This application claims priority to PCT application number PCT/CN2014/083974, filed Aug. 8, 2014, and incorporated by reference herein in its entirety.
Field
Embodiments relate to the field of circuit protection devices, and more particularly to a metal oxide varistor for surge protection.
Discussion of Related Art
Over-voltage protection devices are used to protect electronic circuits and components from damage due to over-voltage fault conditions. These over-voltage protection devices may include metal oxide varistors (MOVs) that are connected between the circuits to be protected and a ground line. MOVs have a current-voltage characteristic that allows them to be used to protect such circuits against catastrophic voltage surges. Because varistor devices are so widely deployed to protect many different types of apparatus, there is a continuing need to improve properties of varistors.
An MOV device (the terms “MOV” and “varistor” are used interchangeably herein unless otherwise noted) is generally composed of a ceramic disc, often based upon ZnO, an electrical contact layer that acts as an electrode, such as a Ag (silver) electrode, and a first metal lead and second metal lead connected at a first surface and second surface, respectively, where the second surface opposes the first surface. The MOV device is also provided with an insulation coating that surrounds the ceramic disc and other materials in many cases. An example of an MOV found in the present market includes a ceramic disc that is coated with epoxy insulation, which has a high dielectric strength.
Notably, this type of MOV is typically restricted for operation at relatively low temperature, such as less than 85° C., and more particularly exhibits reliability problems when operated at bias humidity conditions such as 85° C., 85% relative humidity (RH) and high DC operating voltage. It is believed that the reliability problems experienced under such a bias humidity condition arise from the migration of silver electrode material used to contact surfaces of the ceramic body of the MOV, as well as from the interaction between the epoxy coating and ZnO ceramic. An example of the reliability problems is the increased leakage through the interface when an epoxy-coated MOV is operated at high temperature (at least 85° C.), high humidity conditions while applying DC operating voltage. Moreover, even under lower humidity conditions an epoxy-coated MOV may fail during operation at elevated temperatures, such as 125° C. It is with respect to these and other issues that the present improvements may be desirable.
Exemplary embodiments are directed to improved varistors. In one embodiment a varistor may include a ceramic body. The varistor may further include a multilayer coating disposed around the ceramic body. The multilayer coating may include a first layer comprising a phenolic material or a silicone material and a second layer adjacent the first layer, the second layer comprising a high dielectric strength coating.
In another embodiment, a method of forming a varistor may include providing a ceramic body and applying a first layer on the ceramic body, applying a multilayer coating around the ceramic body. The multilayer coating may include a first layer comprising a phenolic material or a silicone material, and a second layer adjacent the first layer, where the second layer comprises a high dielectric strength coating.
The present embodiments will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments are shown. The embodiments are not to be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey their scope to those skilled in the art. In the drawings, like numbers refer to like elements throughout.
In the following description and/or claims, the terms “on,” “overlying,” “disposed on” and “over” may be used in the following description and claims. “On,” “overlying,” “disposed on” and “over” may be used to indicate that two or more elements are in direct physical contact with one another. Also, the term “on,”, “overlying,” “disposed on,” and “over”, may mean that two or more elements are not in direct contact with one another. For example, “over” may mean that one element is above another element while not contacting one another and may have another element or elements in between the two elements. Furthermore, the term “and/or” may mean “and”, it may mean “or”, it may mean “exclusive-or”, it may mean “one”, it may mean “some, but not all”, it may mean “neither”, and/or it may mean “both”, although the scope of claimed subject matter is not limited in this respect.
The present embodiments are generally related to metal oxide varistors (MOV) based upon zinc oxide materials. As is known, a varistor of this type comprises a ceramic body whose microstructure includes zinc oxide grains and may include various other components such as other metal oxides that are disposed within the ceramic microstructure. By the way of background, many commercially produced MOVs are primarily comprised of zinc oxide granules that are sintered together to form a disc where the zinc oxide granules, in solid form, constitute a highly conductive material, while the intergranular boundary is formed of other oxides is highly resistive. Just at those points where zinc oxide granules meet does sintering produce a ‘microvaristor’ which is comparable to symmetrical Zener diodes. The electrical behavior of a metal oxide varistor results from the number of microvaristors connected in series or in parallel. The sintered body of an MOV also explains its high electrical load capacity which permits high absorption of energy and thus, high surge current handling capability.
The aforementioned materials that are employed to contact or encapsulate a ceramic body of the varistor are potential sources of device degradation, especially when operated at high temperature, high humidity, and/or high voltage conditions. In various embodiments, an improved varistor is provided that is resistant to degradation under conditions such as high temperature, high humidity or high voltage. In various embodiments, an MOV is provided that has a coating that includes a multilayer structure, and in particular, a two layer structure. The two layer structure includes a first layer that is formed from a silicone material or a phenolic material, and a second layer that constitutes a high dielectric strength material. The terms “high dielectric strength” or “high dielectric strength material” as used herein refer to a material or quality in which the dielectric strength is at least 20 kV/mm. This multilayer coating may improve resistance to leakage and other electrical degradation as compared to conventional MOVs in which the ceramic is in direct contact with an epoxy coating.
In various embodiments in which the first layer is formed from a silicone material, the silicone material may include an alkyl silicone resin as well as silicon dioxide. The alkyl silicone resin may be a known silicone resin based upon a branched polysiloxane cage-like structure having alkyl groups attached to the polysiloxane structure. In other embodiments, in which the first layer is a phenolic material, the phenolic material may include a phenolic resin that is formed from the reaction of on phenol or substituted phenol with an aldehyde such as formaldehyde. The phenolic material may optionally include up to approximately 10% additive by weight.
In various embodiments the second layer includes an alkyd resin or other high dielectric strength material, such as polyimide or, acrylic resin, whose dielectric strength may exceed 20 kV/mm. In specific embodiments, an alkyd resin may have a dielectric strength of 50 kV/mm. An example of an alkyd resin includes polyester materials derived from the reaction of a polyol with a dicarboxylic acid. Another example of an alkyd resin includes polyester materials derived from the reaction of a polyol with a carboxylic acid anhydride. More generally, an alkyd resin may include other types of polyester resins that are formed using a fatty acid. The embodiments are not limited in this context.
In various embodiments, the thickness of the first layer 108 may range from approximately 300 μm to 1200 μm. Notably, silicone and phenolic materials have relatively low dielectric strength, such as between 5 kV/mm and 10 kV/mm, in comparison to conventional epoxy coatings that are used to coat a varistor ceramic body. Accordingly, the second layer 110 may include an alkyd resin or other high dielectric strength material that imparts an overall dielectric strength to the multilayer coating 106 that is appropriate for use as a varistor. In some embodiments, the second layer 110 has a thickness of 20 μm to 150 μm, which is adequate to impart a high dielectric strength to the multilayer coating 106 in conjunction with the first layer 108. For example, in some embodiments, the multilayer coating 106 has a dielectric strength that exceeds 2500 V ac.
In various embodiments, the first layer and second layer may be applied as liquid or viscous layers to the surface of a ceramic body 102 after the electrical contact layer 104 is applied. Incorporating a second layer 110 that has a high dielectric strength into a multilayer coating 106 provides advantages over the use of a single layer such as a silicone or phenolic layer for encapsulating the ceramic body 102. In particular, the overall coating thickness may be reduced in a multilayer coating having a high dielectric strength layer. For example, in the absence of the use of a high dielectric strength layer such as the second layer 110, a thickness of 3 mm or more may be needed for a silicone or phenolic layer to impart a target dielectric strength for various applications, such as 2500 V ac. This is in part due to the fact that the silicone layer may have a relatively low dielectric strength, such as 10 kV/mm or less, and the fact that coating thickness around an MOV ceramic may vary drastically, especially in corner regions of an MOV. Accordingly, in order to ensure that a single layer coating would meet a specification such as 2500 Vac, it may be needed to apply an average coating thickness many times that of the theoretical thickness needed to withstand 2500 V if the coating were uniform. For example, it has been observed that in a MOV having a rectangular ceramic body, a silicone layer thickness may vary between 100 μm in corner regions to 1 mm in other regions.
Advantageously, an MOV having a multilayer coating according to the present embodiments may have a dielectric strength of 2500 Vac when coating thickness of the multilayer coating is 1.0 mm (1000 μm) or less. The thinner coating thickness afforded by the multilayer coating 106 provides a less bulky varistor and provides easier handling and higher yield in a mass production environment. For example, a 50 μm thick alkyd layer having a dielectric strength of 50 kV/mm imparts a dielectric strength of 2500 V by itself. Accordingly, the thickness of a silicone or phenolic layer in a multilayer coating that includes a 50 μm thick alkyd layer need just be adequate to protect the ceramic body and electrical contact layer against reaction, since the needed dielectric strength is provided by the alkyd layer alone. Moreover, it has been observed that the thickness of an alkyd layer applied to an inner silicone layer is more uniform that the thickness of the inner silicone layer. For example, in the above example where silicone layer thickness varied by approximately a factor of ten, an alkyd layer applied to the silicone layer exhibited a variation in thickness between 50 μm in corner regions and 110 μm in other regions, or just a factor of approximately 2, with most measurements yielding a thickness between 50-70 μm. Thus, a nominal 70 μm thick alkyd layer having a dielectric strength of 50 kV/mm may be adequate to ensure that all regions of the alkyd layer have adequate thickness (>50 μm) to meet 2500 V ac independent of the thickness of the inner silicone layer.
Because a silicone material or phenolic material may resist reaction with a ceramic body of a varistor, it may be advantageous to provide a multilayer coating as shown in
It is to be noted that an alkyd resin in particular may not be reliable for use as the second layer 110 in the embodiment of
As further shown in
In operation, a varistor such as varistor 100 or varistor 200 may provide superior electrical performance with respect to a conventional varistor in which a ceramic body is encapsulated by an epoxy layer. A particular advantage provided by the MOV devices according to the present embodiments is the improved performance under various high temperature and high voltage conditions.
The results of
In
The leakage current (shown in microAmperes) is measured at a bias voltage of 80% Vnom, with forward leakage and reverse leakage recorded. The initial leakage values under reverse bias conditions exhibit an average value of approximately 15 and decrease slightly as a function of time up to 500 hrs. The initial leakage values under forward bias exhibit an average value of approximately 17, which decreases slightly at 168 hrs. At 336 hrs, the average leakage under forward bias conditions increases moderately to approximately 43, while at 500 hrs this value increases to about 62. The increases in average leakage at 336 hrs and 500 hrs is due to increases in samples 11-20 that were subjected to the 970 V continuous dc bias at 85° C. in an ambient of 85% relative humidity. Samples 1-10, which were subjected to 125° C. with continuous 970 V DC, showed a slight decrease in leakage under forward bias conditions at 168 hrs, 336 hrs, and 500 hrs.
The electrical properties change substantially as a function of time, as shown in
In view of the above results, it is clear that the varistor samples (1-10) arranged with a multilayer coating according to the present embodiments are stable against degradation as measured by Vnom or leakage for at least 500 hours at 125° C. with 970 V DC applied. Moreover, under 85° C., 85% RH, with applied voltage of 970 V DC, the varistor samples 11-20 are stable against shifts in Vnom and reverse bias leakage up to 500 hrs, and are stable against increase in forward bias leakage up to a period between 168 hr and 336 hr. Disadvantageously, as noted, conventional varistor samples having an epoxy coating exhibit large degradation even at 168 hr, in Vnom under forward bias (30%), and in leakage (>1000%).
In addition to the above advantages shown in the electrical property measurements, the two-layer coating of the present embodiments exhibits superior stability under thermal cycling tests as opposed to a conventional varistor coated by a single epoxy layer. In one set of thermal cycling experiments samples were subject to cycling in which one cycle is composed of four steps: 1) 15 min @ −40° C.; 2) 5 min @ room temperature; 3) 15 min @ 125° C.; and 4) 5 min @ room temperature. Varistor samples were subject to 5 cycles, 15 cycles, 50 cycles, 100 cycles, and 200 cycles. Varistor samples having a multilayer coating in which the inner layer includes a silicone material as disclosed herein, and an outer layer having an alkyl resin exhibited no failures even after 200 cycles. Disadvantageously, conventional varistor samples exhibit fails after just 5 cycles.
In various embodiments a multilayer coating may be applied to a varistor ceramic body (including electrical contact layers) using known solution-based techniques. For example, a varistor ceramic body may be dipped in a solution including a resin of a layer to be applied to the varistor. In one instance, a silicone or phenolic layer may be applied to the varistor ceramic body as a viscous liquid coating that is made from a solvent mixture that contains either an alkyl silicone resin or phenolic resin, respectively. The coating may subsequently be baked to form a solid layer. Subsequently, an alkyd layer may be applied to the outer surface of the silicone or phenolic layer as a viscous liquid containing a solution of an alkyd resin, and may be subsequently baked to solidify the alkyd layer. The embodiments are not limited in this context.
While the present embodiments have been disclosed with reference to certain embodiments, numerous modifications, alterations and changes to the described embodiments are possible without departing from the sphere and scope of the present disclosure, as defined in the appended claims. Accordingly, it is intended that the present embodiments not be limited to the described embodiments, and that it has the full scope defined by the language of the following claims, and equivalents thereof.
Number | Date | Country | Kind |
---|---|---|---|
PCT/CN2014/083974 | Aug 2014 | WO | international |
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/CN2015/073739 | 3/6/2015 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2016/019723 | 2/11/2016 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
4039904 | Klein et al. | Aug 1977 | A |
4559167 | Jelke et al. | Dec 1985 | A |
5008646 | Hennings | Apr 1991 | A |
6201290 | Yamada et al. | Mar 2001 | B1 |
8562859 | Kato | Oct 2013 | B2 |
20030150741 | Wu | Aug 2003 | A1 |
20050088273 | Kitsui et al. | Apr 2005 | A1 |
20070025044 | Golubovic et al. | Feb 2007 | A1 |
20090006569 | Morss et al. | Jan 2009 | A1 |
20100157492 | Tan | Jun 2010 | A1 |
20100170626 | Lochtman et al. | Jul 2010 | A1 |
20110274831 | Saegusa et al. | Nov 2011 | A1 |
20120223798 | Wei | Sep 2012 | A1 |
20130162100 | Kang | Jun 2013 | A1 |
20140111300 | Park | Apr 2014 | A1 |
20140124251 | Park et al. | May 2014 | A1 |
Number | Date | Country |
---|---|---|
1434464 | Aug 2003 | CN |
1481560 | Mar 2004 | CN |
1905086 | Jan 2007 | CN |
101556850 | Oct 2009 | CN |
101620901 | Jan 2010 | CN |
102024541 | Apr 2011 | CN |
102024541 | Apr 2011 | CN |
102318016 | Jan 2012 | CN |
102347296 | Feb 2012 | CN |
102664082 | Sep 2012 | CN |
102665082 | Sep 2012 | CN |
10 2012 109704 | Apr 2014 | DE |
H05109506 | Apr 1993 | JP |
2001284103 | Oct 2001 | JP |
2004095609 | Mar 2004 | JP |
05109506 | Apr 2005 | JP |
2005150516 | Jun 2005 | JP |
2005243746 | Sep 2005 | JP |
2009088168 | Apr 2009 | JP |
2009246114 | Oct 2009 | JP |
5157349 | Mar 2013 | JP |
5297163 | Sep 2013 | JP |
5364285 | Dec 2013 | JP |
2013170648 | Nov 2013 | WO |
2014120880 | Aug 2014 | WO |
Entry |
---|
International Search Report for the International Application No. PCT/CN2014/083974, dated Mar. 30, 2015, 4 pages. |
International Search Report for the International Application No. PCT/CN2015/073739, dated Jun. 23, 2015, 4 pages. |
European Search Report and Search Opinion, dated May 28, 2018, for the European Application No. 15830254 (6 pages). |
European Search Report and Search Opinion, dated May 4, 2018, for European Application No. 14899196 (6 pages). |
Number | Date | Country | |
---|---|---|---|
20170221613 A1 | Aug 2017 | US |