1. Field of the Invention
The present disclosure relates to a varistor device; in particular, to a varistor device having a specific-melting-point metallic pin.
2. Description of Related Art
Varistors are used as control or compensation elements in circuits either to provide optimal operating conditions or to protect against excessive transient voltages. When used as protection devices, they shunt the current created by the excessive voltage away from sensitive components when triggered. The most common type of varistor is the metal-oxide varistor (MOV). Application of sustained over-voltage to a varistor can cause high dissipation, potentially resulting in the varistor catching fire. A series connected thermal fuse is one solution to varistor failure. However, dissipated heat may degrade the varistor and reduce its life expectancy, and a user may have no indication when the surge suppressor has failed. Furthermore, if the melting point of the thermal fuse is greater than a temperature that would cause the varistor to burst into flames, the varistor may burst into flames before the melting thermal fuse breaks in two to cut off the conducted current; or, the flaming of the varistor and the breaking of thermal fuse may occur at the same time.
As a specific example, the metal oxide varistor disclosed in patent U.S. Pat. No. 7,453,681 utilizes a fuse to cut off the over-voltages. However, in the heat protection structure of the metal oxide varistor that will automatically go to open circuit in conditions of overheating, the fuse has to be electrically connected between the body and one of the terminals through solder joints. Therefore, the heat may not be able to be conducted to the fuse quickly due to the multiple solder joints, and the heat-shrinkable element wrapped securely around the fuse may not be able to be timely subjected to heat. On the other hand, an insulation bracket is needed to increase the thermal conduction, whereby the heat may be able to be conducted to the fuse more quickly. However, the size and the arrangement of the insulation bracket disposed on the varistor are limited by the size of the varistor, and the insulation bracket may increase the size of the device.
The present disclosure provides a varistor device, which includes a main body, a conductive area, a specific-melting-point metallic pin, and an elastic unit. The main body has a first surface, and the conductive area is located at the first surface. The specific-melting-point metallic pin has a first section and a second section. The first section and the second section are one-piece formed. The first section is fixedly disposed on the conductive area. The second section has a specific melting point such that the second section melts when a current flows between the first surface and the second section as to expose the second section to a temperature greater than the specific melting point. The elastic unit has an end connected to the second section, and the elastic unit provides an elastic force to the second section to break the second section so as to cut off the current when the second section melts.
The present disclosure also provides a varistor device, which includes a first main body, a second main body, a spacing piece, and a metallic pin. The first main body and the second main body are stacked with each other. The spacing piece is interposed between the first main body and the second main body. The metallic pin is interposed between the first main body and the second main body and bypasses the spacing piece. The metallic pin has an end extending outwardly from a side of the first main body, and the metallic pin has another end bypassing the spacing piece and fixedly disposed on the second main body.
In order to further the understanding regarding the present disclosure, the following embodiments are provided along with illustrations to facilitate the disclosure of the present disclosure.
The aforementioned illustrations and following detailed descriptions are exemplary for the purpose of further explaining the scope of the present disclosure. Other objectives and advantages related to the present disclosure will be illustrated in the subsequent descriptions and appended drawings.
(First Embodiment of Varistor Device)
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The embodiment provides a varistor device 1, which includes a main body 110 having a first surface S1, a conductive area 120, a specific-melting-point metallic pin 130, and an elastic unit 160. The conductive area 120 is located at the first surface S1 of the main body 110. The specific-melting-point metallic pin 130 includes a first section 131 fixedly disposed on the conductive area 120 and a second section 132 having a specific melting point. The first section 131 and the second section 132 are one-piece formed. When a current I flows between the first surface S1 and the second section 132 so as to expose the second section 132 to a temperature greater than the specific melting point, the second section 132 melts. The elastic unit 160 has an end connected to the second diction 132 and provides an elastic force to the second section 132 to break the second section 132 when the second section 132 melts, as to cut off the current I.
To put it concretely, the main body 110 further has a second surface S2 opposite to the first surface S1. The first surface S1 and the second surface S2 each serve as an electrode face, which is used for being connected to a corresponding external conductive pin. In the present embodiment, the main body 110 is disc-shaped. As a specific example, the main body 110 can be elongated, annular, or have an irregular shape. The main body 110 has a preferred clamping voltage, thus to suppress line voltage surges. For example, the main body 110 can be made of a metal-oxide ceramic material with an electrical resistivity that varies with the applied voltage, such as strontium titanate (SrTiO3), silicon carbide (SiC), zinc oxide (ZnO), iron oxide (Fe2O3), tin oxide (SnO2), titanium dioxide (TiO2) and barium titanate (BaTiO3) and the like.
The conductive area 120 is located at the first surface S1 of the main body 110. The conductive area 120 may have a covering layer 121 covering the first surface S1 and in direct touch with the first surface S1. For example, as shown in
The specific-melting-point metallic pin 130 includes the first section 131 and the second section 132. The first section 131 and the second section 132 are one-piece formed. The first section 131 is fixedly disposed on the conductive area 120, and the second section 132 extends outwardly from the conductive area 120. The specific-melting-point metallic pin 130 can be positioned between the first surface S1 and the covering layer 121. Alternatively, the covering layer 121 can be formed between the specific-melting-point metallic pin 130 and the first surface S1. As shown in
The specific-melting-point metallic pin 130 is formed of a specific-melting-point metallic material, and the second section 132 has the specific melting point. The specific melting point of the second section 132 ranges from a melting point of a soldering material to a melting point of the main body 110. In other words, the specific melting point of the second section 132 can be greater than the melting point of a soldering material, and less than the melting point of the main body 110. As a specific example, the specific-melting-point metallic pin 130 is formed of a material including a primary metal selected from the group consisting of aluminum, lead, zinc, tin, and any combination thereof. In the instant disclosure, the specific melting point of the second section 132, for example, ranges from 150 to 700 Celsius degrees. The first section 131 can be fixedly disposed on the electrode area 120 by carrying out an inserting and soldering process on the main body 110, such that the first section 131 and the covering layer 121 are configured to be in electrical connection, whereby the specific-melting-point metallic pin 130 may serve as a conductive pin of the main body 110 for external connection. It is worth mentioning that, the first section 131 and the second section 132 are one-piece formed of the specific-melting-point metallic material, and the second section is not confined within the electrode area 120, as shown in
The varistor device 1 further includes a conductive pin 140 having a first section 141 and a second section 142. The first section 141 of the conductive pin 140 is fixedly disposed on the second surface S2 of the main body 110, and the second section 142 of the conductive pin 140 extends outwardly from the main body 110. As shown in
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Specifically, the second section 132 of the specific-melting-point metallic pins 130 is in electrical connection to the printed circuit board through a first contacting spot, which can be a filler metal, such as a golden ball, a silver ball, a lead ball, or the like, soldered on the second section 132 or the printed circuit board. The second section 142 of the conductive pin 140 is in electrical connection to the printed circuit board through a second contacting spot, which can be a filler metal, such as a golden ball, a silver ball, a lead ball, or the like, soldered on the second section 142 or the printed circuit board. The protecting circuit 3 and the electrical connection of the protecting circuit 3 and the protected circuit 4 are exemplary, and the varistor device 1 can also be applied in a socket device or an electronic device.
Moreover, the second section 132 extending outwardly from the main body 110 can serve as a first supporting pin of the main body 110, and the second section 142 extending outwardly from the main body 110 can serve as a second supporting pin of the main body 110. Furthermore, the second section 132 and second section 142 each have a determined mechanical strength, such that the specific-melting-point metallic pin 130 and the conductive pin 140 each can withstand the weight of the main body 110 for holding the main body 110 at a determined position. For example, after the varistor device 1 is disposed on the circuit board, the specific-melting-point metallic pin 130 and the conductive pin 140 each can be used to hold the main body 110 at a determined position above the circuit board. It is worth noting that, the specific-melting-point metallic pin 130 alone can withstand the weight of the main body 110 for supporting the main body 110.
In another embodiment, the specific-melting-point metallic pin 130 or the conductive pin 140 does not serve as a supporting pin. For example, the specific-melting-point metallic pin 130 or the conductive pin 140 does not have the determined mechanical strength for supporting the main body 110. The shape, the size, the material, the strength, or the position of the specific-melting-point metallic pin 130 can be designed according to need, and the present disclosure is not limited thereto in the instant embodiment.
The elastic unit 160 is formed of an elastic material. As a specific example, the elastic unit 160 can be a linear spring, rubber, or the like. The elastic unit 160 has an end connected to the second section 132 of the specific-melting-point metallic pin 130. The elastic unit 160 provides an elastic force to the second section 132. For example, the elastic unit 160 is extended and deformed so as to provide the elastic force to the second section 132. As a specific example shown in the Figures, the direction of the elastic force provided to the second section 132 is substantially perpendicular to the extension direction of the second section 132, and the present disclosure is not limited thereto. In another embodiment, the direction of the elastic force provided to the second section 132 and the extension direction of the second section 132 can be parallel with each other.
When a current I flows between the first surface S1 and the second section 132 as to expose the second section 132 to a temperature greater than the specific melting point, at least a portion of the second section 132 melts. In applications, the varistor device 1 can be used to conduct a current I, which flows through the conductive pin 140, the main body 110, and the specific-melting-point metallic pin 130 for suppressing voltage surges. However, an oxide material is easily formed on the surface of the specific-melting-point metallic pin 130 that is exposed to air. Without providing any external force, the melting second section 132 of the specific-melting-point metallic pin 13 may not break in two due to the oxide material formed on the surface of the second section 132.
When the second section 132 is exposed to a temperature greater than the specific melting point, the elastic unit 160 can break the melting second section 132, which has the oxide material formed on the surface thereof, by the elastic force provided to the second section 132 so as to cut off the current I, resulting in the opening of the varistor 1. The second section 132 broken by the elastic unit remains discontinuous, thus preventing the varistor device 1 from heating up or catching fire.
On the other hand, the temperature of the main body 110 rises when the varistor device 1 is subjected to voltage surges, and the temperature of the specific-melting-point metallic pin 130 rises by thermal conduction due to a temperature gradient. When the temperature of the specific-melting-point metallic pin 130 is greater than the specific melting point, the elastic 160 unit breaks the melting second section 132 in two so as to cut off the current I. Since the specific melting point of the second section 132 is less than a temperature of the varistor device 1 that causes flames, the varistor device 1 can be cut off and become electrically discontinuous before bursting into flames, which prevents the electronic devices arranged in proximity to the varistor device 1 from being damaged by the flame.
The relative positions of the abovementioned components can be altered according to needs. The following describes other embodiments of varistor devices according to the present disclosure. It must be noted that components which can be similar to those of the above embodiment are not further described.
(Second Embodiment of Varistor Device)
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The elastic unit 160 has an end connected to the second section 132 and another end fixedly disposed on the second section 142 of the conductive pin 140, whereby the space needed for disposing the elastic unit 160 can be saved for minimizing the varistor device 1. Moreover, the elastic unit 160 is fixedly disposed on the second section 142 through an insulating unit 170, such that the elastic unit 160 is electrically insulated from the conductive pin 140.
(Third Embodiment of Varistor Device)
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The second section 132 has a bent portion 132a. The shape of the bent portion 132a resembles the shape of a “c” letter or an inversed “c” letter. The varistor device 1 of the present embodiment does not have any elastic unit 160 (
(Fourth Embodiment of Varistor Device)
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To put it concretely, the shape of the specific-melting-point pin 130, for example, resembles the shape of a “∩”. The two second sections 132, 132′ are positioned side by side. The extension direction of the first section 131 and the extension direction of the second section 132 form an angle G1, which ranges from 45 to 90 degrees. The extension direction of the first section 131 and the extension direction of the second section 132′ form an angle G2, which ranges from 45 to 90 degrees. The extension directions of the first section 131 and the second section 132, 132′ are substantially in parallel with the first surface S1. As a specific example, the specific-melting-point pin 130 can be formed of a cylindrical metal strip having a low melting point through bending over one or more times.
(Fifth Embodiment of Varistor Device)
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Specifically, the housing 150 includes an upper cover 151 and a bottom cover 152, and the bottom cover 152 is formed with a plurality of through-holes 1521. The through-holes 1521 correspond to the second sections 132, 132′ of the specific-melting-point metallic pin 130 and the second section 142 of the conductive pin 140 respectively. The second sections 132, 132′ and the second section 142 each pass through the corresponding through-hole 1521 and extend outwardly from the bottom cover 152, such that parts of the second sections 132, 132′ and the second section 142 are exposed outside the housing 150. In another embodiment, the second sections 132, 132′ and the second section 142 each can be completely exposed outside the housing 150.
The varistor device Z may include two elastic units 160 respectively connected to the second sections 132, 132′. The arrangements, the relative positions, and the operations of each of the elastic units 160, the insulating units 170, and the abovementioned components are similar to those of the above embodiment. In
(Sixth Embodiment of Varistor Device)
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(Seventh Embodiment of Varistor Device)
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(Eighth Embodiment of Varistor Device)
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The metallic pin 530 bypasses the spacing piece 590. The metallic pin 530 is interposed between the two main bodies 511, 512 and in touch with both the two main bodies 511, 512. The metallic pin 530 has an end extending outwardly from a side of the main body 511, and the metallic pin 530 has another end bypassing the spacing piece 590 and fixedly disposed on the main body 512, whereby the two main bodies 511, 512 are electrically connected to each other in series or in parallel through the metallic pin 530. For example, the metallic pin 530 has a bent section 533, and the metallic pin 533 can bypass the spacing piece 590 through the bent section 533 to be connected between the two main bodies 511, 512. As a specific example, the shape of the bent section 533 resembles the shape of “∩”, and the metallic pin 530 can hold the spacing piece 590. In another embodiment, the metallic pin 533 can bypass the spacing piece 590 through the bent section 533, such that, in the direction of thickness of the main body 511, 512, the spacing piece 590 is in touch with both the two main bodies 511, 512, and the metallic pin 530 is also in touch with both the two main bodies 511, 512. The metallic pin 530 can be formed of the abovementioned specific-melting-point metallic material, and the bent section can have a specific melting point, which ranges from a melting point of a soldering material to a melting point of the main body 511, 512. Moreover, the varistor device 1 further includes a heat-shrink unit 580, which sleeves the bent section 533. As a specific example, the heat-shrink unit 580 can sleeve the entire bent section 533. When a current I flows in the metallic pin 530 so as to expose the bent section 533 to a temperature greater than the specific melting point of the bent section 533, the bent section 533 melts. When subjected to heat, the heat-shrink unit 580 is shrunk to wrap tightly around the bent section 533 and provide a tension force on the other portions of the metallic pin 530 that are not sleeved by the heat-shrink unit 580, so as to break the melting bent section 533, whereby the current I is cut off thus to prevent the varistor device 1 from heating up or catching fire.
The varistor device 1 further includes at least one conductive pin 540. As shown in
(Ninth Embodiment of Varistor Device)
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To sum up, in accordance with the embodiments, the abovementioned varistor device 1 utilizes the specific-melting-point metallic pin 130 and the elastic unit 160 to cut off the current I when subjected to excessive heat, thus to prevent the varistor device 1 from heating up or catching fire. Especially, when the second section 132, 132′ of the specific-melting-point metallic pin 130 is exposed to a temperature greater than the specific melting point thereof, the second section 132, 132′ can melt and the elastic unit 160 can break the melting second section 132, 132′ in two so as to cut off the current I. Therefore, the varistor device 1 can become electrically discontinuous and not burst into flames.
The descriptions illustrated supra set forth simply the preferred embodiments of the present disclosure; however, the characteristics of the present disclosure are by no means restricted thereto. All changes, alterations, or modifications conveniently considered by those skilled in the art are deemed to be encompassed within the scope of the present disclosure delineated by the following claims.
Number | Date | Country | Kind |
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103138386 | Nov 2014 | TW | national |