units form a vertical flow path that connects the flow spaces to the opening of the enclosure, andthe conductance of the flow space is smaller than the conductance of the flow path.

2. The vapor deposition source according to claim 1, wherein the conductance of the opening of the enclosure is smaller than the conductance of the flow path.

3. The vapor deposition source according to claim 1, wherein the enclosure is disposed above the mounting units, and the mounting units are not disposed immediately under the opening of the vapor deposition source but covered with the enclosure.

4. The vapor deposition source according to claim 1, wherein the vapor deposition source is adapted such that a plurality of structures is vertically stacked, in which the enclosure is integrated with the mounting unit and each of the structures is independent for each mounting unit.

5. A vapor deposition apparatus comprising the vapor deposition source according to claim 1, a chamber, a heating unit for heating vapor deposition material mounted in the vapor deposition source and a holding member for holding an object to be deposited.