Patent Grant
11766071
This application is a Continuation in Part application of German patent application 10 2019 135 177.4 filed Dec. 19, 2019, the entire contents of which is incorporated herein by reference.
The invention relates to a method for producing vaporizer units as a component of inhalers.
The invention furthermore relates to vaporizer units, vaporizer assemblies and vaporizer cartridges as a component of inhalers.
The invention also relates to inhalers, formed and configured for inhaling vapour/aerosol enriched with active ingredients and/or flavourings.
Such vaporizer units, vaporizer assemblies, vaporizer cartridges and inhalers are used in the luxury goods/stimulants industry, here in particular in the context of an electronic cigarette, what are known as E-cigarettes, and in the medical sector in order to be able to inhale liquid luxury goods/stimulants and/or liquid medical products in vapour form and/or as aerosols. During consumption, a person normally sucks on a mouthpiece of the inhaler, as a result of which a suction pressure arises in an air flow channel, which suction pressure generates an air flow through the air flow channel. The air flow can, however, also be generated by machine, for example, by a pump. In the air flow channel, a liquid which is generated by the vaporizer unit and provided in a vaporised form is added to the air flow in order to administer an aerosol or an aerosol-vapour mixture to the consuming person. The liquid is stored at or in the vaporizer cartridge. Various mixtures with various components of the same or different vapour densities are used as the liquid. A typical mixture for use in an E-cigarette has, for example, components of glycerine and propylene glycol, where applicable, enriched with nicotine and/or almost any desired taste and/or flavouring agents. The mixture can correspondingly have medical components and active ingredients for use in the medical or therapeutic sector, i.e., for the inhalation of asthma preparations.
The vaporizer unit which is normally a single-use item or component of a single-use item is of central importance in the inhaler. An increasing trend is apparent for the use of such vaporizer units which leads to the vaporizer units, vaporizer assemblies and vaporizer cartridges and inhalers being produced in very large numbers in particular when the vaporizer assemblies and/or vaporizer cartridges with the vaporizer units are formed as single-use items. In other words, the vaporizer units are a mass-produced product. The previously known methods for the production of vaporizer units are only suitable to a limited extent to produce large numbers of items quickly and efficiently in order to be able to mount them en masse quickly and efficiently in vaporizer assemblies and vaporizer cartridges or be able to produce inhalers from them.
The vaporizer unit is a component of the vaporizer assembly. The vaporizer assembly is a component of the vaporizer cartridge. The vaporizer cartridge forms the inhaler together with a cartridge carrier and a mouthpiece. The individual components of the vaporizer cartridge, namely at least one hollow body, a supply tank and the vaporizer unit, can be combined in a joint component, wherein this component is then a single-use item which is designed for a finite number of inhalation draws by a consuming person and forms an inhaler together with a cartridge carrier as a reusable multi-use item which comprises at least one electronic control unit and an energy source. The vaporizer cartridge can, however, also firstly be formed by the joining together of several components, wherein individual components, namely in particular the hollow body and the vaporizer unit, are arranged in the cartridge carrier as multi-use items, and the supply tank as a separate component forms the single-use item. Ultimately, the inhaler can be used variably by replacing the single-use item which normally contains the liquid.
The single-use item and the multi-use item are correspondingly connected detachably to one another. The cartridge carrier as a multi-use item normally comprises at least one electronic control unit and an electric energy source. The energy source can be, e.g., an electrochemical single-use battery or a rechargeable electrochemical battery, e.g., a lithium ion or lithium polymer battery, by means of which a heating element is supplied with energy via electric contacts of the vaporizer unit. The electronic and/or electric control unit serves to control the vaporizer unit within the vaporizer cartridge. The cartridge carrier can, however, also comprise components of the vaporizer cartridge. The single-use item can be formed as a plug-on part so as to be capable of being plugged onto the multi-use item or as an insertion part so as to be capable of being inserted into the multi-way item. Instead of a plug connection, screw connections, snap connections or other quick connections can also be used. A mechanical and electric coupling for the formation of a functionally ready inhaler is produced with the connection of a single-use item and a multi-use item.
A component which ultimately determines the use (e.g., as an E-cigarette or as a medical inhaler) is the supply tank as a component of the vaporizer cartridge. This generally includes the liquid selected, desired and/or required by the person or a liquid mixture (also referred to below in general as a fluid) as well as the hollow body which forms the air flow channel and the vaporizer unit. The fluid is stored in the supply tank of the vaporizer cartridge. The fluid is conducted by means of the liquid-permeable—as a result of micro-channels—vaporizer unit out of the supply tank due to at least initially capillary conveying through a wick element and to the heating element. The voltage generated by an energy source and applied to the heating element leads to a flow of current in the heating element. As a result of the heating resistance, preferably the ohmic resistance of the heating element, the flow of current leads to a heating of the heating element and ultimately to a vaporisation of the fluid located in the vaporizer unit. The vapour and/or aerosol generated in this manner escapes from the vaporizer unit in the direction of the air flow channel and is mixed with the air flow as additional vapour. The fluid thus has a predefined track with a predefined direction of flow, namely as a fluid through the wick element to the and through the heating element and in a gaseous form out of the heating element into the air flow channel. In the air flow channel, the vaporised fluid is carried along by the air flow, wherein vapour/mist and/or aerosol are formed if the air flow channel is acted upon with a pressure/vacuum in that, e.g., a consuming person sucks on the air flow channel or a pump conveys an air flow through the air flow channel.
So that the fluid does not flow out of the supply tank directly into the air flow channel, the vaporizer unit completely covers the access from the supply tank to the air flow channel. Completely covered means in this context that the liquid is necessarily guided through the vaporizer unit so that the fluid cannot travel directly from the supply tank into the air flow channel, but rather must take the “detour” via the wick element and the heating element. The wick element serves on one hand the purpose of interim storage of fluid in order to still make available sufficient fluid for a few draws on the inhaler in particular in the case of an almost empty supply tank. The wick element serves on the other hand in particular to transport the fluid from the supply tank in the direction of the air flow channel and acts simultaneously as a type of non-return protection in order to suppress the return flow of fluid and/or gas or vapour in the direction of the supply tank and prevent an accumulation of individual components of the fluid at higher temperatures.
Known methods for producing vaporizer units provide that heating elements, e.g., components having substantially silicon or doped silicon, are connected by means of direct contacting electrically to conductor paths on a ceramic substrate in such a manner that the heating element covers a passage opening located in the ceramic substrate. This method is only suitable to a limited extent for mass production. Vaporizer units produced in such a manner are problematic on one hand in terms of the imperviousness—with the exception of the micro-channels in the heating element—of the passage opening, and on the other hand during mounting of the vaporizer unit with components of the inhaler which surround the vaporizer unit. In order to ensure that neither liquid enters into the air flow channel nor liquid runs out of the vaporizer cartridge or the inhaler, additional sealing means, e.g., in the form of sealing rings or the like are necessary. This leads to a plurality of individual parts with correspondingly narrow tolerances so that mounting of the vaporizer units produced with the known methods is complicated and expensive, since automation of production is to some extent very complex and therefore complicated and technically difficult.
In further known methods for producing vaporizer units, metallic punch strips around which plastic is sprayed are fitted with heating elements. The heating elements are prefixed and then an electric contacting of the heating elements with conductor paths of the punch strips is performed, e.g., by means of wire bonding. This method is on one hand complicated and thus expensive since an automated sequence of steps can be carried out with standardised processes only in adapted apparatuses/machines. In the case of the vaporizer units manufactured in such a manner, the sealing problem furthermore exists since with components of the inhaler which surround the vaporizer unit, several such components have to be sealed off with respect to one another with additional sealing means as a result of the variety of parts in particular during mounting of the vaporizer units. As a result of this, the mounting of the vaporizer units produced with the known methods is complicated and expensive.
As known to those of skill in the art, while the above discusses features and structures that may be known, certain uses and combinations disclosed hereinbelow nonetheless may be novel and non-obvious.
The object on which the invention is based is thus to propose an efficient method for mass production of vaporizer units which are mounting-friendly and optimised in terms of sealing properties. The object further lies in creating mounting-friendly vaporizer units, vaporizer assemblies, vaporizer cartridges and inhalers which can be produced in an automated and efficient manner as mass-produced articles and have optimised sealing properties.
This object is achieved by the method with the following steps: a) providing a flexible circuit board material with a plurality of sites for individual vaporizer units, wherein the flexible circuit board material is optionally pre-structured at least with conductor paths and/or pre-punched areas predetermined in terms of position and/or course for each site, b) providing and placing at least one heating element which is optionally connected or can optionally be connected electrically to the conductor paths at the or each site, and c) at least partial covering of each site with a sealing material for the formation of a partial sheathing for each formed vaporizer unit, wherein the sealing material is applied in such a manner that the sheathing formed from sealing material covers each heating element while keeping open a heating surface at least on an upper side of the flexible circuit board material at least in an edge region, and at least the outer surfaces of the sheathing pointing away from the circuit board material and/or the heating element form sealing surfaces. The production of vaporizer units as mass-produced articles is ensured without additional development of special machines or the like with this sequence of steps. The sequence of steps can be performed at least in a partially automated manner, preferably, however, in a fully automated manner above all from delivery of the individual parts up to the installation-ready evaporator unit within a production line composed of known apparatuses/machines. As a result, the logistics requirements are restricted in a cost-saving manner merely to the supply of individual parts, such as flexible circuit board material and heating elements and sealing material, and the transporting away of the produced vaporizer units.
The flexible circuit board material is an expedient carrier material and enables an energy-saving design of the conductor paths with a conductor cross-section which can be configured almost as desired. In particular, as thin as possible and as narrow as possible conductor path cross-sections can be provided for optimised energy efficiency. The use of the flexible circuit board material and its provision also enable, in contrast to the provision of ceramic or the punch scrap sheathed with plastic as the carrier material, small contours for conductor paths and/or pre-punched areas and provide a wide range of contacting possibilities of the conductor paths free from process-related restrictions, such as exist, for example, in the punch scrap process. For example, the circuit board material can have polyimide in the form of a film or be composed thereof.
Pre-punched areas in the sense of the invention are holes, gaps, clearances, passages or the like in the circuit board material which connect the upper side to the lower side. Examples of pre-punched areas are, e.g., circumferential separating gaps only interrupted by connecting webs or openings which form passage openings at each site. A connecting location which forms the basis for a vaporizer unit to be produced is referred to as a site. A connecting location is a region on the circuit board material which can be separated/isolated after the completion of the rest of the circuit board material and as a result forms an individual vaporizer unit. The several sites on a roll are preferably formed to be identical and thus form what are known as continuous strands/belts. The sites can be arranged/formed individually consecutively and/or in two or more rows next to one another, uniformly or offset from one another or in another manner on such a belt. For example, the sites can be arranged in a chessboard-like pattern or in a hexagonal pattern. The electric conductor paths and pre-punched areas are predefined and pre-structured for each site, and indeed depending on the configuration of the vaporizer units to be produced in each case. In other words, the flexible circuit board material is prefabricated. Prefabrication can also comprise the heating elements in that a heating element is integrated at each site instead of a pre-punched area as a passage opening for a heating element to be placed separately in the circuit board material, which heating element is connected electrically to the conductor paths. In this event, steps a) and b) coincide since the heating elements are also provided simultaneously with the provision of the flexible circuit board material. The connection of the heating element to the conductor path can already exist, e.g., in the case of a heating element integrated into the circuit board material as a film heater. Such a heating element can be liquid-permeable or become liquid-permeable, e.g., through a micro-structuring. The connection can, however, also only be formed, e.g., in the case that the heating element is placed on the conductor paths. Such a heating element can advantageously already have micro-channels.
Alternatively or additionally, the electric conductor paths can be applied prior to the provision and placing of the heating element onto the circuit board material. This can occur, for example, with a process which is similar to colour printing, e.g., polyjet, screen printing or stamp printing, or targeted vaporisation. Any other suitable and known process is, however, also conceivable. In other words, the circuit board material is prefabricated or prestructured by this step. Alternatively or additionally, pre-punched areas are also incorporated into the circuit board material prior to or after the provision and placing of the heating element. For example, pre-punched areas can be incorporated via suitable punching tools or other cutting and boring tools. In other words, the circuit board material is prefabricated or prestructured by this step. The sequence of the application of conductor paths and the introduction of pre-punched areas can be carried out independently and thus consecutively in any desired sequence or simultaneously.
In the event that the heating elements are not an integral component of the flexible circuit board materials, but rather in step b) are provided as structural elements/heating chips to be fitted separately, the placing of the or each heating element comprises, e.g., by means of suitable SMT pick-and-place machines the receiving and outputting of each heating element which can be, e.g., a heater chip composed significantly of silicon comprising a sawn wafer composite or also a film heating element above the or each pre-punched area formed in the circuit board material as a passage opening. For the electric connection of the fitted heating elements to the conductor paths, see further below. The providing and placing of the heating element on the or each site comprises in the sense of the invention, e.g., also the provision and placing at every second site in so far as this is desired or necessary, or only at fault-free sites. The term at each site therefore does not mean anything other than at any desired, predefined site.
In step c) at least the or each heating element is partially enclosed, e.g., with suitable silicons, plastics, polyimide, rubber or other materials which are suitable as sealing material, for example, by means of what is known as the Film-Assisted-Moulding method. It is also conceivable that the sealing material has a multi-layer structure from any desired combination of the above-mentioned materials and is produced by multiple use of the Film-Assisted-Moulding method with in each case a different or the same above-mentioned materials from the list. Regions of the heating element, namely in particular the heating surface, are partially recessed. On one hand, an (additional) mechanical retention of each heating element is formed with the formation of the sheathing. On the other hand and particularly advantageously, sealing surfaces are simultaneously created with the sheathing. Reliable sealing surfaces adapted to desired or necessary contours can particularly advantageously be achieved as a result of the at least partial covering by at least partially spraying or moulding of the site with sealing material. The sealing surfaces/seals integrated in the vaporizer unit, preferably with a defined sealing surface, can reduce the number of components required, such as, e.g., additional sealing means, during mounting to an inhaler. As a result of this, the mounting is simplified and the automation of the process is optimised. A further advantage of the at least partial covering of each site with the sealing material lies in the fact that, as a result of the shaping of the sheathing, surrounding geometries of the vaporizer unit, e.g., for air and/or liquid guidance are included in the vaporizer unit, namely are an integral component of each vaporizer unit. Due to the fact that the sealing material is applied in step c), a sharp delimitation to the heating surface of the heating element can also be achieved so that an effective sealing directly to the active heating surface, i.e., the active passage region for liquid from a tank, is achieved. In step c), optionally only the upper side which bears the heating elements is provided with the sealing material. The lower side of each vaporizer unit can be delimited free from sealing material by the circuit board material.
Flexible circuit board material is preferably provided in step a), in the case of which at least one site for an RFID chip is formed in the region of each site for a single vaporizer unit, wherein the flexible circuit board material is prestructured in terms of position and/or course of predetermined conductor paths as an RFID antenna. A high degree of integration is thus achieved in that installation space which is present in any event on the circuit board material is used to improve the functionality of each vaporizer unit obtained therefrom without changing the installation space and without negatively influencing the efficiency during mass production. The predetermined conductor paths as RFID antenna ultimately form at least one coil, wherein transmission and receiving coils can be formed separately from one another, preferably in parallel planes to one another with a small spacing, or can be formed integratively as a joint transmission and receiving coil. The preferred further development also enables in particular a modular product concept in the case of which optionally a heating element and/or an RFID chip can be integrated.
In one advantageous further development, the flexible circuit board material is optionally pre-structured at least with conductor paths and/or pre-punched areas predetermined in terms of position and/or course for each site for electronic connection at least of the RFID chip. As a result of this, the connections and/or the antenna itself are already provided and incorporated during the structuring process of the circuit board materials, which ensures particularly compact and efficient production of the vaporizer units.
An RFID chip is preferably provided and placed at each site in a step k) which can be carried out prior to, with or after step b). This is performed in the event that the or each RFID chip is not an integral component of the flexible circuit board material, but is rather provided in step k) as a structural element to be fitted separately. For example, NFC components can be provided and placed as an RFID chip. Other short-distance radio modules can, however, also be used. The or each RFID chip can itself have an antenna in order to be able to communicate with the or each RFID antenna. The placing of the or each RFID chip is performed, e.g., by means of suitable SMT pick-and-place machines, just like the receiving and outputting of each RFID chip. For the electric connection of the fitted RFID chips to conductor paths, see further below.
As mentioned, the RFID chip can be an integral component of the circuit board material. Optionally, the separate RFID chip is provided, placed and connected electrically to the conductor paths, wherein the RFID chip at each site is optionally connected or can optionally be connected to the conductor paths which form the RFID antenna. The connection can be performed electrically or via wireless signals.
In order to protect the RFID chip, in particular from moisture, the site for the RFID chip is also optionally covered with the sealing material with the formation of sealing surfaces in step c) additionally for partial covering of each site for the heating element.
The provision of the flexible circuit board material in step a) is preferably optionally performed by rolling out the circuit board material stored on rolls or by supplying portions of the circuit board material stored in magazines or the like. The rolls with flexible circuit board material can be stored in a space-saving manner and enable rapid provision of the sites in large numbers by simple rolling out/unwinding. The same applies to the supply of portions of the circuit board material from magazines or the like.
In step c), each site is advantageously enclosed at least partially with sealing material in such a manner that sealing surfaces for an existing connection free from additional sealing means to the components of the inhaler surrounding the vaporizer unit are additionally formed both on the upper side and on a lower side, opposite the upper side, of the flexible circuit board material on the outer surfaces of the sheathing. The formation of additional, preferably defined, sealing surfaces in particular on the lower side of the circuit board material can also be performed prior to/during/after the application of the sealing material onto the upper side. The vaporizer unit can thus be mounted in a particularly easy and particularly sealing manner, e.g., into standardised vaporizer assemblies or the like.
As described further above, the heating elements can also be formed as separate structural elements. In this event, it is particularly advantageous that step b) comprises: as step b1) the application of electric contacting material at least on contact surfaces of the conductor paths at each site on the upper side of the flexible circuit board material; as step b2) the placing of the at least one heating element in the region of each site in such a manner that a pre-punched area which connects the upper side to the lower side of the circuit board material is fully or partially covered by the or each heating element; and as step b3) the formation of an electric connection between the heating element and the conductor paths at each site.
As described further above, the RFID chips can be provided as separate structural elements. Step k) optionally comprises: as step k1) the application of electric contacting material at least on contact surfaces of the conductor paths at each site for the RFID chips on the upper side of the flexible circuit board material; as step k2) the placing of the at least one RFID chip in the region of each site; and as step k3) the formation of an electric connection between the RFID chip and the conductor paths at each site. In further embodiments or preferred further developments, electric contacting material can also be applied onto the contacts of the RFID chips. Concretely, for example, anisotropically conductive adhesive can be applied onto the lower side of the chip in the region of the contacts, wherein the chips prepared in such a manner are placed onto the conductor paths of the flexible circuit board material.
The application of the electric contacting material, which can be, e.g., soldering paste, solder, sinter paste, electrically conductive adhesive material or the like or a combination of one or more of the above-mentioned contacting materials, can be performed by means of suitable methods. Examples of suitable methods are screen printing, stencil printing, pad printing, dispensing or the like or a combination of one or more of the above-mentioned methods. These methods are performed with the aid of suitable apparatuses. One example of a suitable apparatus is a screen-printing machine.
The placing of the heating element and also of the RFID chip can preferably be performed with an SMT pick-and-place machine or the like. The formation of the electric connection can be performed, e.g., by transforming the contacting material, e.g., by heat and/or pressure in a furnace, a sintering press, contact thermodes or the like or a combination of one or more of the above-mentioned variants. Wiring by means of what is known as wire bonding is also optionally possible in step b3). As a result of the adaptation of the manufacturing process of the vaporizer units to standardised manufacturing processes and manufacturing device, in particular in step b), on one hand mass production of vaporizer units is ensured, and on the other hand capacity bottlenecks which can arise when using special methods/special machines are reliably avoided.
It is also conceivable that what is known as the nanowiring method is used for electric contacting of the heating element. In the case of the nanowiring method, nanowires are grown on a surface. The nanowiring method is a galvanic process which is similar to pad printing. In this case, a pad which bears an electrolyte is pressed onto the substrate. A metallic lawn with diameters of a few nanometres to a few micrometres and lengths of a few hundred nanometres to a few tens of micrometres grows into the porosity layer of the pad. The substrates are only coated in the provided regions with nanowiring coating by a structuring process (also referred to as masking). Finally, during the stripping process, all of the materials which are not required for the connection are removed and cleaning of the substrate is performed. As a result of the galvanic process, it is possible to produce the nanowires from practically any galvanically separable metal. For example, copper, gold or nickel can be used for the production of the nanowiring coating.
In the case of what is known as KlettWelding, two substrates are prepared by means of the nanowiring method, i.e., the portions of the conductor paths on the circuit board material and portions on the heating element are connected in each case to a nanowiring coating and thus provided with nanowires are connected by compression (e.g., with 20 MPa) at room temperature. This force can be applied as a function of the component size by commercially available pick-and-place machines or flip chip bonders. Large surface area connections are produced with electric or hydraulic motors. The use of simple knee lever presses is also possible. As a result of their small diameters, the individual wires are connected instantaneously mechanically and additionally at an atom lattice level—similar to cold welding. The resultant connection has comparable electric—and thermal—characteristic data to rolled copper, alongside simultaneously high mechanical strength.
It is also conceivable that the electric connection is performed by means of what is known as the KlettSintering process. In this case, only one substrate, i.e., either the circuit board material or the heating element, has a nanowiring coating. The second substrate, i.e., either the heating element or the circuit board material, requires a copper-plated or gold-plated surface. Both substrates are compressed (e.g., with 20 MPa) and a temperature in the range of 210° C. is introduced into the connection zone, e.g., via a thermode. The same also applies to the electric contacting of the RFID chip.
In one preferred further development of the method, after step c), the sprue portions of the sealing material generated during covering or enclosing of the sites with sealing material are removed in a step d). Each site or the vaporizer unit formed thereon—with the exception of at least one connecting web—is thus released or separated from the circuit board material and all further connections which are not a component part of a vaporizer unit. It is, however, also conceivable that the release or separation of the sprue portions is performed simultaneously in the case of an isolation of the vaporizer units from the belt from the circuit board material.
Preferably, after step c) or d), the circuit board material provided with the plurality of finished, sealing vaporizer units can, for further use, in a step e) be optionally rolled back onto a roll or collected in a magazine or the like. Rolling up/collection can also already be performed after step b) in particular from the time of permanent connection between the heating element and the circuit board material. Further use can be storage, intermediate storage or further processing. As a result of the intermediate rolling up/collection of the circuit board material produced in steps a) and b) or a) to c) or d) with vaporizer units generated thereon, a space-saving, effective mass production of vaporizer units is actively supported. For example, complete rolls or magazines or the like can be supplied with a plurality of vaporizer units so that mass mounting of the vaporizer units is subsequently enabled after completed isolation at any desired location.
To prepare mounting of the vaporizer units, the sealing vaporizer units are isolated from the flexible circuit board material for further use in a step f). Isolation can be performed, e.g., preferably by punching from the circuit board material in that the or each remaining connecting web to the circuit board material is separated. The vaporizer units can also be separated fully from the circuit board material, i.e. without entirely or partially circumferential pre-punched areas. Sawing or cutting are also options for isolation. The isolated vaporizer units can then be further processed as trayware or bulkware or directly be further mounted.
To complete the vaporizer unit, at least one wick element can be placed in a step g) on or at the upper side of the flexible circuit board materials on the free heating surfaces of the heating elements at each site. The wick element is preferably mounted on or at an upper side (O) of the circuit board material. The wick element can be placed on the free heating surface in particular in the case of a one-piece formation, e.g., by means of SMT pick-and-place machine. The wick element can also be configured as a granular wick element and be poured for mounting. A granular wick element is at least partially formed from a plurality of granulate-like grains which form micro-channels as a result of their pouring and/or formation. In the event that the wick element is already formed in combination with the heating element, the heating element therefore simultaneously the wick element or the heating element at and/or on the heat surface has a wick element, the wick element is also simultaneously placed by the placing of the heating element. The wick element can correspondingly be placed in any desired sequence of steps together with step b) or after step b). During placing after step b), the or each wick element can still be placed prior to step c) or after step c). For fixing each wick element, it can, e.g., be placed/pushed/mounted/fixed into a recess/pocket formed by the sealing material or the like after step c). The wick element can also be placed after step c) on the free heating surface and fixed by pushing into a receiver, e.g., formed in a component of a vaporizer assembly. The time of fitting/placing the wick elements can ultimately be selected almost as desired. Even the placing of the wick element after isolating the vaporizer units from the circuit board material is possible.
In one preferred further development of the method, at least one additional electronic component can be placed in the region of each site in a step h), preferably together with step b2) and k2). The electronic component is, for example, an ID chip which serves as a characterising element for unique identification of the respective vaporizer unit and as an NFC element, RFID element or as a digital memory chip (e.g., EEPROM). The or each ID chip can optionally also be connected to an antenna, for example, an NFC antenna or an RFID antenna. Various options are possible in terms of the position of the or each ID chip on the site. It is also possible to position the additional components, instead of the ID chip or in addition to the ID chip, sensors and other electronic components can be placed, not only on the upper side, but also on the lower side in the region of corresponding electric contact surfaces. The ID chip and any other component can also be at least partially covered or enclosed by the sheathing. The covering/enclosing can be performed with the sealing material with which the heating element is also covered/enclosed in particular when the electronic component is placed prior to step c). The covering/enclosing can, however, also be performed in a separate step with the same sealing material or a second material, in particular a sealing material.
Preferably, prior to step h), and particularly preferably together, therefore simultaneously with step b1) and k1), contacting material can be applied on contact surface of the conductor paths at each site on the upper side and/or the lower side of the flexible circuit board material, and after step h), preferably together, therefore simultaneously with step b3) or k3), an electric connection is formed between the or each electronic component and conductor paths at each site. The production machine used for the heating elements can correspondingly be used.
Each heating element and/or each RFID chip and/or each additional electronic component is particularly preferably connected electrically to the conductor paths of the flexible circuit board material by using one or more methods from the list: direct contacting by means of silver sintering, eutectic bonding, conductive gluing, anisotropically conductive gluing, KlettWelding, KlettSintering, soldering, welding. As a result of this, particularly good contacting to the conductor paths is achieved, with sufficient thermal insulation.
Optionally, at least portions of an air flow channel are formed in step c) during covering or enclosing of each site from and/or with the sealing material on the lower side of the circuit board material at each site. The formation of the portions of the air flow channel can also be performed prior to step c) and after step c), and indeed by the sealing material with which the heating element is also covered/enclosed or with a second sealing material. This embodiment leads to what is known as an “open” variant since the air flow channel only becomes a continuous air flow channel which is closed on the circumferential side in combination with components surrounding the vaporizer unit.
In a further option, a tubular, prefabricated portion as part of an air flow channel is placed on the lower side of the circuit board material and enclosed by means of additional sealing material and thus fixed at each site. This embodiment leads to what is known as a “closed” variant since the vaporizer unit itself comprises a continuous portion of the air flow channel which is closed on the circumferential side.
At least steps a) to c) are particularly preferably carried out consecutively in each case at a separate or the same production station of a production line in such a manner that a plurality of sites are processed simultaneously in each step. As a result of this, a high degree of automation for rapid and efficient series production with highly optimised parts logistics is ensured.
The entire production process of the vaporizer units is particularly preferably carried out in a joint production line with several production stations, as a result of which the above-mentioned advantages are yet further supported.
In one preferred further development, the flexible, prestructured circuit board material which is preferably composed of polyimide is unwound as a continuous strand from a supply roll and continuously or intermittently transported through the production line which comprises several production stations. It is thus possible, for example, to roll out the continuous strand so that, e.g., at a first production station step b) is carried out at a plurality of sites for a plurality of vaporizer units. After the completion of step b), the continuous strand can be transported further in order to transport a subsequent portion of the continuous strand for the carrying out of step b) into the region of the first production station. For example, the leading portion which has already undergone method step b) can then optionally be located in a second production station for carrying out step c). This process sequence can be carried out continuously up to step h) and including step k). All of the production steps can thus be performed preferably in an entirely automated manner with the aid of a production line. The method can correspondingly also be carried out in that portions of flexible circuit board material are supplied with one site or several sites, e.g., in magazines, cassettes or the like and are transported with or without a magazine or the like through the production line.
The object is also achieved by a vaporizer unit mentioned hereinbefore which is characterised by a circuit board portion composed of flexible circuit board material, wherein the circuit board portion comprises at least two conductor paths and a passage opening which connects an upper side of the circuit board portion to a lower side of the circuit board portion, at least heating element which fully or partially covers the passage opening from the upper side and is in electric contact with the conductor paths, as well as a sheathing composed of sealing material which at least partially covers the circuit board portion and the heating element while keeping open a heating surface and is provided towards the outside with sealing surfaces. The flexible circuit board material of the circuit board portion offers, in addition to the possibility of mass production, a particularly energy-efficient formation of the cross-section of the conductor paths. As a result of the sheathing of the heating element composed of sealing material, this is on one hand reliably secured mechanically and on the other hand the preferably defined sealing surfaces pointing to the outside, i.e. away from the heating element, lead to the vaporizer unit including overall a double function, namely on one hand as a vaporizer and on the other hand as sealing means such that mounting with a reduced number of parts is ensured with the vaporizer unit according to the invention with integrated sealing means. Overall, an energy-efficient and reliable vaporizer unit which is suitable for mass production is created by the formation according to the invention.
The circuit board portion advantageously comprises at least one RFID chip and at least one RFID antenna. The or each RFID chip and the or each RFID antenna are thus an integral component of the carrier substrate and thus of the vaporizer unit itself so that contactless transmission of data, e.g., between the vaporizer unit or a vaporizer cartridge comprising the vaporizer unit and a cartridge carrier or between the vaporizer unit or an inhaler comprising the vaporizer unit and a read-out device, such as, e.g., a smartphone, is ensured in a compact and efficient manner. Typical data which can be transmitted are, e.g., data for correct vaporisation, to authorise the user of the inhaler, to activate the vaporizer cartridge or to track the usage behaviour by the user himself or herself and/or a doctor or pharmacist in particular for medically used inhalers.
The circuit board portion is advantageously formed from polyimide, a doped silicon chip with microchannels is connected as a heating element by direct contacting by means of silver sintering electrically to the conductor paths, and the circuit board portion as well as the silicon chip are partially enclosed by silicon or polyimide so that on one hand the silicon chip is mechanically retained and on the other hand preferably defined sealing surfaces preferably towards the outside are formed. The sealing surfaces can be formed to be undefined. The sealing surfaces preferably, however, have predefined and reproducible, i.e. defined sealing surfaces. An alternative to silicon can be a suitable plastic or polyimide. The circuit board portion and silicon chip are furthermore enclosed by the sealing material in such a manner that liquid can be transported through the microchannels of the silicon chip from a first side of the silicon chip to a second side of the silicon chip. The advantages described above are even further amplified with this formation. As an alternative to the silicon chip, what is known as a film heater can also be used or provided as the heating element which has a microstructure by means of which liquid can be transported from a first side of the film heater to a second side of the film heater.
In a particularly preferred further development, the conductor paths embedded in the flexible circuit board material protrude out of the sheathing formed by the sealing material for the formation of a flexible contacting bendably, in particular reversibly and/or flexibly bendably. During and after bending, the conductor paths embedded in the circuit board material are electrically conducting and contact the silicon chip or the film heater or any other heating element. As a result, further contacting in particular into components surrounding the vaporizer unit, for example, of a vaporizer assembly or vaporizer cartridge, can be dispensed with, which further reduces the variety of parts and in particular enables highly simplified and space-saving mounting.
One expedient embodiment is characterised in that the heating surface of the heating element is covered on the upper side at least partially by a wick element. As a result of this, the vaporizer unit is completed for particularly efficient and reliable use.
One optional embodiment is characterised in that at least one tube portion as a portion of an air flow channel is formed and/or arranged on the lower side of the circuit board portion, wherein the tube portion has an opening directed towards the heating element. The tube portion can be formed from sealing material and/or a separate tube.
The vaporizer unit is particularly preferably produced with a method as described herein. The advantages which arise from this have already been explained above in conjunction with the production method, hence reference is made to the corresponding passages to avoid repetition.
The object is also achieved by a vaporizer assembly mentioned hereinbefore which is characterised by a vaporizer unit as described herein as well as an adapter plug into which vaporizer unit is plugged, wherein the vaporizer unit or its sheathing bears at least partially with an outer surface of the sheathing in a sealing manner against the inner geometry of the adapter plug. The inner geometry of the adapter plug designates here surfaces of a region in the adapter plug which is configured for receiving the vaporizer assembly. As a result of this formation of the sheathing in combination with the inner geometry of the adapter plug, there is a fluid connection exclusively via the vaporizer unit in the direction of the flow channel without additional sealing means. In other words, the vaporizer assembly is formed in a sealing manner with the exception of the vaporizer unit in the region of the heating surface for receiving liquid from a supply tank and generating vapour in the direction of an air flow channel.
The vaporizer assembly advantageously comprises at least one portion of an air flow channel which is formed by the vaporizer unit and/or the adapter plug. The adapter plug can have a separate portion of an air flow channel, wherein the air flow channel has an opening for a connection to the vaporizer unit. The air flow channel can, however, also be formed entirely by the vaporizer unit or partially by the vaporizer unit in combination, e.g., with a wall of the adapter plug or a portion of the inner geometry described above of the adapter plug.
The object is also achieved by a vaporizer cartridge mentioned hereinbefore which is characterised by a hollow body with at least one portion of an air flow channel, a supply tank for storing liquid, as well as a vaporizer assembly, wherein the vaporizer assembly is connected to the hollow body and the supply tank in a sealing manner such that the portion of the air flow channel of the vaporizer assembly and the portion of the air flow channel of the hollow body form a joint air flow channel and the supply tank has at least one access opening to the flow channel in which the vaporizer unit is placed.
The object is also achieved by an inhaler mentioned hereinbefore which is characterised by a cartridge carrier comprising at least one electronic control unit and one electric energy source as well as a vaporizer cartridge.
The advantages which arise in conjunction with the vaporizer assembly, the vaporizer cartridge and the inhaler have already been described in conjunction with the production method as well as the vaporizer unit, hence reference is made to the corresponding passages to avoid repetition.
Further expedient and/or advantageous features and further developments as well as method steps will become apparent from the description and/or the drawing. Particularly preferred embodiments and the production method are explained in greater detail on the basis of the enclosed drawing. In the drawing:
aa) to 1bb) are schematic views of the embodiment according to
The vaporizer unit represented in the drawing or the vaporizer assembly and vaporizer cartridge serve, when mounted to an inhaler, for the inhalation of vapour and/or aerosols enriched with active ingredients, e.g., nicotine, from liquid, and are described in the context of an E-cigarette. Other purposes of use, in particular also use in the medical sector, are expressly encompassed, since in particular the vaporizer units and the vaporizer assembly allow universal use since the standardised vaporizer unit or vaporizer assembly enables an integration/an installation in various vaporizer cartridges and/or various tank shapes.
As mentioned, and generally referring to all Figures, the method serves to produce vaporizer units 10 as a component of inhalers 100. The method can be carried out manually or semi-automatically in that, e.g., only individual method steps are performed in an automated manner. The method is, however, preferably formed for fully automated performance or production of vaporizer units.
The method is characterised according to the invention in that at least the following steps are performed in the defined sequence a) to c), namely a) providing a flexible circuit board material 11 with a plurality of sites 12 for individual vaporizer units 10, wherein flexible circuit board material 11 is optionally pre-structured at least with conductor paths 13, 14 and/or pre-punched areas 15, 16, 24 predetermined in terms of position and/or course for each site 12, b) providing and placing at least one heating element 17 which is or can be optionally connected electrically to conductor paths 13, 14 at the or each site 12, and c) at least partial covering of each site 12 with a sealing material 18 for the formation of a partial sheathing 19 for each formed vaporizer unit 10, wherein sealing material 18 is applied in such a manner that sheathing 19 formed from sealing material 18 covers each heating element 17 while keeping open a heating surface 20 at least on an upper side O of flexible circuit board material 11 at least in the edge region of the heating element 17, and at least the outer surfaces of sheathing 19 facing away from circuit board material 11 and/or heating element 17 form sealing surfaces 21.
The terms each or the or each site 12 also expressly encompass that, for example, only every second site 12 or only fault-free sites 12 are processed. Each desired or selected site 12 or site 12 to be produced is therefore meant. In the ideal case, in actual fact all sites 12 should be processed without exception for particularly high efficiency. In step a), the provision of circuit board material 11 can be performed in a different manner (see in this regard further below). Circuit board material 11 can already be provided in a pre-structured manner or still be pre-structured after the provision and prior to further processing, i.e., in the production process of vaporizer units 10. In step b), heating element 17 can already be connected, e.g., for the case that heating element 17 is a film heater, while heating element 17 can still be connected in the production method, e.g., for the case that heating element 17 is a silicon chip. The or each heating element 17 can be arranged on both sides of circuit board material 11, e.g., only on the upper side or only on the lower side, wherein the upper side and lower side are ultimately exchangeable since assignment is dependent on how circuit board material 11 is ultimately retained/transported or the vaporizer unit 10 formed thereon is ultimately mounted, or on both sides with a through-contacting. In the edge region 17.1 means that heating element 17 is sealed off circumferentially in such a manner that a fluid connection between upper side O and lower side U of circuit board material 11 adjacent to heating surface 20 is ruled out. An exemplary circumferential edge region 17.1 is schematically represented by a dotted line in
Flexible circuit board material 11 as a substrate can be, e.g., a single-web belt 11.1 (also referred to below as a continuous belt) (see in particular
In addition to the transport-related pre-punched areas/recesses 15, circuit board material 11 can at each site 12 of a vaporizer unit 10 have further pre-punched areas 16, i.e. recesses or openings, and indeed in particular in such cases in which heating elements 17 to be fitted separately are used for vaporizer units 10. In these cases, pre-punched areas 16 at each site 12 serve as a passage opening 41 to enable a connection between a supply tank and an air flow channel via vaporizer unit 10, which is discussed in detail further below. For the case that heating element 17, e.g., as a film heater, is an integral component of circuit board material 11, a region 92 of a micro-structuring can optionally be provided which is formed in a liquid-permeable manner. Further pre-punched areas 24 serve to allow sealing material 18 to flow from the upper side to the lower side or vice versa. Pre-punched areas 24 can also serve to already pre-detach vaporizer unit 10 in portions from circuit board material 11.
Each site 12 also comprises at least two conductor paths 13, 14 for electric contacting of heating element 17. Both conductor paths 13, 14 and pre-punched areas 15, 16 which are assigned to circuit board material 11 at the or each side edge 22, 23 and each site 12 are pre-structured in such a manner that they are adapted to a predefined structure/a predefined layout of conductor paths 13, 14 and pre-punched areas 15, 16, 24 in a manner corresponding to vaporizer units 10 to be produced. Ultimately, the number of sites 12 on a continuous belt 11.1 can be as desired and vary in terms of arrangement/pattern, just as the layouts of sites 12 can vary. Preferably, however, all sites 12 on a continuous belt 11.1 are formed to be identical.
For the case that circuit board material 11 at each site 12 comprises a heating element 17 integrated into circuit board material 11 for the formation of a heating surface 20 (see, e.g.,
Steps a) and b) can be performed consecutively for the case that heating element 17 is not formed integrally with circuit board material 11 (see further below in this regard) so that at least a three-step method emerges in combination with step c). In the latter case, the fitting of each site 12 with at least one heating element 17 is performed, e.g., by means of an SMT pick-and-place machine, from upper side O of circuit board material 11 (see representation according to
The method steps described below represent preferred embodiments seen on their own and in combination with one another. It is expressly pointed out that further developments and method steps which are summarised in the claims and/or the description and/or the drawing or are described in a joint embodiment, can also functionally independently further develop the method and the components which arise from this.
Preferably, in step a), flexible circuit board material 11 is provided, see, e.g.,
Circuit board material 11 can be differently pre-structured in terms of additional site 101 for RFID chip 102 and its electric connection or wireless connection. Conductor paths 13, 14 for heating element 17 can form RFID antennae 105 as a coil. Optionally, however, separate conductor paths 103, 104 form the coil as an RFID antenna 105. Several conductor paths can also be pre-structured in order to form on one hand a receiving antenna (receiving coil) and on the other hand a transmission antenna (transmission coil). Communication between RFID antenna and RFID chip can be performed electrically or via electromagnetic coupling, just like the voltage supply of the RFID chip. The pre-structured RFID antennae can be arranged and formed preferably in parallel planes to one another and at a small distance. Flexible circuit board material 11 is particularly preferably optionally pre-structured at least with conductor paths and pre-punched areas predetermined in terms of position and/or course for each site 101 for electronic connection of at least RFID chip 102.
RFID chip 102 can be an integral component of pre-structured circuit board material 11. In the event that RFID chip 102 is a separate component, an RFID chip 102 is provided and placed at each site 101 in a step k), which can correspond to step h) described further below and which can be performed before, with or after step b). RFID chip 102 which is optionally connected or connectable electrically to conductor paths 103, 104 is preferably provided and placed, wherein RFID chip 102 is optionally connected or connectable at each site 101 to conductor paths which form RFID antenna 105, and indeed electrically or via electromagnetic coupling.
Moreover, the method steps described previously in conjunction with heating element 17 correspondingly apply for RFID chip 102 and RFID antenna 105. Site 101 for RFID chip 102 is optionally also covered with sealing material 18 while forming sealing surfaces in step c) additionally for partially covering each site 12 for heating element 17. In other words, RFID chip 102 is protected from the surroundings by sealing material 18.
As already indicated, the provision of flexible circuit board material 11 in step a) can optionally be carried out by rolling out circuit board material 11 stored or supplied on rolls or by supplying portions of circuit board material 11 stored in magazines or the like.
Preferably, in step c) each site 12, 101 is at least partially enclosed with sealing material 18 in such a manner such that sealing surfaces 21 for an existing connection free of additional sealants to the components of inhaler 100 surrounding vaporizer unit 10 (see further below in the regard) are formed additionally both on upper side O and on a lower side U, opposite upper side O, of flexible circuit board material 11 on the outer surfaces of sheathing 19. In other words, the enclosing of each site 12, 101 is performed from both sides of continuous belt 11.1, e.g., by overmoulding from upper side O and lower side U or by overmoulding exclusively from upper side O, wherein sealing material 18 travels through pre-punched areas 24 at each site 12, 101 to lower side U. Sealing surfaces 21 are preferably partially or completely defined and formed to be reproducible. By way of example,
In the case already indicated further above that heating element 17 is not an integral component of circuit board material 11, but rather circuit board material 11 is to be fitted separately with each heating element 17, step b) comprises: as step b1) the application of electric contacting material 25 at least on contact surfaces 26 of conductor paths 13, 14 (see representation according to
In the event that RFID chip 102 is to be fitted separately, step k) comprises: as step k1) the application of electric contacting material 25 at least on contact surfaces of conductor paths at each site 101 on upper side O of flexible circuit board material 11; as step k2) the placing of the at least one RFID chip 102 in the region of each site 101; and as step k3) the formation of an electric connection between RFID chip 102 and conductor paths at each site 101. As already described further above, the electric contacting material can in step k1) also optionally be applied directly onto the contacts of the RFID chip, wherein the RFID chip prepared in such a manner is then placed onto site 101.
The method is described above for the case that heating element 17 is placed and connected on the upper side of circuit board material 11. A placing and a connection on the lower side is also optionally and correspondingly possible. It is also possible that heating element 17 is placed on the upper side, wherein the electric contacts, i.e. e.g. conductor paths 13, 14 are arranged on the lower side. Pre-punched areas 24 in the region of the electric contacts of heating element 17 connect the upper side and the lower side so that contacting material 25 is applied in the region of pre-punched areas 24 which after step b3) produces a connection between heating element 17 on the upper side and conductor paths 13, 14 on the lower side. The same applies to each RFID chip 102.
The below numbering of steps d) to h) and k) does not represent an obligatory sequence of the steps. On the contrary, steps d) to h) and k) can be performed quasi as desired in terms of their sequence. Step k) is particularly preferably carried out directly before or after step b).
After step c), continuous belt 11.1 can, for example, be rolled up again in order to be able to use a roll-to-roll process for the production of vaporizer units 10. This means that initially in step a) a roll with rolled-up flexible circuit board material 11 is provided. Subsequently, a number of vaporizer units 10 are mapped thereon in steps b) and c). Finally, flexible circuit board material 11 can be rolled up again in a step e) for further use, for example, for transport, for storage or the like. If portions of circuit board material 11 are processed, these can, e.g., in step e), be supplied back to a magazine or the like for further use.
When covering or enclosing sites 12 with sealing material 18, due to the process, what are known as sprue points are generated, i.e. material webs which arise during moulding, spraying or other processing of sealing material 18. Preferably, after step c) the sprue portions of sealing material 18 which arise during covering or enclosing of the sites with sealing material are removed in a step d). Removal can also be performed later, e.g., when separating out individual vaporizer units 10. Renewed rolling up can, as mentioned, be performed, e.g. after step c) and optionally subsequently after each further step. Rolling up can optionally even already be performed after step b). Circuit board material 11 provided with the plurality of completed, sealing vaporizer units 10 free from sprue portions can correspondingly preferably be rolled up for the first time or again in step e) onto a roll for further use. The same applies in the case of use of portions of circuit board material 11 in magazines or the like.
Produced, sealing vaporizer units 10, which are, i.e., provided with sealing surfaces 21 and which are sealing in combination or by mounting with other components of inhaler 100 without additional sealant, are isolated from flexible circuit board material 11 for further use in a step f). For the purpose of isolation, rolled-up circuit board material 11 provided with vaporizer units 10 can be rolled out again at a later point in time, for example, at a mounting site for vaporizer units 10. Isolation can be performed, e.g., by punching, cutting or the like. Isolation can also be performed directly after step d) in order to produce, e.g., trayware or bulkware.
In order to complete each vaporizer unit 10, in a step g) at least one wick element 27 (e.g.,
Optionally, in a step h), which can correspond to step k), preferably together with step b2) or k2), at least one additional electronic component can be placed in the region of each site 12. Step h) can, however, also be carried out before or after step b2) or k2). Prior to step h), preferably together with step b1 and k1), contacting material 25 is applied on contact surfaces 26 of conductor paths 13, 14 at each site 12 on upper side O and/or lower side U of flexible circuit board material 11, and after step h), preferably together with step b3) or k3), an electric connection is formed between the or each additional electronic component and conductor paths 13, 14 at each site 12. This can involve conductor paths 13, 14 of heating element 17. The electronic components can, however, also be contacted electrically at/on separate conductor paths. The electronic components can be placed on the side of heating element 17 and/or on the opposite side. The or each additional electronic component, e.g., ID chips, sensors or other electronic components, can be partially or completely covered or enclosed by sealing material 18. This can be carried out, e.g., in step c). It is also possible that the electronic components are entirely or partially sheathed in a separate step by the same sealing material 18 or a different material.
Each heating element 17 and/or each RFID chip 102 and/or each additional electronic component, in particular each ID chip, is connected electrically to conductor paths 13, 14, or other contacting surfaces of circuit board material 11 as a result of the use of one or more methods from the list (not exhaustive): direct contacting by means of silver sintering, eutectic bonding, conductive gluing, anisotropically conductive gluing, KlettWelding, KlettSintering, soldering, welding. In particular, the RFID chips and other electronic components can optionally also be connected by means of wire bonding to conductor paths 13, 14 of circuit board material 11. For this purpose, the electronic components (RFID chip etc.) are fixed with a non-conductive adhesive on of circuit board material 11 and then connected.
In a further development of the method, e.g., in step c), at least preferably web-like portions 29 (see, e.g.,
At least steps a) to c) are carried out consecutively in each case at a separate or the same production station of a production line 33 in such a manner that, in the case of each step at each production station 34 to 39, a plurality of sites 12, 101 are or can be simultaneously processed. There is, for example, the option that sintering for producing the electric connection and the enclosing with sealing material 18 are performed in/at a production station. This simultaneously means within the meaning of the invention that the same steps are carried out at several sites 12, 101 or that several/different steps are carried out at several sites 12, 101. The entire production process of vaporizer units 10 is, however, particularly preferably carried out in a joint production line 33 with several production stations 34 to 39. An exemplary production line 33 is indicated schematically in
Process sequences/step sequences which are preferred purely by way of example are described below. Circuit board material 11 is provided on rolls. Circuit board material 11 is unwound on a first production line 33. By means of stencil printing, circuit board material 11 is printed with a sinter paste at the positions at which heating elements 17 are later placed. After inspecting the print image, heating elements 17 are placed by means of an SMT placer, i.e., a pick-and-place apparatus. Circuit board material 11 is subsequently dried with a hot plate from below. Sintering is performed with hot stamps from above on the same plate. Finally, fitted circuit board material 11 is rolled up again.
At a further production line 33 with a corresponding structure or the same production line 33, where applicable, with adapted programmes for printing and placing at least one RFID chip, the above sequence of steps can be repeated so that circuit board material 11 fitted with heating elements 17 and RFID chips 102 is then provided in a rolled-out state.
Circuit board material 11 prepared and fitted in such a manner can then be further processed on a further production line which is preferably separate as a result of lower capacities, wherein the or each additional production line is formed as a FAM line (Film-Assisted-Molding). Prefabricated circuit board material 11 can be rolled out in the FAM line or FAM apparatus. After rolling out, connection points/sites including heating elements 17 and RFID chips 102 are sheathed with silicon. After the separation of the sprue residues, circuit board material 11 is rolled up again.
This process sequence only represents a selected example which can be varied almost as desired.
Isolated vaporizer units 10 are produced (see, e.g.,
In all of the embodiments described here of a vaporizer unit 10, electric contacting, i.e., electric connection, of heating element 17 to conductor paths 13, 14 can be performed directly or indirectly. In the case of direct contacting, at least a part of conductor paths 13, 14 which should be or is contacted electrically to heating element 17 is arranged on the same side of circuit board portion 40 as heating element 17. Electric contacting is performed in this case via the methods described here in conjunction with the invention. In the case of indirect contacting, the part of conductor paths 13, 14 which should be or is contacted electrically to heating element 17 is arranged on the side of circuit board portion 40 which is opposite the side on which heating element 17 is or is supposed to be arranged. In this case, an electric contacting, i.e., connection of the electric contacts, of heating element 17 to conductor paths 13, 14 is performed through circuit board portion 40. These contacts are correspondingly not shown or not visible in the represented exemplary embodiment.
In order to produce the contacting, one or more openings can be provided in circuit board portion 40, in which one or more openings electrically conductive material is arranged which produces the electric connection between heating element 17 and conductor paths 13, 14. Alternatively, electric connections which are continuous from one to the other side, i.e., from upper side O to lower side U of circuit board material 11, can already be provided during the prefabrication of circuit board material 11 so that contacts points are present on the side opposite conductor paths 13, 14, to which contact points heating element 17 can be electrically connected. In this case too, electric contacting is performed via the methods described here in conjunction with the invention.
In one preferred embodiment, circuit board portion 40 comprises at least one RFID chip 102 and at least one RFID antenna 105. RFID antenna 105 can be formed by windings of heating element 17. The or each RFID antenna 105 is preferably formed by separate conductor paths 103, 104. RFID antenna 105 and heating element 17 can be arranged or formed on the same side of circuit board portion 40 or on opposite sides. RFID antenna 105 can preferably be arranged on circuit board portion 40 in such a manner that it encloses heating element 17 in the plane of circuit board portion 40 in an inner region enclosed by it. The location and/or position of RFID chip 102, the number of RFID chips 102, as well as the location and/or position and/or alignment of the or each RFID antenna 105 in relation to heating element 17 can vary. The transmission of data is optionally performed wirelessly. To this end, e.g., RFID chip 102 can contain an antenna.
Circuit board portion 40 of vaporizer unit 10 is preferably formed from polyimide, wherein other flexible substrate materials can also be used. A doped silicon chip is particularly preferably connected as heating element 17 by direct contacting by means of silver sintering electrically to conductor paths 13, 14. Other components, in particular MEMS components (Micro-electro-mechanical components) which are composed substantially from silicon or which have silicon or p- or n-doped silicon and which are liquid-permeable, can also be used as heating element 17. In particular, what are known as film vaporizers/film heaters can also be used as heating element 17. Circuit board portion 40 as well as a silicon chip are at least partially enclosed by silicon or polyimide so that on one hand the silicon chip is mechanically retained and on the other hand sealing surfaces 21 preferably defined towards the outside are formed. Instead of silicones, other materials which can be processed in particular using the Film-Assisted-Moulding method and which act in a sealing manner in the processed state can also be used. Examples of further active ingredients which can be processed using the Film-Assisted-Moulding method are polyimide or plastics.
In one preferred further development, a portion of conductor paths 13, 14 embedded in flexible circuit board material 11 projects in a bendable manner out of sheathing 19 formed by sealing material 18 for the formation of flex contacting 43. A space-saving contacting possibility of conductor paths 13, 14 can be generated by bending the projecting portion, for example, by 90°.
Vaporizer unit 10 is particularly preferably produced with a method described herein. The or each vaporizer unit 10 can be stored on a roll or a magazine or be used, stored and employed as an individual part, exchange part, replacement part or the like. Vaporizer unit 10 is preferably, however, a constituent part of a vaporizer assembly 44 which itself is a component part of an inhaler 100. Vaporizer assembly 44 comprises a vaporizer unit 10, preferably according to one or more of claims 24 to 30, as well as an adapter plug 45, into which vaporizer unit 10 can be plugged and is also plugged in the functional state, i.e., in a mounted state, wherein vaporizer unit 10 or its sheathing 19 bears at least partially with an outer surface of sheathing 19, i.e., sealing surfaces 21, at least partially in a sealing manner against an inner geometry of adapter plug 45. A sealing unit, in the case of which there is a fluid connection only via the path opening 47 in adapter plug 45—wick element 27—heating element 17—passage opening 41—opening 48 is already produced by the mounting which includes a simple pushing in of vaporizer unit 10 into adapter plug 45. In other words, a liquid in supply tank 62 of a vaporizer cartridge 59 can only travel via the above-mentioned path into the portion of air flow channel 50 and further into air flow channel 30 (after previous vaporisation at or in heating element 17).
A preferred embodiment of a vaporizer assembly 44 is represented in
Vaporizer unit 10 can, however, also be connected in another manner in a positive and/or non-positive sealing manner to adapter plug 45. Sealing material 18 of sheathing 19 of a vaporizer unit 10 from
Vaporizer assembly 44 comprises at least one portion 50 of an air flow channel 30 which is formed by vaporizer unit 10 and/or adapter plug 45. In
Said tube portion 31 and/or portion 50 of air flow channel 30 can be coupled to further portions of air flow channel 30 of inhaler 100 for the formation of a continuous vent in inhaler 100 (see further below in this regard). In the event that tube portion 31 with second sealing material 32 is fixed on vaporizer unit 10, e.g., two circumferential seal contours 56, 57—similar to an O-ring—can be formed from second sealing material 32 in such a manner that vaporizer unit 10 with tube portion 31 is inserted in a directly sealing manner into a portion 58 of air flow channel 30 of a vaporizer cartridge 59 for the formation of a vent 60, wherein the internal diameter of portion 58 is at least partially or in portions larger than the external diameter of vaporizer unit 10 including linked tube portion 31 (see in particular
Vaporizer assembly 44 or vaporizer unit 10 is correspondingly preferably a component of a vaporizer cartridge 59 (see in particular
In the case of the embodiment according to
The invention furthermore relates to an inhaler 100, formed and configured for inhaling vapour/aerosol enriched with active ingredients and/or flavourings, which comprises at least one electronic control unit 64 and cartridge carriers 66 comprising an energy source 65 as well as a vaporizer cartridge 44, such as shown in
Vaporizer unit 10 or vaporizer assembly 44 according to the invention can, however, also be a component of an inhaler 100 in the case of which vaporizer unit 10 or vaporizer assembly 44 is arranged outside vaporizer cartridge 59 so that vaporizer assembly 44 is a fixed component of cartridge carrier 66, and correspondingly forms a multi-use item. Cartridge carrier 66, vaporizer assembly 44 and a vaporizer cartridge 59 only comprising hollow body 61 and/or supply tank 62 are optionally connected exchangeably with one another at different intervals.
Those of skill in the art will recognize that the embodiments discussed and illustrated herein may be altered in various ways without departing from the scope or teaching of the present invention. It is the following claims, including all equivalents, which define the scope of the invention.
| Number | Date | Country | Kind |
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| 102019135177.4 | Dec 2019 | DE | national |
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| 2018019486 | Feb 2018 | WO |
| 2018219584 | Dec 2018 | WO |
| 2019127643 | Jul 2019 | WO |
| Number | Date | Country | |
|---|---|---|---|
| 20210186116 A1 | Jun 2021 | US |
