This application is related to concurrently-filed U.S. patent application Ser. No. 17/739,595, filed in the name of Tigran Poghosyan, Anthony Oliveti, Gabe Calebotta, and Kirkwood Rough, and entitled “DIELECTRIC FLUID VARIABLE CAPACITOR,” which application is hereby incorporated by reference herein for all purposes, including right of priority in the United States and all foreign jurisdictions.
Variable capacitors are used in a variety of applications, particularly those involving high frequency, high power signals. Variable capacitors may be utilized, for example, in oscillation circuits for high-power radio transmission, high-frequency power supplies for semiconductor manufacturing equipment, and impedance matching networks in which the impedance of a time-dependent, high-frequency load is to be matched with that of a generator.
A capacitor consists essentially of two spaced-apart capacitor plates with an insulator or dielectric material disposed between the capacitor plates. As used herein, the terms “dielectric,” “dielectric material” and “dielectric medium” are interchangeably used to refer to a material (i.e., solid, liquid, or gas) which is polarizable in the presence of an electric field, typically expressed in terms of the material's electrical susceptibility x.
In a vacuum variable capacitor, the two capacitor plates are maintained in a high vacuum, (e.g., 10−6 Torr or less) which serves as the capacitor's dielectric, having a susceptibility χ≈0. In some vacuum variable capacitors, the capacitor plates may be configured as a plurality of interdigitated, concentric cylindrical coil plates, and the variability of capacitance may be achieved through physically adjusting the length of overlapping in the interdigitation.
The present disclosure is best understood from the following detailed description when read with the accompanying figures, wherein:
It is emphasized that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion or illustration.
Illustrative examples of the subject matter claimed below are disclosed. In the interest of clarity, not all features of an actual implementation are described for every example in this specification. It will be appreciated that in the development of any such actual implementation, numerous implementation-specific decisions may be made to achieve the developers' specific goals, such as compliance with system-related and business-related constraints, which will vary from one implementation to another. Moreover, it will be appreciated that such a development effort, even if complex and time-consuming, would be a routine undertaking for those of ordinary skill in the art having the benefit of this disclosure.
The expressions such as “include” and “may include” which may be used in the present disclosure denote the presence of the disclosed functions, operations, and constituent elements, and do not limit the presence of one or more additional functions, operations, and constituent elements. In the present disclosure, terms such as “include” and/or “have”, may be construed to denote a certain characteristic, number, operation, constituent element, component or a combination thereof, but should not be construed to exclude the existence of or a possibility of the addition of one or more other characteristics, numbers, operations, constituent elements, components or combinations thereof.
As used herein, the article “a” is intended to have its ordinary meaning in the patent arts, namely “one or more.” Herein, the term “about” when applied to a value generally means within the tolerance range of the equipment used to produce the value, or in some examples, means plus or minus 10%, or plus or minus 5%, or plus or minus 1%, unless otherwise expressly specified. Further, herein the term “substantially” as used herein means a majority, or almost all, or all, or an amount with a range of about 51% to about 100%, for example. Moreover, examples herein are intended to be illustrative only and are presented for discussion purposes and not by way of limitation.
As used herein, to “provide” an item means to have possession of and/or control over the item. This may include, for example, forming (or assembling) some or all of the item from its constituent materials and/or, obtaining possession of and/or control over an already-formed item.
Unless otherwise defined, all terms including technical and/or scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure pertains. In addition, unless otherwise defined, all terms defined in generally used dictionaries may not be overly interpreted.
The subject matter described herein is directed to examples of vacuum variable capacitors as well as vacuum variable capacitors incorporating a liquid dielectric material between capacitor plates. In the latter examples, the liquid dielectric material may increase the effective maximum capacitance of the variable capacitor for a given capacitor plate geometry. The liquid dielectric material may further increase the electrical breakdown voltage of the capacitor for a given capacitor plate geometry. The liquid dielectric material may further provide for additional dissipation of thermal energy within the variable capacitor relative to, for example, a vacuum capacitor, owing to the potential of a liquid dielectric having a greater thermal conductivity than a vacuum.
An upper end of an actuator 114 extends out of actuator end cap 104. In some examples, actuator 114 may threaded, and may be rotated to advance and retract a movable capacitor assembly within enclosure 102. In other examples, actuator 114 may be advanced and retracted by means of a linear motor, an electromagnetic coil arrangement, or hydraulic or pneumatic systems. In examples, a first conductive mounting plate 116 may be provided in electrical contact with first conductive collar 106 to facilitate physical installation of vacuum variable capacitor 100 in operating environments. First conductive mounting plate 116 may further provide an external electrical connection to vacuum variable capacitor 100 as herein described. Vacuum variable capacitor 100 may further include a second conductive mounting plate 119 in electrical contact with conductive collar 108 to further facilitate installation of vacuum variable capacitor in operating environments.
In examples, first and second capacitor plate assemblies 118 and 120 are configured such that first mounting plate 126 and bottom portion 132 of second collar 108 may be positioned relative to each other to enable first capacitor plate 122 to at least partially concentrically interdigitate with second capacitor plate 128. In examples, first capacitor plate 122 and second capacitor plate 128 do not contact each other directly, although the spacing between first mounting plate 126 and bottom portion 132 of second collar 108 may be adjusted, as described herein, to vary the length of concentric, overlapping interdigitation between first capacitor plate 122 and second capacitor plate 128, thereby adjusting the effective capacitance established between first capacitor plate 122 and second capacitor plate 128. In examples, first and second capacitor plates 122 and 128 may be made of materials (e.g., oxygen-free copper or copper-plated brass) conventionally used for such structures in a vacuum variable capacitor.
With continued reference to
As shown in
With continued reference to
A second volume 160 is defined within enclosure 102. (Again, multiple reference numerals 160 appear in
In examples, first volume 158 may be at or near external, atmospheric pressure, due to a possibly nominal seal between actuator 114 and gaskets 150 as actuator enters actuator end cap 104. On the other hand, second volume 160 is hermetically (i.e., vacuum- and liquid-tight) sealed, due to sealed attachment of flexible structure 134 to first collar 106 and to first mounting plate 126, such as by brazing.
According to the present examples, the extent of interdigitated overlapping of first capacitor plate 122 and second capacitor plate 128, and hence the capacitive performance of vacuum variable capacitor, may be adjusted through rotation of actuator 114. Rotation of actuator 114, such as by a stepper motor or servo-motor (not shown) causes threads of actuator 114 to raise or lower thrust collar 154 and extended coupling 156, thereby raising or lowering first mounting plate 126 relative to second mounting plate 132. That is, in these examples, first mounting plate 126, carrying first capacitor plate assembly 118, is movable with respect to bottom portion 132 of second collar 108, carrying second capacitor plate assembly 120.
With reference specifically to
In examples, first mounting plate 126, flexible structure 134, extended coupling 156, thrust collar 154, and mounting plate 116 are conductive (e.g., metallic) and provide a low-resistance electrical conduction path between first electrode 124, first collar 106, and mounting plate 116, which may serve as a first external electrical contact for vacuum variable capacitor 100. Second electrode 130 is coupled to bottom portion 132 of second collar 108, and to bottom conductive plate 119 which may be integral with (or electrically coupled to) second collar 108, thereby enabling second collar 108 and bottom conductive plate 119 to serve as a second electrical connection to vacuum variable capacitor 100. To facilitate attachment of an electrode plate, a threaded socket 170 may be provided in second collar 108.
Like capacitor plate 128 in the example of
With reference specifically to
Like capacitor plate 128 in the example of
With reference specifically to
Like capacitor plate 128 in the example of
With reference specifically to
In the example of
With reference specifically to
In the various examples herein, the geometries of the capacitor plates in the respective capacitor plate assemblies may achieve improved performance with respect to the variation in impedance of the capacitors across a range of variable capacitance. This, in turn, improves the tuning behavior of the variable capacitors, particularly when utilized in RF matching networks. Capacitors having capacitor plates of non-consistent height, as disclosed in various examples herein, and/or having profiles varying along a radius (such as the example of
In examples, using a control algorithm for adjustment of the variable capacitance, a consistent tuning behavior may be achieved as the element being controlled has a more linear change in impedance as capacitance is varied. Furthermore, in various examples herein, where the heights of the capacitor plates is varied through the radius, the gap between capacitor plates can be varied along the radius in the same way, such that the effective voltage rating may increase as the variable capacitors are adjusted from maximum to minimum capacitance. This may increase the effective voltage of the variable capacitors in the various examples described herein, as the current rating is primarily a function of the real component of the load impedance, not the reactive component.
For example,
On the other hand,
Further,
One or more vacuum variable capacitors such as the vacuum variable capacitors from the examples of
Radio frequency processing devices may include a radio frequency generator that transmits a signal to a plasma reaction chamber. A radio frequency matching device, which may have a variable impedance, may be located between the radio frequency generator and the plasma reaction chamber. The radio frequency matching device may be controlled, or otherwise tuned by varying the impedance of the radio frequency matching device. Tuning the radio frequency matching device reduces reflected power from the plasma reaction chamber and/or the radio frequency matching device, which may increase power that is transferred from the radio frequency generator to the plasma reaction chamber and into the plasma process. During operation, a radio frequency generator may be energized to form a plasma within a reaction chamber. The plasma may be produced after a source gas is injected into the reaction chamber and power is supplied within the reaction chamber by the radio frequency generator.
Under certain conditions, the power that is supplied to the reaction chamber may be reflected back from the reaction chamber. One cause of the reflected power may be a mismatch in the characteristic impedance of the system and the load formed by the plasma within the reaction chamber. To help prevent reflected power, a matching network may be disposed between the radio frequency generator and the reaction chamber. Such matching networks may include a number of variable capacitors or other impedance elements. The variable capacitors may be tuned so that the complex load impedance within the reaction chamber matches the impedance of the radio frequency generator.
While multiple methods of controlling or otherwise tuning matching networks have been used, such methods may not reliably and efficiently result in impedance matching. Matching networks may include stepper motors, which have a specific number of steps that are a function unique to a particular stepper motor. During operation, a capacitor may be driven by a motor that has a range between zero and one hundred percent and the motor may, as a result, have a number of clicks. Embodiments of the present disclosure may provide recipes and/or otherwise allow for the adjustment of a capacitor position based, at least in part, on “a steps to percent ratio.”
Turning to
In the example of
Splitter branch 604 receives RF power from matching branch 1802, which, splits the received RF power between a fourth variable capacitor 1816 and a fifth variable capacitor 1818. Fourth variable capacitor 616 and fifth variable capacitor 1818 may also be variable capacitors such as that disclosed herein with reference to
Fifth variable capacitor 1818 is connected to an inner coil 1820. Between fifth variable capacitor 1818 and inner coil 1820, one or more sensors 1822 may be disposed. Sensor(s) 1822 may be used to measure, for example, voltage between fifth variable capacitor 1818 and ground. Similarly, fourth variable capacitor 1816 is connected to an outer coil 1824. Between fourth variable capacitor 1816 and outer coil 1824, one or more sensors 1826 may be disposed. Sensors 1826 may be used to measure, for example, voltage between fourth variable capacitor 1816 and ground.
Inner coil 1820 may further be connected to a ground and outer coil 1824 may be connected to circuitry that includes a sensor 1828 and a sixth capacitor 1830. Sensor 1828 may be used to measure, for example, voltage between outer coil 1824 and ground. Inner coil 1820 and outer coil 1824 may be located outside of the matching network 1800 circuitry, as indicated by dashed line 1832 in
The circuitry illustrated in
The circuitry, which in one embodiment may be employed in matching network 200 as a current split ratio matching network, may be controlled using a programmable logic controller (not shown), which may be disposed in or otherwise connected to matching network 1800.
The foregoing description, for purposes of explanation, uses specific nomenclature to provide a thorough understanding of the disclosure. However, it will be apparent to one skilled in the art that the specific details are not required in order to practice the systems and methods described herein. The foregoing descriptions of specific examples are presented for purposes of illustration and description. Examples herein are not intended to be exhaustive of or to limit this disclosure to the precise forms described. Many modifications and variations are possible in view of the above teachings. The examples are shown and described in order to best explain the principles of this disclosure and practical applications, to thereby enable others skilled in the art to best utilize this disclosure and various examples with various modifications as are suited to the particular use contemplated. It is intended that the scope of this disclosure be defined by the claims and their equivalents below.
Number | Name | Date | Kind |
---|---|---|---|
4177495 | Perret | Dec 1979 | A |
4679007 | Reese et al. | Jul 1987 | A |
4953057 | Davidian | Aug 1990 | A |
5175472 | Johnson, Jr. et al. | Dec 1992 | A |
5195045 | Keane et al. | Mar 1993 | A |
5394061 | Fujii | Feb 1995 | A |
5474648 | Patrick et al. | Dec 1995 | A |
5576629 | Turner et al. | Nov 1996 | A |
5609737 | Fukui et al. | Mar 1997 | A |
5629653 | Stimson | May 1997 | A |
5737175 | Grosshart et al. | Apr 1998 | A |
5792261 | Hama et al. | Aug 1998 | A |
5810963 | Tomioka | Sep 1998 | A |
5842154 | Harnett et al. | Nov 1998 | A |
5849136 | Mintz et al. | Dec 1998 | A |
5866869 | Schneider | Feb 1999 | A |
5889252 | Williams et al. | Mar 1999 | A |
5910886 | Coleman | Jun 1999 | A |
5914974 | Partlo | Jun 1999 | A |
6016131 | Sato et al. | Jan 2000 | A |
6157179 | Miermans | Dec 2000 | A |
6164241 | Chen et al. | Dec 2000 | A |
6252354 | Collins et al. | Jun 2001 | B1 |
6313584 | Johnson et al. | Nov 2001 | B1 |
6313587 | MacLennan et al. | Nov 2001 | B1 |
6326597 | Lubomirsky et al. | Dec 2001 | B1 |
6407648 | Johnson | Jun 2002 | B1 |
6455437 | Davidow et al. | Sep 2002 | B1 |
6463875 | Chen et al. | Oct 2002 | B1 |
6507155 | Barnes et al. | Jan 2003 | B1 |
6677828 | Harnett et al. | Jan 2004 | B1 |
6703080 | Reyzelman | Mar 2004 | B2 |
6806437 | Oh | Oct 2004 | B2 |
6876155 | Howald et al. | Apr 2005 | B2 |
6894245 | Hoffman | May 2005 | B2 |
6949887 | Kirkpatrick et al. | Sep 2005 | B2 |
7030335 | Hoffman | Apr 2006 | B2 |
7042311 | Hilliker et al. | May 2006 | B1 |
7079597 | Kenwood | Jul 2006 | B1 |
7102292 | Parsons et al. | Sep 2006 | B2 |
7192505 | Roche et al. | Mar 2007 | B2 |
7196283 | Buchberger, Jr. | Mar 2007 | B2 |
7215697 | Hill et al. | May 2007 | B2 |
7220937 | Hoffman | May 2007 | B2 |
7251121 | Bhutta | Jul 2007 | B2 |
7259623 | Coleman | Aug 2007 | B2 |
7298128 | Bhutta | Nov 2007 | B2 |
7467612 | Suckewer | Dec 2008 | B2 |
7514936 | Anwar | Apr 2009 | B2 |
7795877 | Radtke | Sep 2010 | B2 |
7796368 | Kotani | Sep 2010 | B2 |
8169162 | Yuzurihara | May 2012 | B2 |
8203372 | Arduini | Jun 2012 | B2 |
8222822 | Gilbert | Jul 2012 | B2 |
8421377 | Kirchmeier | Apr 2013 | B2 |
8466622 | Knaus | Jun 2013 | B2 |
8471746 | Kurunezi et al. | Jun 2013 | B2 |
8491759 | Pipitone et al. | Jul 2013 | B2 |
8742669 | Carter et al. | Jun 2014 | B2 |
8779662 | Boston | Jul 2014 | B2 |
8803424 | Boston | Aug 2014 | B2 |
8884180 | Ilie | Nov 2014 | B2 |
8896391 | du Toit | Nov 2014 | B2 |
8928229 | Boston | Jan 2015 | B2 |
9042121 | Walde et al. | May 2015 | B2 |
9065426 | Mason et al. | Jun 2015 | B2 |
9105447 | Brouk et al. | Aug 2015 | B2 |
9111725 | Boston | Aug 2015 | B2 |
9124248 | Van Zyl et al. | Sep 2015 | B2 |
9142388 | Hoffman et al. | Sep 2015 | B2 |
9148086 | Fife et al. | Sep 2015 | B2 |
9166481 | Vinciarelli | Oct 2015 | B1 |
9171700 | Gilmore | Oct 2015 | B2 |
9196459 | Bhutta | Nov 2015 | B2 |
9208992 | Brouk et al. | Dec 2015 | B2 |
9224579 | Finley et al. | Dec 2015 | B2 |
9225299 | Mueller et al. | Dec 2015 | B2 |
9287098 | Finley et al. | Mar 2016 | B2 |
9294100 | Van Zyl et al. | Mar 2016 | B2 |
9306533 | Mavretic | Apr 2016 | B1 |
9313870 | Walde et al. | Apr 2016 | B2 |
9337804 | Mason et al. | May 2016 | B2 |
9345122 | Bhutta | May 2016 | B2 |
9385021 | Chen | Jul 2016 | B2 |
9418822 | Kaneko | Aug 2016 | B2 |
9478397 | Blackburn et al. | Oct 2016 | B2 |
9483066 | Finley et al. | Nov 2016 | B2 |
9490353 | Van Zyl et al. | Nov 2016 | B2 |
9496122 | Bhutta | Nov 2016 | B1 |
9520269 | Finley et al. | Dec 2016 | B2 |
9524854 | Hoffman et al. | Dec 2016 | B2 |
9525412 | Mavretic | Dec 2016 | B2 |
9536713 | Van Zyl et al. | Jan 2017 | B2 |
9543122 | Bhutta | Jan 2017 | B2 |
9544987 | Mueller et al. | Jan 2017 | B2 |
9558917 | Finley et al. | Jan 2017 | B2 |
9577516 | Van Zyl et al. | Feb 2017 | B1 |
9584090 | Mavretic | Feb 2017 | B2 |
9578731 | Hoffman et al. | Mar 2017 | B2 |
9591739 | Bhutta | Mar 2017 | B2 |
9589767 | Finley et al. | Apr 2017 | B2 |
9620340 | Finley et al. | Apr 2017 | B2 |
9651957 | Finley et al. | May 2017 | B1 |
9660613 | Van Zyl et al. | May 2017 | B2 |
9673028 | Walde et al. | Jun 2017 | B2 |
9697911 | Bhutta | Jul 2017 | B2 |
9711331 | Mueller et al. | Jul 2017 | B2 |
9711335 | Christie et al. | Jul 2017 | B2 |
9728378 | Bhutta et al. | Aug 2017 | B2 |
9729122 | Mavretic | Aug 2017 | B2 |
9741544 | Van Zyl et al. | Aug 2017 | B2 |
9745660 | Bhutta | Aug 2017 | B2 |
9748076 | Choi et al. | Aug 2017 | B1 |
9755641 | Bhutta | Sep 2017 | B1 |
9773644 | Van Zyl et al. | Sep 2017 | B2 |
9807863 | Van Zyl et al. | Oct 2017 | B1 |
9812305 | Pelleymounter et al. | Nov 2017 | B2 |
9844127 | Bhutta | Dec 2017 | B2 |
9852890 | Mueller et al. | Dec 2017 | B2 |
9854659 | Van Zyl et al. | Dec 2017 | B2 |
9865432 | Bhutta | Jan 2018 | B1 |
9952297 | Wang | Apr 2018 | B2 |
10008317 | Iyer | Jun 2018 | B2 |
10020752 | Vinciarelli | Jul 2018 | B1 |
10026592 | Chen | Jul 2018 | B2 |
10026594 | Bhutta | Jul 2018 | B2 |
10026595 | Choi et al. | Jul 2018 | B2 |
10074518 | Van Zyl et al. | Sep 2018 | B2 |
10139285 | Murray et al. | Nov 2018 | B2 |
10141788 | Kamstedt | Nov 2018 | B2 |
10194518 | Van Zyl et al. | Jan 2019 | B2 |
10217618 | Larson et al. | Feb 2019 | B2 |
10224184 | Van Zyl et al. | Mar 2019 | B2 |
10224186 | Polak et al. | Mar 2019 | B2 |
10263577 | Van Zyl et al. | Apr 2019 | B2 |
10269540 | Carter et al. | Apr 2019 | B1 |
10314156 | Van Zyl et al. | Jun 2019 | B2 |
10332730 | Christie et al. | Jun 2019 | B2 |
10340879 | Mavretic | Jul 2019 | B2 |
10373811 | Christie et al. | Aug 2019 | B2 |
10374070 | Wood | Aug 2019 | B2 |
10410836 | McChesney | Sep 2019 | B2 |
10411769 | Bae | Sep 2019 | B2 |
10447174 | Porter, Jr. et al. | Oct 2019 | B1 |
10469108 | Howald | Nov 2019 | B2 |
10475622 | Pankratz et al. | Nov 2019 | B2 |
11657980 | Poghosyan | May 2023 | B1 |
20030121609 | Ohmi et al. | Jul 2003 | A1 |
20030150710 | Evans et al. | Aug 2003 | A1 |
20030230984 | Kitamura et al. | Dec 2003 | A1 |
20040016402 | Walther et al. | Jan 2004 | A1 |
20040026235 | Stowell, Jr. | Feb 2004 | A1 |
20050001490 | Weiler et al. | Jan 2005 | A1 |
20050034811 | Mahoney et al. | Feb 2005 | A1 |
20050045475 | Wantanabe | Mar 2005 | A1 |
20050270805 | Yasumura | Dec 2005 | A1 |
20060005928 | Howald | Jan 2006 | A1 |
20060169582 | Brown et al. | Aug 2006 | A1 |
20060169584 | Brown et al. | Aug 2006 | A1 |
20060249729 | Mundt et al. | Nov 2006 | A1 |
20070121267 | Kotani | May 2007 | A1 |
20070222428 | Garvin et al. | Sep 2007 | A1 |
20080061793 | Anwar et al. | Mar 2008 | A1 |
20080061901 | Gilmore | Mar 2008 | A1 |
20080087381 | Shannon et al. | Apr 2008 | A1 |
20080190204 | Danel et al. | Aug 2008 | A1 |
20080197854 | Valcore et al. | Aug 2008 | A1 |
20080272875 | Huang et al. | Nov 2008 | A1 |
20080317974 | de Vries | Dec 2008 | A1 |
20090026964 | Knaus | Jan 2009 | A1 |
20090206974 | Meinke | Aug 2009 | A1 |
20100012029 | Forester et al. | Jan 2010 | A1 |
20100072172 | Ui et al. | Mar 2010 | A1 |
20100096261 | Hoffman et al. | Apr 2010 | A1 |
20100098882 | Lubomirsky et al. | Apr 2010 | A1 |
20100159120 | Dzengeleski et al. | Jun 2010 | A1 |
20110121735 | Penny | May 2011 | A1 |
20110140607 | Moore et al. | Jun 2011 | A1 |
20110148303 | Van Zyl et al. | Jun 2011 | A1 |
20110174777 | Jensen et al. | Jul 2011 | A1 |
20120097104 | Pipitone et al. | Apr 2012 | A1 |
20120097524 | Pipitone et al. | Apr 2012 | A1 |
20120145322 | Gushiken et al. | Jun 2012 | A1 |
20120164834 | Jennings et al. | Jun 2012 | A1 |
20120262064 | Nagarkatti | Oct 2012 | A1 |
20130002136 | Blackburn et al. | Jan 2013 | A1 |
20130140984 | Hirayama | Jun 2013 | A1 |
20130180964 | Ilic | Jul 2013 | A1 |
20130214683 | Valcore et al. | Aug 2013 | A1 |
20130240482 | Nam et al. | Sep 2013 | A1 |
20130278140 | Mudunuri et al. | Oct 2013 | A1 |
20130345847 | Valcore et al. | Dec 2013 | A1 |
20140225504 | Kaneko | Aug 2014 | A1 |
20140239813 | Van Zyl | Aug 2014 | A1 |
20140265911 | Kamata et al. | Sep 2014 | A1 |
20140328027 | Zhang et al. | Nov 2014 | A1 |
20140367043 | Bishara et al. | Dec 2014 | A1 |
20150002020 | Boston | Jan 2015 | A1 |
20150115797 | Yuzurihara | Apr 2015 | A1 |
20150150710 | Evans et al. | Jun 2015 | A1 |
20150313000 | Thomas et al. | Oct 2015 | A1 |
20160002020 | Orita | Jan 2016 | A1 |
20160093445 | Mildner | Mar 2016 | A1 |
20160248396 | Mavretic | Aug 2016 | A1 |
20160308560 | Howald et al. | Oct 2016 | A1 |
20170018349 | Otsubo et al. | Jan 2017 | A1 |
20170133886 | Kurs et al. | May 2017 | A1 |
20170338081 | Yamazawa | Nov 2017 | A1 |
20170345620 | Coumou et al. | Nov 2017 | A1 |
20180034446 | Wood | Jan 2018 | A1 |
20180102238 | Gu et al. | Apr 2018 | A1 |
20180261431 | Hammond, IV | Sep 2018 | A1 |
20190172683 | Mavretic | Jun 2019 | A1 |
20190199241 | Satoshi et al. | Jun 2019 | A1 |
20190385822 | Marakhtanov et al. | Dec 2019 | A1 |
Number | Date | Country |
---|---|---|
107221432 | Sep 2017 | CN |
04239211 | Aug 1992 | JP |
05284046 | Aug 1993 | JP |
2006-310245 | Jun 2008 | JP |
2010-016124 | Jan 2010 | JP |
2015-502213 | Jan 2015 | JP |
10-2006-0067957 | Jun 2006 | KR |
10-2014-0077866 | Jun 2014 | KR |
10-2017-0127724 | Nov 2017 | KR |
10-2018-0038596 | Apr 2018 | KR |
2012054305 | Apr 2012 | WO |
2012054306 | Apr 2012 | WO |
2012054307 | Apr 2012 | WO |
2016048449 | Mar 2016 | WO |
2016097730 | Jun 2016 | WO |
2019096564 | May 2019 | WO |
2019147513 | Aug 2019 | WO |
2019-244734 | Dec 2019 | WO |
Entry |
---|
PCT/US2023/066447 International Search Report and Written Opinion of the International Searching Authority, dated Sep. 12, 2023, 11 pages. |
PCT/US2018/062851—International Search Report and Written Opinion of International Searching Authority, dated Aug. 28, 2019, 10 pages. |
Stowell, et al., “RF-superimposed DC and pulsed DC sputtering for deposition of transparent conductive oxides”, Thin Solid Films 515 (2007), pp. 7654-7657. |
Bender, et al., “Characterization of a RF=dc-magnetron discharge for the sputter deposition of transparent and highly conductive ITO films”, Appl. Phys. A 69, (1999), pp. 397-409. |
Economou, Demetre J., “Fundamentals and application of ion-ion plasmas”, Applied Surface Science 253 (2007), pp. 6672-6680. |
Godyak et al., “Plasma parameter evolution in a periodically pulsed ICP”, XXVIIth, Eindhoven, the Netherlands, Jul. 18-22, 2005, 4 pages. |
Banna, et al., “Inductively Coupled Pulsed Plasmas in the Presence of Synchronous Pulsed Substrate Bias for Robust, Reliable, and Fine Conductor Etching”, IEEE Transactions on Plasma Science, vol. 37, No. 9, Sep. 2009, pp. 1730-1746. |
Kushner, Mark J., “Pulsed Plasmas as a Method to Improve Uniformity During Materials Processing”, Journal of Applied Physics, Jul. 1, 2004, vol. 96, No. 1, pp. 82-93. |
LTM Technologies, M. Haass “Synchronous Plasma Pulsing for Etch Applications”, Apr. 3, 2010 16 pages. |
PCT/US2020/038892—International Search Report and Written Opinion of the International Searching Authority, dated Oct. 6, 2020, 3 pages. |
PCT/US2020/038899—International Search Report and Written Opinion of the International Searching Authority, dated Sep. 26, 2019, 5 pages. |
PCT/US2021/012847—International Search Report and Written Opinion of the International Searching Authority, dated May 6, 2021, 11 pages. |
PCT/US2021/012849 International Search Report and Written Opinion of the International Searching Authority, dated May 10, 2021, 11 pages. |
PCT/US2021/012851 International Search Report and Written Opinion of the International Searching Authority, dated May 6, 2021, 10 pages. |
Number | Date | Country | |
---|---|---|---|
20230360858 A1 | Nov 2023 | US |