The present invention relates to a wavelength-variable laser formed by a semiconductor laser of which wavelength is variable and a method for manufacturing the same.
Wavelength-variable lasers are useful light sources used in a wide range of fields such as wavelength division multiplexing transmission, optical measurement, optical frequency sweeping optical coherence tomography (OCT), laser light spectroscopy, and light sensitivity measurement. Among the above, a wavelength-variable semiconductor laser using a semiconductor as a gain medium has low power consumption, is small in size, and is easy to handle, and hence is widely used in various fields.
Wavelength-variable semiconductor lasers are mainly divided into three types due to differences in structure. The three types means a distributed feedback (DFB) laser, a distributed bragg reflector (DBR) laser, and an external cavity laser.
The DFB laser includes a grating (diffraction grating) on an active layer and realizes wavelength change by adjusting the injection current amount or the temperature of a device.
In the DBR laser, a grating is not disposed on an active region, and a DBR grating is disposed on both sides or one side of the active region. In general, the DBR laser includes a phase adjustment region for performing phase matching. The DBR laser achieves variation of the wavelength with use of a carrier plasma effect that occurs by injecting current into a DBR region that is independent of the active region.
The external cavity laser enables the wavelength to be variable by disposing a mirror on the outer side of an active region and mechanically moving the mirror. In the case of the semiconductor laser, a mirror obtained by micro-electromechanical systems (MEMS) is normally used in order to reduce the footprint (device size).
Next, features of those lasers when those lasers are applied to gas sensing are described. The laser that is most used for gas sensing is the DFB laser. The DFB laser has a structure that can realize a narrow linewidth, and hence is used in a form in which the wavelength is aligned with the absorption line of gas. As described above, in the DFB laser, the wavelength can be variable in a range of about 1 nm by changing the injection current and the temperature of the device itself. However, it takes 1 ms or more for the DFB laser to perform sweeping when wavelength sweeping is performed.
The DBR laser can cause a wavelength of about 5 nm to be variable by simultaneously changing the DBR current and the phase adjustment current. The DBR laser causes the wavelength to be variable by using a refractive index change induced by the injection current as a principle, and hence can enable the wavelength to be variable at a high speed, that is, in microseconds or less.
The external cavity laser is characterized by a wideband wavelength-variable width acquired by using a MEMS mirror, and can enable the wavelength to be variable to the extent of 100 nm in principle. However, when a semiconductor is used as the gain medium, the wavelength is variable by about 60 nm in actuality because the gain band is limited. In the external cavity laser, the MEMS mirror is mechanically moved, and hence the wavelength sweeping requires about milliseconds.
In consideration of the above, the DBR laser that can enable the wavelength to be variable with a higher speed is conceived to be suitable for gas sensing. In the abovementioned type of sensing, it is preferred that the range by which the wavelength is variable be wider. For example, in the DBR laser, a state in which the wavelength is continuously variable by 5 nm or more is realized (see NPL 1). In the technology above, the same power source is resistively divided, and currents are synchronized and injected into the DBR region and the phase adjustment region of the DBR laser, to thereby enable the wavelength to be variable by 5.6 nm. In NPL 2, control is performed by separate power sources in which the DBR current and the phase adjustment current of the DBR laser are synchronized with each other. The control method of NPL 1 and the control method of NPL 2 are essentially the same.
Non Patent Literature
The structure of a wavelength-variable laser according to a DBR laser is described with reference to
The regions share a semiconductor substrate 301. In the rear DBR region 321 and the phase adjustment region 322, a core 302 formed by a bulk semiconductor is formed on the semiconductor substrate 301. In the rear DBR region 321, a grating 303 is formed on the core 302.
In the laser active region 323, an active layer 304 having a multi-quantum well structure is formed on the semiconductor substrate 301.
In the front DBR region 324, a core 305 formed by a bulk semiconductor is formed on the semiconductor substrate 301, and a grating 306 is formed on the core 305.
In the amplification region 325, an active layer 307 having a multi-quantum well structure is formed on the semiconductor substrate 301.
An overclad 308 is formed in the regions in a sharing manner.
A common electrode 310 is formed on the rear side of the semiconductor substrate 301. A first electrode 311 is formed on the overclad 308 in the rear DBR region 321. A second electrode 312 is formed on the overclad 308 in the phase adjustment region 322. A third electrode 313 is formed on the overclad 308 in the laser active region 323. A fourth electrode 314 is formed on the overclad 308 in the front DBR region 324. A fifth electrode 315 is formed on the overclad 308 in the amplification region 325.
Next, the roles of the regions when laser oscillation and wavelength control are performed are described. Light generated in the laser active region 323 by injecting a current 333 into the third electrode 313 causes laser oscillation by a resonator formed by the rear DBR region 321, the phase adjustment region 322, and the front DBR region 324. The laser is amplified by the amplification region 325 in which a current 334 is injected into the fifth electrode 315, and exits from the right side of the paper of
Next, a wavelength map is described.
In the wavelength map, a mode hop does not occur in regions in which the state continuously changes, but a mode hop is generated when a borderline at which the wavelength discontinuously changes is crossed. The following can be understood from the wavelength map. Firstly, it is also possible to enable the wavelength to be variable to a certain degree by injecting a current only into the DBR region. Secondly, it is also possible to enable the wavelength to be variable to a certain degree by injecting a current only into the phase adjustment region, but the oscillation wavelength can only be continuously changed within a range of about 1 nm at most because a mode hop immediately occurs.
However, when current is applied by interposing division resistors between the DBR region and the phase adjustment region as described in NPL 1 or when current is applied in a form in which separate power sources are in synchronization with each other as described in NPL 2, a wavelength of 5 nm or more can be continuously changed along a locus indicated by an arrow view line in
Next, a side-mode suppression ratio (SMSR) map is described. The side-mode suppression ratio is a parameter indicating the monochromaticity (the unity of the longitudinal mode) of the spectrum of the laser that oscillates and is a strength ratio between the highest peak (main mode) of which spectral intensity is the largest and the second highest peak (side mode).
When a locus (the arrow view line in
The abovementioned phenomenon is described from the viewpoint of electric signals with reference to
A locus for a case where the current widths are the same is drawn in
Embodiments of the present invention have been made in order to solve the problem as above, and an object thereof is to suppress the degradation of the SMSR in a wavelength-variable laser.
A wavelength-variable laser according to embodiments of the present invention includes: a rear DBR region; a phase adjustment region disposed following the rear DBR region; a laser active region disposed following the phase adjustment region; a front DBR region disposed following the laser active region; an amplification region disposed following the front DBR region; a first current injection unit that injects a DBR current into the rear DBR region and the front DBR region; and a second current injection unit that injects a phase adjustment current that changes at a frequency that is twice as much as a frequency of the DBR current into the phase adjustment region in synchronization with the DBR current.
A control method of a wavelength-variable laser according to embodiments of the present invention is a control method of a wavelength-variable laser including: a rear DBR region; a phase adjustment region disposed following the rear DBR region; a laser active region disposed following the phase adjustment region; a front DBR region disposed following the laser active region; and an amplification region disposed following the front DBR region, the control method including injecting a phase adjustment current that changes at a frequency that is twice as much as a frequency of a DBR current injected into the rear DBR region and the front DBR region into the phase adjustment region in synchronization with the DBR current.
As described above, according to embodiments of the present invention, the phase adjustment current that changes at a frequency that is twice as much as the frequency of the DBR current injected into the rear DBR region and the front DBR region is injected into the phase adjustment region in synchronization with the DBR current, and hence the degradation of the SMSR in the wavelength-variable laser is suppressed.
A wavelength-variable laser according to an embodiment of the present invention is described below with reference to
The regions are formed so as to share a semiconductor substrate. In the rear DBR region 101 and the phase adjustment region 102, a core formed by a bulk semiconductor is formed on the semiconductor substrate. In the rear DBR region 101, a grating is formed on the core. In the laser active region 103, an active layer having a multi-quantum well structure is formed on the semiconductor substrate. In the front DBR region 104, a core formed by a bulk semiconductor is formed on the semiconductor substrate, and a grating is formed on the core. In the amplification region 105, an active layer having a multi-quantum well structure is formed on the semiconductor substrate. An overclad is formed in the regions in a sharing manner. Those configurations are similar to those of the wavelength-variable laser according to the DBR laser described with reference to
The wavelength-variable laser includes a first current injection unit 111 that injects a DBR current into the rear DBR region 101 and the front DBR region 104, and a second current injection unit 112 that injects a phase adjustment current to the phase adjustment region 102. The first current injection unit 111 applies a DBR current obtained by modulating the bias current by a modulation signal to the DBR regions. The second current injection unit 112 injects a phase adjustment current obtained by modulating the bias current by a modulation signal. The first current injection unit 111 inverts the modulation signal in regions in which the modulation signal is a negative value. The wavelength-variable laser includes a third current injection unit 113 that injects a current into the laser active region 103 and a fourth current injection unit 114 that injects a current into the amplification region 105.
Light generated in the laser active region 103 by injecting a predetermined current into the laser active region 103 by the third current injection unit 113 causes laser oscillation by a resonator formed by the rear DBR region 101, the phase adjustment region 102, and the front DBR region 104. The light is amplified by the amplification region 105 into which a predetermined current is injected by the fourth current injection unit 114, and exits from the right side of the paper of
In the wavelength-variable laser according to the embodiment, the second current injection unit 112 injects a phase adjustment current that changes at a frequency that is twice as much as that of the DBR current into the phase adjustment region 102 in synchronization with the DBR current. The first current injection unit 111 inverts the modulation signal for modulating the DBR current to a positive value in regions in which the modulation signal is a negative value.
The abovementioned control is described with reference to
Next, the conventional control and the control of embodiments of the present invention are described in comparison with each other. First, the conventional control is described with reference to
Next, embodiments of the present invention are described with reference to
The locus described by the DBR current and the phase adjustment current set as described above forms a curved line as shown in
As described above, according to embodiments of the present invention, the phase adjustment current that changes at a frequency that is twice as much as that of the DBR current injected into the rear DBR region and the front DBR region is injected into the phase adjustment region in synchronization with the DBR current, and hence the degradation of the SMSR in the wavelength-variable laser is suppressed.
The present invention is not limited to the embodiment described above, and it is obvious that various modifications and combinations can be carried out by a person skilled in the art within the technical idea of the present invention.
This application is a national phase entry of PCT Application No. PCT/JP2019/026493, filed on Jul. 3, 2019, which application is hereby incorporated herein by reference.
Filing Document | Filing Date | Country | Kind |
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PCT/JP2019/026493 | 7/3/2019 | WO |