The invention is in the field of microcavity plasma devices, also known as microdischarge devices or microplasma devices.
Microcavity plasma devices produce a nonequilibrium, low temperature plasma within, and essentially confined to, a cavity having a characteristic dimension d below approximately 500 μm. This new class of plasma devices exhibits several properties that differ substantially from those of conventional, macroscopic plasma sources. Because of their small physical dimensions, microcavity plasmas normally operate at gas (or vapor) pressures considerably higher than those accessible to macroscopic devices. For example, microplasma devices with a cylindrical microcavity having a diameter of 200-300 μm (or less) are capable of operation at rare gas (as well as N2 and other gases tested to date) pressures up to and beyond one atmosphere.
Such high pressure operation is advantageous. An example advantage is that, at these higher pressures, plasma chemistry favors the formation of several families of electronically-excited molecules, including the rare gas dimers (Xe2, Kr2, Ar2, . . . ) and the rare gas-halides (such as XeCl, ArF, and Kr2F) that are known to be efficient emitters of ultraviolet (UV), vacuum ultraviolet (VUV), and visible radiation. This characteristic, in combination with the ability of microplasma devices to operate in a wide range of gases or vapors (and combinations thereof), offers emission wavelengths extending over a broad spectral range. Furthermore, operation of the plasma in the vicinity of atmospheric pressure minimizes the pressure differential across the packaging material when a microplasma device or array is sealed.
Research by the present inventors and colleagues at the University of Illinois has resulted in new microcavity plasma device structures as well as applications. As an example, semiconductor fabrication processes have been adapted to produce large arrays of microplasma devices in silicon wafers with the microcavities having the form of an inverted pyramid. Arrays with 250,000 devices, each device having an emitting aperture of 50×50 μm2, have been demonstrated with a device packing density and array filling factor of 104 cm−2 and 25%, respectively. Other microplasma devices have been fabricated in ceramic multilayer structures, photodefinable glass, and Al/Al2O3 structures.
Microcavity plasma devices developed over the past decade have a wide variety of applications. An exemplary application for a microcavity plasma device array is to a display. Since the diameter of single cylindrical microcavity plasma devices, for example, is typically less than 200-300 μm, devices or groups of devices offer a spatial resolution that is desirable for a pixel in a display. In addition, the efficiency of a microcavity plasma device can exceed that characteristic of conventional plasma display panels, such as those in high definition televisions.
Early microcavity plasma devices exhibited short lifetimes because of exposure of the electrodes to the plasma and the ensuing damage caused by sputtering. Polycrystalline silicon and tungsten electrodes extend lifetime but are more costly materials and difficult to fabricate.
Large-scale manufacturing of microcavity plasma device arrays benefits from structures and fabrication methods that reduce cost and increase reliability. Of particular interest in this regard are the electrical interconnections between devices in a large array. If the interconnect technology is difficult to implement or if the interconnect pattern is not easily reconfigurable, then manufacturing costs are increased and potential commercial applications may be restricted. Such considerations are of increasing importance as the demand rises for displays or light-emitting panels of larger area.
Previous work conducted by some of the present inventors has resulted in thin, inexpensive metal/metal oxide arrays of microcavity plasma devices. Metal/metal oxide lamps are formed from thin sheets of oxidized electrodes, are simple to manufacture and can be conveniently formed by mass production techniques such as roll-to-roll processing. In some manufacturing techniques, the arrays are formed by oxidizing a metal screen, or other thin metal sheet having cavities formed in it, and then joining the screen to a common electrode. The metal/metal oxide lamps are light, thin, and can be flexible. While individual arrays can be joined with other arrays to form larger arrays, rapidly fabricating individual arrays having radiating areas that exceed approximately 100 cm2 is challenging. As arrays become larger, avoiding stress that can reduce the flatness of the array is of increasing importance.
Eden et al. U.S. Pat. No. 7,385,350, entitled “Arrays of Microcavity Plasma Devices with Dielectric Encapsulated Electrodes,” which issued on Jun. 10, 2008, discloses arrays of microcavity plasma devices with dielectric encapsulated electrodes. A pattern of microcavities is produced in a metal foil, or the metal foil can be a pre-formed metal screen. Oxide is subsequently grown on the foil and within the microcavities (where plasma is to be produced) to protect the microcavity from the plasma and electrically isolate the foil. A second metal foil is also encapsulated with oxide and is bonded to the first encapsulated foil. A thin glass layer or vacuum packaging, for example, is able to seal the plasma medium into the array. The second electrode can be a solid sheet common electrode, which requires no particular alignment, or can be a patterned electrode, which requires alignment with the first electrode.
Preferred embodiments of the invention provide microcavity plasma lamps having a plurality of metal and metal oxide layers defining a plurality of arrays of microcavities and encapsulated thin metal electrodes. Packaging encloses the plurality of metal and metal oxide layers in plasma medium. The metal and metal oxide layers are configured and arranged to vary the electric field strength and total gas pressure (E/p) in the lamp. The invention also provides methods of manufacturing a microcavity plasma lamp that simultaneously evacuate the volume within the packaging and a volume surrounding the packaging to maintain an insignificant or zero pressure differential across the packaging. The packaging is backfilled with a plasma medium while also maintaining an insignificant or zero pressure differential across the packaging.
Preferred embodiments of the invention provide microcavity plasma lamps having a plurality of metal and metal oxide layers defining a plurality of arrays of microcavities and encapsulated thin metal electrodes. Packaging encloses the plurality of metal and metal oxide layers in plasma medium. The metal and metal oxide layers are configured and arranged to vary the electric field strength and total gas pressure (E/p) in the lamp. The invention also provides methods of manufacturing a microcavity plasma lamp that simultaneously evacuate the volume within the packaging and a volume surrounding the packaging to maintain an insignificant or zero pressure differential across the packaging. The packaging is backfilled with a plasma medium while also maintaining an insignificant or zero pressure differential across the packaging.
The invention provides high efficiency arrays of microcavity plasma devices including plural thin sheets of metal/metal oxide electrodes with associated microcavities. Arrays of the invention produce emissions from both the front and back sides of the array, and are especially well-suited for general lighting applications that can benefit greatly from high efficiency performance.
Preferred embodiments will now be discussed with respect to the drawings. The drawings include schematic figures that are not to scale, which will be fully understood by skilled artisans with reference to the accompanying description. Features may be exaggerated for purposes of illustration. From the preferred embodiments, artisans will recognize broader aspects of the invention.
Other methods of coating thin screens or foils having microcavities can also be used, but the anodization process is a simple and preferred method for manufacturing metal/metal oxide electrode layers 13a and 13b.
Metal electrodes 16, 18 are encapsulated in metal oxide 17 as a result of the anodization, which protects the electrodes 16, 18 from plasma produced within the microcavities 12, thereby promoting the lifetime of the array 10, and electrically insulating the electrodes 16, 18. The intentional staggering of the microcavities 12 in the lamp 10 provides an advantage in terms of efficiency by varying the ratio of the electric field strength and total gas pressure (E/p, where E is the electric field strength and p is the total gas pressure) in a periodic manner throughout the lamp. The suspension of the sheets 13a and 13b permits small microplasmas to form above and below the sheets 13a and 13b in addition to forming in the microcavities 12. The small micro plasmas that form above and below the sheets 13a and 13b also have an E/p that is different from that in the microcavities. This permits design flexibility in varying E/p (accomplished by selecting gaps and offsets) which is a valuable mechanism (by which radiative efficiency of the lamp 10 can be optimized. Gaps 15a between electrodes 13a and 13b are capable of producing plasma that efficiently generates ultraviolet light. The gap between layers 13a and 13b can be maintained without spacers when the layers 13a and 13b have sufficient stiffness to be supported in a stable fashion when supported solely at one end. Alternatively, small dielectric, (e.g., glass) spacers (not shown in
Gas(es), vapor(s) or a combination thereof are sealed in the microcavities 12 by packaging layers 20, such as glass or plastic. The packaging layers are spaced apart and sealed by spacers 22, by which the gaps 15a and 15b are set and by which the metal oxide layers 13a and 13b are suspended from their ends. A thickness T of the array in preferred embodiments is in the approximate range of 0.5-5.0 mm. Portions of the electrodes 16, 18 are illustrated as extending outside the spacers 22, which can seal to the electrodes. The extension can provide for electrical connection to the electrodes. Application of an appropriate time-varying voltage between electrodes 16 and 18 will ignite plasmas in all of the microcavities 12, and also in the gap regions 15a, 15b. A voltage differential in the gaps 15b during positive half-cycles is the result of negative charge build on surfaces opposing the layers 13a, 13b (in this instance, a phosphor layer 26). The wavelength of the plasma emissions can be tailored using different gas(es) and/or vapor(s) in the array. A port 24 can be used to evacuate and fill the array 10, and can be sealed once the array is filled with the desired gas/vapor mixture.
If the gas(es) introduced to array 10 of
In several preferred embodiments of the invention, the packaging layers 20 are glass sheets typically 50 μm-2 mm in thickness. Such sheets can be bonded to the spacers 22 by a sealant such as glass frit. Since the total pressure of the gas(es) in array 10 is on the order of one atmosphere, the pressure differential across the packaging layers 20 is small, and so the array 10 can also be sealed with packaging layers 20 that are thin sheets of plastic. In this embodiment, the spacers 22 may not be necessary and the plastic packaging layers can be sealed directly to one another by any of several methods well known in the art.
The array 10 of
In the illustrated embodiments, each of the layers 13a, 13b, 13c, 13d, 13e can be formed from anodized screens where the holes in the screens constitute the microcavities. However, the spacer screen layers 13c, 13d, 13e that don't serve as electrodes are not necessarily anodized. The inclusion of a number of metal oxide layers as spacer layers has only a negligible effect on the overall thickness of the microcavity plasma device arrays, but the spacer layers are beneficial to efficiency for reasons that are not yet completely understood. The thickness T of the multiple layers 13a, 13b, 13c, 13d, 13e in
In the embodiment of
The embodiment of
In the embodiment of
During manufacture of the devices of the invention, it is important to maintain the flatness and alignment of the thin layers 13a-13e as the device assembly is finalized. In the case of the extruded embodiment of
While various embodiments of the present invention have been shown and described, it should be understood that other modifications, substitutions and alternatives are apparent to one of ordinary skill in the art. Such modifications, substitutions and alternatives can be made without departing from the spirit and scope of the invention, which should be determined from the appended claims.
Various features of the invention are set forth in the following claims.
This invention was made with Government assistance under U.S. Air Force Office of Scientific Research grant Nos. F49620-03-1-0391 and AF FA9550-07-1-0003. The Government has certain rights in this invention.
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