Exemplary embodiments of the present disclosure pertain to vehicle interior trim parts and more particularly, a vehicle interior trim part formed with integrated electronics.
Injection molded structural electronics are unique standalone parts. However and when multiple electronic components are desired to be used in a single application, multiple separate pieces have to be fit together on a carrier frame. This leads to increased package requirements and the management of multiple fit requirements. Alternatively, one single injection molded structural electronic with numerous components is cost prohibitive and difficult to change.
Accordingly, it is desirable to provide a vehicle interior trim part formed with integrated electronics.
Disclosed is an, the assembly including: a substrate; an injection molded structural electronic component; and a layer of polymer that partially encapsulates the substrate and the injection molded structural electronic component and unifies the substrate and the injection molded structural electronic component into one component.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the assembly includes another injection molded structural electronic component.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the assembly includes alternative electronics.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the injection molded structural electronic component has a cut out portion that is configured to receive the alternative electronics.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the assembly is a portion of a vehicle interior.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the assembly includes a plurality of icons.
Also disclosed is a method for providing an assembly, the method including the steps of: forming an injection molded substrate; forming at least one injection molded structural electronic component; placing the injection molded substrate and the at least one injection molded structural electronic component in a tool; and partially overmolding the injection molded substrate and the at least one injection molded structural electronic component with a polymer injected into the tool; and unifying the injection molded substrate and the at least one injection molded structural electronic component into one component with the polymer.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, another injection molded structural electronic component is placed in the tool prior to the partially overmolding step.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, alternative electronics are inserted into the tool.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, at least one injection molded structural electronic component has a cut out portion that is configured to receive alternative electronics.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the assembly is a portion of a vehicle interior.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the assembly includes a plurality of icons.
The following descriptions should not be considered limiting in any way. With reference to the accompanying drawings, like elements are numbered alike:
A detailed description of one or more embodiments of the disclosed apparatus and method are presented herein by way of exemplification and not limitation with reference to the Figures.
In accordance with the present disclosure, an insert molding process is used to incorporate multiple injection molded structural electronic (IMSE) parts or other electronic parts into one component. Injection molded structural electronics use multiple printed film layers and injected polymer between layers to provide the injection molded structural electronic (IMSE) part.
In accordance with the present disclosure, several electronic components such as an injection molded structural electronic (IMSE) part are located in an injection mold. In one embodiment, at least one injection molded structural electronic (IMSE) part is placed in the injection mold. In yet another embodiment, at least one injection molded structural electronic (IMSE) part is placed in the injection mold in addition to another electronic part.
Once the part or parts are inserted into the injection mold a polymer is injected into the tool that partially encapsulates the parts in the tool and unifies those parts into one component.
In another exemplary embodiment of the invention a substrate is created in a first injection molding shot, and components are added to this substrate. Once the parts are joined, a third material is molded over the sub-assembly creating a unified structure.
Referring now to
Once these part or parts are inserted into the injection mold a polymer is injected into the tool that partially encapsulates the parts in the tool and unifies those parts into one component.
As mentioned above, the injection molded structural electronic components 16, 18 comprises multiple printed film layers and injected polymer between layers, which will include a non-contact sensor or switch such as a capacitive switch that corresponds to a respective icon 12. In one embodiment, the injection molded structural electronic component 16, 18 may also comprise a means for illuminating the icons 12. In one embodiment, the means for illuminating or illuminating device may be a light emitting diode.
Referring now to
The term “about” is intended to include the degree of error associated with measurement of the particular quantity based upon the equipment available at the time of filing the application. For example, “about” can include a range of ±8% or 5%, or 2% of a given value.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, element components, and/or groups thereof.
While the present disclosure has been described with reference to an exemplary embodiment or embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present disclosure. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the essential scope thereof. Therefore, it is intended that the present disclosure not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this present disclosure, but that the present disclosure will include all embodiments falling within the scope of the claims.
This application claims the benefit of Application No. 62/953,317 filed on Dec. 24, 2019, the contents of which are incorporated herein by reference thereto.
Number | Date | Country | |
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62953317 | Dec 2019 | US |